• Sunday | 09 August 2026
TSMC Expands CoWoS Outsourcing Strategy to Ease AI Chip Packaging Bottlenecks

Taiwan Semiconductor Manufacturing Co. (TSMC) is broadening its outsourcing strategy for advanced chip packaging as it works to address persistent capacity constraints driven by the rapid expansion of the artificial intelligence (AI) market. The world's leading contract chipmaker is reportedly increasing the amount of Chip-on-Wafer (CoW) processing within its Chip-on-Wafer-on-Substrate (CoWoS) pa...

7 Aug 2026 | Friday | NEWS
Valens Semiconductor Interview: AI-Powered Conference Room Connectivity and the Future of Enterprise Collaboration

Semicon Leaders Asia Interviews: Eli Ofek, VP of Products for Valens Semiconductor, on AI-Powered Conference Room Connectivity and Enterprise Collaboration   1. AI-powered features such as automatic camera switching, speaker tracking, and intelligent framing are becoming standard in modern conference rooms. What are the biggest connectivity and infrastructure challenges organisations f...

7 Aug 2026 | Friday | Interaction
Longsys Showcases Edge AI Storage Innovations with AMD Collaboration at FMS 2026

Longsys (301308.SZ) is presenting its "Edge AI Storage Fusion" showcase at the Future of Memory and Storage (FMS) 2026, spanning three core scenarios: AI Agent Hosts (AI BOX), AI PCs, and AI Mobile embedded devices. AI Agent Hosts: Co-Optimized with AMD To address memory bottlenecks, KV cache expansion, and latency challenges in local LLM deployment, Longsys has partnered with AMD to integrate A...

7 Aug 2026 | Friday | NEWS
Toshiba Launches TXZ+ M4V Microcontrollers with Advanced Security for IoT and Industrial Systems

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has announced the TXZ+™ Family Entry-Class M4V Group, standard microcontrollers[1] featuring an Arm® Cortex®-M4 core with a floating-point unit (FPU) that enhances security and data management in IoT devices and industrial equipment. Engineering samples are available. The widespread adoption ...

7 Aug 2026 | Friday | NEWS
Silicon Motion Unveils MonTitan SSD Reference Design Kit to Power Agentic AI Storage Infrastructure

Silicon Motion Technology Corporation (NasdaqGS: SIMO), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, unveiled its new MonTitan™ SSD Reference Design Kit (RDK), featuring the company’s next-generation patented PerformaShape™ technology. Designed for Agentic AI infrastructure, the platform enables enterprise SSDs to serve as a p...

7 Aug 2026 | Friday | NEWS
Everspin and MaxLinear Partner to Evaluate MRAM-Based Memory Architectures for AI Servers

Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of MRAM solutions, and MaxLinear, Inc., a provider of high-performance connectivity and storage acceleration solutions, today announced the signing of a memorandum of understanding (MOU) to evaluate next-generation memory architectures designed to improve efficiency and performance in AI servers. AI m...

6 Aug 2026 | Thursday | NEWS
Samsung Unveils Next-Generation AI Memory Innovations, Including Industry-First V10 BV-NAND and zHBM at FMS 2026

Samsung Electronics Co., Ltd., a global leader in advanced memory technology, showcased its latest AI memory innovations at Future of Memory and Storage (FMS) 2026 in Santa Clara, California. With broad expertise spanning DRAM, NAND, enterprise storage and relevant advanced semiconductor technologies, Samsung presented its latest AI memory portfolio and technology roadmap, including a preview of ...

6 Aug 2026 | Thursday | NEWS
Marvell Expands AI Memory Infrastructure Portfolio to Boost Token Efficiency and Scalable AI Inference

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, announced innovations across its AI memory infrastructure portfolio, advancing its position spanning server-level AI storage, rack-scale CXL memory expansion and pooling, and pod-level optical shared memory. The portfolio helps hyperscalers and cloud providers scale memory more independently from...

6 Aug 2026 | Thursday | NEWS
NEO Semiconductor Launches NEO.AI Memory Platform to Break AI Memory Bottlenecks

NEO Semiconductor, a leading innovator in advanced AI and memory technologies, announced the launch of NEO.AI, its next-generation AI memory platform designed to solve the two most significant memory bottlenecks limiting future artificial intelligence systems: on-chip memory (AI cache) and HBM capacity. As part of the platform launch, the company is officially unveiling X-SRAM, its breakthrou...

6 Aug 2026 | Thursday | NEWS
AI-Powered Analog Simulation to Transform Semiconductor Verification and Accelerate Chip Design

Semicon Leaders Asia Interviews Paul Neil, Chief Operating Officer, Mach42 on AI-Powered Analog Simulation, Faster Verification and the Future of Semiconductor Design   Q. Mach42’s latest funding will support the commercialisation of AI-driven analog circuit simulation technology. How will this investment accelerate your go-to-market strategy, and which semiconductor market segments r...

6 Aug 2026 | Thursday | Interaction
POLYN Introduces Deterministic Responsive Computing to Bridge the Gap Between AI and Real-Time Physical Systems

As artificial intelligence moves beyond cloud computing into autonomous vehicles, industrial automation and intelligent robotics, one challenge continues to limit its deployment in safety-critical environments: delivering AI inference with guaranteed timing, predictable behaviour and ultra-low power consumption. POLYN Technology believes it has identified a solution. The company has released a n...

6 Aug 2026 | Thursday | NEWS
Alif Semiconductor Licenses Arm Keil MDK to Accelerate Edge AI Development on Ensemble and Balletto MCUs

Alif Semiconductor announced that Alif has licensed Arm® Keil® MDK to provide Alif's customers with professional software development tools for the Alif Ensemble® and Balletto® families of Arm-based microcontrollers and fusion processors. The agreement gives Alif's customers access to the Keil MDK toolchain for embedded software develop...

5 Aug 2026 | Wednesday | NEWS
Ceva and Actions Technology Launch Bluetooth HDT Audio SoCs Ahead of Bluetooth 7.0

Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, and Actions Technology Co., Ltd. (688049.SH), a leading provider of smart wireless audio and Edge AI SoCs of AIoT, announced the introduction of the Actions Technology ATS296X-series Bluetooth® audio series of chips, powered by the Ceva-Waves™ Bluetooth High Data Throughput (HDT) plat...

5 Aug 2026 | Wednesday | NEWS
Ambiq Launches Open-Source heliaPROFILER to Accelerate Edge AI Optimisation on Apollo SoCs

Ambiq Micro, Inc. (“Ambiq®”), a technology leader in ultra-low power semiconductor solutions for edge AI, announced the launch of heliaPROFILER™, a new open-source profiling tool that expands its HELIA™ AI ecosystem. Designed for AI developers building on Ambiq Apollo SoCs, heliaPROFILER provides cycle-accurate insight into AI model execution on production har...

5 Aug 2026 | Wednesday | NEWS
Brewer Science Completes Heraeus Epurio Semiconductor Chemicals Acquisition to Strengthen Advanced Chip Materials Portfolio

Brewer Science, Inc., a global leader in advanced materials and processes for the fabrication of cutting-edge microdevices, announced it has completed its acquisition of the semiconductor chemicals business line of Heraeus Epurio, a recognised technology leader in ultrapure electronic chemicals for the semiconductor industry. The closing is a deliberate act of vertical integration: by bringing the...

5 Aug 2026 | Wednesday | NEWS
Sandisk and SK hynix Unveil Open HBF Standard to Advance AI Inference Memory Architecture

Sandisk Corporation (Nasdaq: SNDK) and SK hynix Inc. announced the release of the HBF™ (High Bandwidth Flash) technical specification through the Open Compute Project (OCP), advancing the workstream to drive HBF standardisation for the AI inference era, just six months after the consortium began work in February. The specification was developed through the HBF technology workstream under OC...

5 Aug 2026 | Wednesday | NEWS
IonQ and EPB Launch First U.S. Quantum Communications R&D Centre Connected to a Live Network

IonQ, Inc. (NYSE: IONQ), the world’s leading quantum platform company, and EPB, Chattanooga’s energy and communications solutions company, announced plans for the Tennessee Quantum Communications Research Centre. This will be the first dedicated next-generation quantum communication research and development (R&D) innovation lab directly connected to a real-world network. “In...

5 Aug 2026 | Wednesday | NEWS
Marvell to Showcase AI Memory, CXL and PCIe 6.0 Storage Solutions at FMS 2026

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, announced it will showcase its comprehensive portfolio of AI memory and storage solutions at FMS 2026 at the Santa Clara Convention Centre and Hyatt Regency in Santa Clara, California. As agentic AI inference scales, memory capacity, bandwidth and connectivity are becoming as critical as compute. Lar...

4 Aug 2026 | Tuesday | NEWS
KIOXIA Launches GP1 PCIe 6.0 NVMe SSD with 10 Million IOPS to Accelerate AI GPU Memory Expansion

KIOXIA America, Inc. announced the KIOXIA GP1 Series PCIe® 6.0 NVMe™ SSD, the first product in its KIOXIA GP Series of Super High IOPS SSDs optimised for GPU direct access. Building on the KIOXIA GP Series technology introduced earlier this year1, the KIOXIA GP1 Series delivers up to 10 million random read IOPS2 using KIOXIA XL-FLASH™ generation 2 flash mem...

4 Aug 2026 | Tuesday | NEWS
Kioxia Unveils XL1 CXL Memory Expansion Module Powered by XL-FLASH for AI Data Centres at FMS 2026

Kioxia Corporation, a world leader in memory solutions, announced that it will exhibit the KIOXIA XL1 series, a Compute Express Link™ (CXL™) compatible memory expansion module, at the Kioxia booth at FMS: the Future of Memory and Storage, taking place August 4 - 6 in Santa Clara, CA. The product features KIOXIA XL-FLASH™, a low-latency and high-performance flash memory techn...

4 Aug 2026 | Tuesday | NEWS

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