• Thursday | 09 October 2025
Omni Design Technologies Tapes Out 64 GSPS SWIFT™ ADC in TSMC 3nm to Power Next-Gen Data Connectivity

Omni Design Technologies, a leading provider of high-performance, low-power Wideband Signal Processing™ solutions,  announced the tape out of its new ODT-ADS-7B64G-3T, an ultra-high-speed 64 GSPS SWIFT™ analog-to-digital converter (ADC) supporting 7- and 8-bit output modes, designed in TSMC’s 3nm process. This time-interleaved ADC provides the breakthrough speed and perfor...

8 Oct 2025 | Wednesday | NEWS
JEDEC Unveils UFS 5.0 Standard for AI, Mobile, and Edge Devices

Flash Optimized for AI, Mobile, and Edge Devices with Enhanced Speed, Security, and Signal Integrity JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry,  announced it is nearing completion of the next version of its highly anticipated Universal Flash Storage (UFS) standard: UFS 5.0. Designed for mobile app...

7 Oct 2025 | Tuesday | NEWS
OpenAI Partners with South Korea’s Tech Giants to Power the Next Generation of AI Infrastructure

OpenAI announced a series of strategic partnerships with South Korean technology leaders Samsung and SK Group to accelerate the development of Stargate, a landmark $500 billion initiative aimed at building next-generation infrastructure for artificial intelligence. The announcements followed a meeting in Seoul between OpenAI CEO Sam Altman, South Korean President Lee Jae Myung, and senior execu...

6 Oct 2025 | Monday | NEWS
Alchip’s 3DIC Validation Paves Way for 2nm–3nm Stacked Architectures

Alchip Technologies, the dedicated high-performance and AI computing ASIC leader, validated its 3DIC ecosystem readiness with results from its 3DIC test chip tape out. The results vaulted Alchip into a clear 3DIC technology leadership because it validated an entire, integrated 3DIC solution, as well as its various elements.  The test chip provided CPU/NPU core demonstration, UCIe and PCIe ...

6 Oct 2025 | Monday | NEWS
GoSaaS Rebrands to GoSaaS.ai, Signalling AI-First Approach to Oracle Cloud

GoSaaS, Inc., an Oracle Cloud Applications implementation partner, announced it is moving from GoSaaS.io to GoSaaS.ai and introducing an updated logo. The changes reflect a simple idea: the reason to go to SaaS today is to use AI to drive outcomes, not just to move off older systems. “Seven years ago, our brand emphasized getting from on-prem to cloud. Our customers still need that, but t...

3 Oct 2025 | Friday | NEWS
QuickLogic Wins eFPGA Hard IP Contract for 12 nm Data Center ASIC

QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened, Antifuse and ruggedized FPGAs, announced  that its eFPGA Hard IP was selected for a new high-performance Data Center ASIC design that will be fabricated on an industry-proven 12 nm process technology. IP delivery for this contract is scheduled for Q4 2025. "We are excited...

3 Oct 2025 | Friday | NEWS
Phaidra Raises $50M+ Series B to Power Energy-Efficient AI Factories with Intelligent Agents

Phaidra, the company building AI agents for AI factories, announced a Series B funding round of more than $50 million led by Collaborative Fund, with participation from Helena, Index Ventures, NVIDIA, Sony Innovation Fund, and others. The funding will be used to make AI factories — the data center infrastructure purpose-built for AI workloads — radically more resource-efficient via A...

2 Oct 2025 | Thursday | NEWS
Global X Launches CHPX ETF to Capture AI and Quantum Semiconductor Innovation

Global X Management Company LLC ("Global X"), the New York-based provider of exchange traded funds (ETFs), announced the launch of the Global X AI Semiconductor & Quantum ETF (CHPX), designed to capture innovation in the semiconductor industry. The fund is passively managed and priced at 50 bps. The semiconductor industry is evolving to cater to demands of next-gen computing, including AI a...

2 Oct 2025 | Thursday | NEWS

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