OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analog and display solutions, announced today its latest-generation automotive image sensor: the OX08D20 8-megapixel (MP) CMOS image sensor with TheiaCel™ technology. This new device is an upgrade to the popular OX08D10 sensor for exterior cameras used in advanced driver assistance syste...
Geographic Regions Americas and EMEA Reported Double-Digit Increases Electronic System Design (ESD) industry revenue increased 8.6% to $5,089.4 million in the second quarter of 2025 from the $4,685.5 million registered in the second quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report. ...
SmartSoC Solutions Private Limited, an Indian semiconductor design and product engineering company, today announced a strategic partnership with Cortus S.A.S., a French semiconductor company renowned for its cutting-edge Intellectual Property (IP) solutions in secure identification technologies. This partnership aims to drive innovation and accelerate the development and manufacturing of SIM car...
All 27 European Union member states have joined a Dutch-led initiative to strengthen Europe’s semiconductor strategy, as momentum builds for a renewed “Chips Act 2.0” aimed at safeguarding critical technologies, accelerating approvals, and expanding semiconductor capacity across the bloc. The Semicon Coalition, founded in March by the Netherlands alongside eight other EU count...
GS Microelectronics US, Inc. (GSME), a leading-edge global supplier of integrated circuit design and manufacturing solutions, announced that it has acquired Muse Semiconductor. Muse Semiconductor is a recognized provider of multi-project wafer (MPW) services, enabling chip designs built on TSMC technology. This strategic acquisition will expand GSME's reach into key innovation hubs across No...
ShunYun Technology Ltd (SYT), a world-class manufacturer of optical transceivers, and NewPhotonics, a leading designer of highly integrated photonic integrated circuit (PIC) chips for data center optical interconnect, today announced a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line. Ethernet pluggable optics are forecasted to scale to >100 million by...
scia Systems GmbH, the industry leader in advanced ion beam and plasma process equipment for the microelectronics, MEMS, and precision optics industries, announced new capabilities supporting high-precision, high-throughput semiconductor device manufacturing and failure analysis (FA) on its industry-leading scia Mill series of ion beam etching (IBE) systems. Fi...
Senior engineers, company leaders, investors, researchers and students of microelectronics are to have a new opportunity to meet, discover and learn with the launch of the Microelectronics UK exhibition, to be held on 24-25 September 2025 at the Excel London. The event, the first in the UK to bring together the entire microelectronics value chain, will feature zones and content for semiconducto...
Tekscend Photomask (formerly Toppan Photomask), the world's largest merchant photomask supplier for the semiconductor industry, has installed a state-of-the-art photomask laser writing system, the SLX1, at its Corbeil, France facility. This marks the first European deployment of the SLX1 system, manufactured by Swedish technology leader, Mycronic AB. The new system represents a strat...
Ezurio, a global leader in connectivity, proudly announces the release and immediate availability of the BL54L15μ Series, a breakthrough Bluetooth® Low Energy (LE) module series designed to deliver big performance in an ultra-compact footprint. Built on Nordic Semiconductor's nRF54L15 SoC and featuring a chip antenna or trace pad, the BL54L15μ is the most compact nRF54L-based solution ...
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With...
Valens Semiconductor announced that Samsung is supporting the MIPI A-PHY standard for high-speed sensor connectivity and is partnering with Valens Semiconductor to develop the next generation of MIPI A-PHY products, in response to strong market demand from global OEMs. Valens and Samsung have a long history of collaboration. Samsung was among the earlier investors in Valens, and the two co...
ZYT (ZHUOYU Technology) made its European debut at the IAA Mobility 2025 in Munich, Germany, officially unveiling its European strategy to the global audience. ZYT Establishes German Branch in Braunschweig, Accelerating Localization Efforts in Europe Europe, as the birthplace and innovation hub of the automotive industry, represents a pivotal market in ZYT's global strategy. Taking Germa...
Grinn, a full-cycle technology company specializing in the design and development of advanced IoT and embedded solutions, has announced the launch of a strategic partnership with MediaTek which will help it to extend the implementation of advanced AI and IoT technologies based on its off-the-shelf embedded computing systems. The first fruit of the partnership is the creation of a family of ...
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced it will showcase its extensive, industry-leading interconnect portfolio for scale-up and scale-out data center AI deployments at the European Conference on Optical Communication (ECOC), September 28 to October 2 in Copenhagen, Denmark. The rapid evolution of generative AI technologies and larg...