• Thursday | 09 October 2025
Semtech Launches Next-Generation 5G AirLink® Routers with Network Slicing for Mission-Critical Public Safety Operations

New Generation of Purpose-Built Routers With 5G Network Slicing Support Enables Dedicated Connectivity Lanes for Mission-Critical First Responder Operations Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today announced the availability of the AirLink® XR80 and XR9...

8 Oct 2025 | Wednesday | NEWS
Momentum Technologies Begins Commercial-Scale Rare Earth Recovery in Texas Using Proprietary MSX Platform

  Momentum Technologies (“Momentum”), a company revolutionizing critical mineral and metal recovery for reuse, announced that its Carrollton, Texas demonstration plant has commenced the processing of rare earth element (“REE”) waste from magnet swarf and mining tailings at commercial scale using its proprietary Membrane Solvent Extraction (MSX) technology. MSX is bein...

8 Oct 2025 | Wednesday | NEWS
HAP International Advances Toward Agreement with U.S. Customs for TRACE ID Supply Chain Traceability Program

HAP International announced  that following a successful technical assessment of the quality and scope of shipment-level traceability data provided by the TRACE ID program, they are taking steps toward a formal Memorandum of Agreement with U.S. Customs and Border Protection (CBP). The initiative builds on CBP’s ongoing Global Business Identifier (GBI) test and reflects the agency&rsqu...

8 Oct 2025 | Wednesday | NEWS
Omni Design Technologies Tapes Out 64 GSPS SWIFT™ ADC in TSMC 3nm to Power Next-Gen Data Connectivity

Omni Design Technologies, a leading provider of high-performance, low-power Wideband Signal Processing™ solutions,  announced the tape out of its new ODT-ADS-7B64G-3T, an ultra-high-speed 64 GSPS SWIFT™ analog-to-digital converter (ADC) supporting 7- and 8-bit output modes, designed in TSMC’s 3nm process. This time-interleaved ADC provides the breakthrough speed and perfor...

8 Oct 2025 | Wednesday | NEWS
OMNIVISION Expands TheiaCel™ Portfolio with OX08D20 for Advanced Driver Assistance and AD Systems

OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analog and display solutions, announced today its latest-generation automotive image sensor: the OX08D20 8-megapixel (MP) CMOS image sensor with TheiaCel™ technology. This new device is an upgrade to the popular OX08D10 sensor for exterior cameras used in advanced driver assistance syste...

8 Oct 2025 | Wednesday | NEWS
Advanced Energy Launches 401M Mid-Infrared Pyrometer for Next-Generation Semiconductor Precision

Advanced Energy Industries, Inc. (Nasdaq: AEIS), a global leader in highly engineered, precision power conversion, measurement and control solutions, announces the launch of the 401M mid-infrared optical pyrometer, designed for high-precision, non-contact temperature measurement in semiconductor and industrial process environments. The 401M debuts at SEMICON® West 2025. Engineered for speed...

8 Oct 2025 | Wednesday | NEWS
Reed Semiconductor Sues Monolithic Power Systems for Patent Infringement

Reed Semiconductor Corp., a global leader in the design, development, and manufacture of advanced semiconductor solutions, announced that it has filed a patent infringement lawsuit (Case No. 6:25-cv-00449) in the United States District Court for the Western District of Texas against Monolithic Power Systems, Inc. (MPS). The lawsuit alleges infringement of U.S. Patent No. 7,960,955, which covers ...

7 Oct 2025 | Tuesday | NEWS
3M Joins JOINT3 Consortium to Advance Next-Generation Semiconductor Packaging

3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, equipment and design.  JOINT3 is a co-creation evaluation platform established by Japan-based Resonac Corporation with the aim of accelerating the development of tools optimized for panel-level organic interposers, the thin layers made from org...

2 Oct 2025 | Thursday | NEWS
GS Microelectronics Acquires Muse Semiconductor to Expand Global MPW Services and Innovation Reach

GS Microelectronics US, Inc. (GSME), a leading-edge global supplier of integrated circuit design and manufacturing solutions, announced that it has acquired Muse Semiconductor. Muse Semiconductor is a recognized provider of multi-project wafer (MPW) services, enabling chip designs built on TSMC technology. This strategic acquisition will expand GSME's reach into key innovation hubs across No...

2 Oct 2025 | Thursday | NEWS
QuantumScape and Corning Partner to Develop Ceramic Separator Manufacturing for Solid-State Batteries

-QuantumScape Corporation (NYSE: QS), a global leader in next-generation solid-state lithium-metal battery technology, and Corning Incorporated (NYSE:GLW), one of the world’s leading innovators in glass, ceramics, and materials science,  announced an agreement to jointly develop ceramic separator manufacturing capabilities for QS solid-state batteries. The companies will work together...

1 Oct 2025 | Wednesday | NEWS
Purdue and VMS Solutions Launch Collaboration to Advance Semiconductor Manufacturing Education

Purdue University and VMS Solutions have announced a new collaboration to advance education and research in semiconductor manufacturing and supply chain management. The partnership aims to prepare the next generation of engineering talent to address the chronic workforce gap in the semiconductor industry. Through this partnership, students and researchers at Purdue will gain hands-on exper...

1 Oct 2025 | Wednesday | NEWS
ShunYun Technology and NewPhotonics Forge Strategic OSAT Partnership to Accelerate High-Volume PIC Manufacturing

ShunYun Technology Ltd (SYT), a world-class manufacturer of optical transceivers, and NewPhotonics, a leading designer of highly integrated photonic integrated circuit (PIC) chips for data center optical interconnect, today announced a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line. Ethernet pluggable optics are forecasted to scale to >100 million by...

1 Oct 2025 | Wednesday | NEWS
scia Systems Expands Ion Beam Etching Capabilities to Advance Whole-Wafer Failure Analysis and Semiconductor Packaging

scia Systems GmbH, the industry leader in advanced ion beam and plasma process equipment for the microelectronics, MEMS, and precision optics industries, announced new capabilities supporting high-precision, high-throughput semiconductor device manufacturing and failure analysis (FA) on its industry-leading scia Mill series of ion beam etching (IBE) systems.     Fi...

1 Oct 2025 | Wednesday | NEWS
AP Memory Introduces ApSRAM™ for Edge AI and IoT, with Mass Production Set for Year-End

AP Memory, a leading global design company providing customized memory solutions, announced that its next-generation PSRAM—ApSRAMTM (Attached-pSRAM)—has successfully passed customer validation and is scheduled to begin mass production by the end of the year. ApSRAMTM is an advanced version of AP Memory's PSRAM (Pseudo Static Random Access Memory), featuring a new architecture optimiz...

27 Sep 2025 | Saturday | NEWS

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