Baya Systems Targets Japan’s AI and Chiplet Market with Advanced Data-Movement Technology

In this exclusive interview,  Semicon Leaders Asia speaks with Nandan Nayampally, Chief Commercial Officer at Baya Systems, about the company’s expansion into Japan and the growing opportunities across the country’s semiconductor ecosystem. Nayampally shares his insights into the rising demand for AI, HPC, automotive and chiplet-based architectures, the importance of efficien...

8 Sep 2026 | Tuesday | Interaction
Thermo Fisher Introduces EMPAD G2 for High-Speed 4D STEM Semiconductor Analysis

New detector enables faster 4D STEM imaging, helping researchers uncover material properties with greater speed and detail Key highlights: Innovation: EMPAD G2 helps researchers capture more information about materials in a single scan, recording both the strongest and weakest signals without sacrificing imaging speed or data quality. Performance: EMPAD G2 runs at 10,000 frames per sec...

28 Aug 2026 | Friday | NEWS
Lam Research and NY CREATES Launch Semiconductor Training Programme to Address US Talent Shortage

Robert E. Geer, Vice President for Education and Workforce Development at NY CREATES, speaks to Semicon Leaders Asia about the five-year partnership with Lam Research to strengthen semiconductor talent development. The programme aims to equip around 3,500 students with advanced process integration skills through virtual fabrication and digital-twin technology, helping prepare the workforce for the...

27 Aug 2026 | Thursday | Interaction
Mimik and AMD Advance Device-First Agentic AI for Physical Systems

In this exclusive interview with Semicon Leaders Asia, Fay Arjomandi, Founder, CEO and Board Member of mimik, shares how mimOE Embedded Edition and AMD’s Ryzen AI Embedded X100 Series are shaping a device-first approach to Agentic AI, enabling secure, scalable and efficient intelligence for physical AI, autonomous systems and industrial automation.   Q. mimOE Embedded Edition has been...

17 Aug 2026 | Monday | Interaction
Aeonsemi Brings 10Gbps Ethernet Over Existing Coax to Next-Generation AI and Broadband Networks

Semicon Leaders Asia speaks with Mike Hansen, Sr. Product Line Manager at Aeonsemi, on how LumaReach™ is reshaping Ethernet-over-coax deployments and enabling cost-effective, high-speed connectivity. Q. LumaReach™ introduces what you describe as the industry's first commercially available 10 Gbps Ethernet-over-coax network controller. What market opportunity did Aeonsemi identify, a...

13 Aug 2026 | Thursday | Interaction
Cirrus Logic Bets Big on Smart Energy with Next-Gen Metrology AFE Platform

SemiconLeaders Asia speaks with Eddie Sinnott, VP, Automotive and Industrial, Cirrus Logic, on the company's big bet on smart energy — from its Scottish Enterprise-funded metrology analogue front-end platform and University of Strathclyde partnership to Edinburgh's growing role as its largest engineering hub outside the United States. Q. Cirrus Logic has received R&D funding from Scotti...

12 Aug 2026 | Wednesday | Interaction
Ambiq Advances Edge AI Development with Open-Source heliaPROFILER for Apollo SoCs

Semicon Leaders Asia Speaks with Dr Adam Page, Head of AI at Ambiq, on AI Workload Optimisation, Open-Source Edge AI and the HELIA Ecosystem Q. heliaPROFILER is designed to simplify AI workload optimisation on resource-constrained devices. What specific challenges faced by edge AI developers does this new tool address, and how does it improve the development process? The conversation around...

11 Aug 2026 | Tuesday | Interaction
How AI is Reshaping Memory Semiconductor Investing: Tema ETFs on CXMT, DISK and Global Growth

In Conversation with Yuri Khodjamirian, CFA, Chief Investment Officer, Tema ETFs | Semicon Leaders Asia Explores AI, CXMT and the Future of Memory Semiconductor Investing   Q. Tema ETFs added CXMT as one of DISK's largest holdings immediately after its IPO. What gave your investment team the confidence to make such an early and significant allocation? We studied CXMT well before the IPO, i...

10 Aug 2026 | Monday | Interaction
Valens Semiconductor Interview: AI-Powered Conference Room Connectivity and the Future of Enterprise Collaboration

Semicon Leaders Asia Interviews: Eli Ofek, VP of Products for Valens Semiconductor, on AI-Powered Conference Room Connectivity and Enterprise Collaboration   1. AI-powered features such as automatic camera switching, speaker tracking, and intelligent framing are becoming standard in modern conference rooms. What are the biggest connectivity and infrastructure challenges organisations f...

7 Aug 2026 | Friday | Interaction
AI-Powered Analog Simulation to Transform Semiconductor Verification and Accelerate Chip Design

Semicon Leaders Asia Interviews Paul Neil, Chief Operating Officer, Mach42 on AI-Powered Analog Simulation, Faster Verification and the Future of Semiconductor Design   Q. Mach42’s latest funding will support the commercialisation of AI-driven analog circuit simulation technology. How will this investment accelerate your go-to-market strategy, and which semiconductor market segments r...

6 Aug 2026 | Thursday | Interaction
AI, Advanced Packaging and EVs to Drive the Next Decade of Thermal Interface Materials Growth

In this interview with Semicon Leaders Asia,  Nikhil Kaitwade, Associate Vice President at Future Market Insights, Inc., discusses how AI infrastructure, advanced semiconductor packaging and electrification are driving demand for thermal interface materials, while highlighting the role of Asia, material innovation and industry collaboration in shaping the market's future.   Which end...

3 Aug 2026 | Monday | Interaction
The Water Ledger: What Asia's Biggest Fabs Draw, and What They Give Back

In the spring of 2021, the Baoshan Second Reservoir in Hsinchu County stopped looking like a reservoir. Photographs from that April show a cracked brown basin with a thin channel of water at the bottom and a shoreline of dried mud. Taiwan had gone a full year without a typhoon making landfall, the first time since 1964, and storage in the reservoir fell to around seven percent of capacity. Baosha...

28 Jul 2026 | Tuesday | Analysis
POLYN Partners with ALTER TECHNOLOGY France to Accelerate Neuromorphic AI Chip Commercialisation

Alexander Simin, COO of POLYN Technology, speaks exclusively with Semicon Leaders Asia about the company's partnership with ALTER TECHNOLOGY France, the commercialisation of its neuromorphic AI technology, and its vision for advancing edge AI, automotive innovation and the future of Physical AI.   Q1. How does this partnership with ALTER TECHNOLOGY France strengthen POLYN’s commercial...

21 Jul 2026 | Tuesday | Interaction
How AlpSemi Is Advancing Solid-State Circuit Breakers for AI Data Centres, Smart Buildings, and Next-Generation Power Distribution

In this exclusive interview with Semicon Leaders Asia,  Frédéric Dupont, Chief Executive Officer of AlpSemi, discusses how the company's next-generation semiconductor power switches are enabling the widespread adoption of solid-state circuit breakers (SSCBs) for AI data centres, smart buildings, industrial electrification, and electric vehicles, paving the...

6 Jul 2026 | Monday | Interaction
How AI-Powered EDA, 2nm Design, and Samsung Foundry Collaboration Are Accelerating Next-Generation AI Chip Development

In this exclusive interview with Semicon Leaders Asia, Shekhar Kapoor, Executive Director of Product Line Management, Synopsys, shares how AI-driven design automation, advanced-node collaboration, and system-level optimisation are shaping the future of semiconductor innovation.   Q. As AI, multi-die architectures, and advanced process nodes increase desig...

3 Jul 2026 | Friday | Interaction
Tim Allemeersch of Qualinx on Advancing Secure GNSS Positioning for the Next Generation of IoT and Connected Devices

In this interview with Semicon Leaders Asia, Tim Allemeersch, Senior Director of Customer Success at Qualinx, explains how Qualinx is combining ultra-low-power GNSS technology with Galileo OSNMA to bring trusted positioning to mass-market connected devices. He highlights the importance of collaboration across the Galileo ecosystem, secure semiconductor manufacturing, and next-generation positionin...

2 Jul 2026 | Thursday | NEWS
Chuck Xu of Qnity on Enabling the Next Generation of AI Infrastructure Through Advanced Packaging Materials

In this interview with Semicon Leaders Asia, Chuck Xu, President, Interconnect Solutions at Qnity, shares how advanced packaging materials are becoming a critical enabler of AI-driven semiconductor innovation. He explains how Qnity is working closely with foundries, OSATs, substrate manufacturers, and equipment partners to accelerate the adoption of organic interposers, glass-cor...

29 Jun 2026 | Monday | Interaction
Jeennifer Chen of PI USA on Advancing Precision Motion Control for Semiconductor Manufacturing and High-Tech Automation

  In this interview with Semicon Leaders Asia, Jennifer Chen, Product Line Manager for Air Bearings and Precision Motion Systems at PI USA, shares insights into the future of precision positioning technologies and intelligent motion control. She explains how PI’s V-783 platform leverages advanced motion control, nanometre-resolution feedback systems, and high-performa...

25 Jun 2026 | Thursday | Interaction
Dell and NVIDIA Expand AI Factory Collaboration with PowerEdge XE8812 for Next-Generation HPC and AI Workloads

ISC--Dell Technologies (NYSE: DELL) introduces the Dell PowerEdge XE8812 server, a new addition to the Dell AI Factory with NVIDIA, purpose-built for the world's most demanding HPC and AI workloads, featuring NVIDIA Vera Rubin NVL4 architecture and delivering up to 144 GPUs per rack. The announcement comes as Dell AI Factory deployments accelerate worldwide, advancing sovereign AI initiatives...

24 Jun 2026 | Wednesday | NEWS
Xinliang (XL) Wang of pSemi on Advancing RF Connectivity for Next-Generation Wireless, Satellite, and Test Systems

In this interview with Semicon Leaders Asia, Xinliang (XL) Wang, Senior Director, Product Portfolio Management at pSemi, explains how pSemi is expanding its RF technology portfolio to support increasingly complex wireless and connectivity ecosystems. Through close collaboration with OEMs, system integrators, and test equipment manufacturers, the company is leveraging its UltraCMO...

19 Jun 2026 | Friday | Interaction