• Thursday | 09 October 2025
GS Microelectronics Acquires Muse Semiconductor to Expand Global MPW Services and Innovation Reach

GS Microelectronics US, Inc. (GSME), a leading-edge global supplier of integrated circuit design and manufacturing solutions, announced that it has acquired Muse Semiconductor. Muse Semiconductor is a recognized provider of multi-project wafer (MPW) services, enabling chip designs built on TSMC technology. This strategic acquisition will expand GSME's reach into key innovation hubs across No...

2 Oct 2025 | Thursday | NEWS
Arasan Chip Systems Launches Total IP Solution for eUSB v2 Targeting 1.2V SoCs in Mobile and Automotive Markets

Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, announced the immediate availability of its Total IP for eUSB with the eUSB v2 Controller and eUSB v2 PHY IP. Arasan's eUSB2 has been designed to target SoCs operating at 1.2V as the interface operating voltage. Arasan is one of the pioneers in the USB IP business having started with USB 1.0 as the compan...

28 Sep 2025 | Sunday | NEWS
FICG Accelerates AI Factory Connectivity with Advanced Optical Transceiver Packaging

As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing...

28 Sep 2025 | Sunday | NEWS
FICG Accelerates AI Factory Connectivity with Advanced Optical Transceiver Packaging

As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing...

28 Sep 2025 | Sunday | NEWS
ALi Corporation and Ceva Join Forces to Deliver AI-Enhanced Smart Edge Devices

As demand accelerates for intelligent, video-centric devices across consumer and industrial markets, ALi Corporation and Ceva, Inc. announced a strategic licensing partnership to integrate Ceva's advanced NeuPro-Nano and NeuPro-M Neural Processing Units (NPUs) into ALi's next-generation Video Display Sub-System (VDSS) platform. This collaboration combines ALi's expertise in multimedia SoCs ...

28 Sep 2025 | Sunday | NEWS
Alif Semiconductor Sets New AI MCU Benchmark with Ensemble E4, E6, and E8 Processors

Alif Semiconductor®, the leading global supplier of secure, connected, power efficient Artificial Intelligence and Machine Learning (AI/ML) microcontrollers (MCUs) and fusion processors, today released benchmarks on its latest E4, E6 and E8 microcontrollers and fusion processors, extending Alif's advantage in the AI MCU market. Alif has been a trendsetter in this field since 2021, when it i...

28 Sep 2025 | Sunday | NEWS
Clarkson University Launches Open-Source Tool to Tackle Chip Overheating in AI and HPC Systems

From smartphones and gaming consoles to artificial intelligence, the powerful chips that drive modern technology generate intense heat. When temperatures rise too high, performance suffers, energy is wasted, and hardware can fail. A research team at Clarkson University is developing a new tool to combat this challenge. Thermal Analysis of Semiconductor Chips, known as TASChips, is an open-sourc...

28 Sep 2025 | Sunday | NEWS
LG Innotek Unveils Next-Generation Digital Key Solution for Smarter, Safer Vehicle Access

LG Innotek recently held an event to unveil its newly developed 'Next-generation Digital Key Solution' for the first time to the media. The 'Next-generation Digital Key Solution' is a flagship product of LG Innotek's automotive connectivity business, a key pillar of its automotive components business, along with 5G communication modules and automotive AP modules. The digital key is touted as a...

28 Sep 2025 | Sunday | NEWS
Lam Research Debuts VECTOR® TEOS 3D to Power Advanced Chip Packaging for AI and HPC

Lam Research Corp.  unveiled VECTOR® TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence (AI) and high-performance computing (HPC) applications. TEOS 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. It provides ultra-thick, ...

27 Sep 2025 | Saturday | NEWS
FIC Global Emerges as Key Enabler of AI Infrastructure with 16 Years of Optical Transceiver Expertise

As artificial intelligence continues to reshape the global economy, the underlying infrastructure enabling its growth is drawing increasing attention. At the heart of this transformation is a little-known but critical component — optical transceivers — and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawi...

27 Sep 2025 | Saturday | NEWS
DB HiTek Nears Completion of 650V GaN HEMT Process, Launches MPW Program to Accelerate Power Semiconductor Innovation

DB HiTek, a leading 8-inch specialty foundry, announced it is in the final stages of development of its 650V E-Mode GaN HEMT (Gallium Nitride High-Electron Mobility Transistor) process, a next-generation power semiconductor platform. The company is also to offer a dedicated GaN MPW (multi-project wafer) program at the end of October. Compared with traditional silicon-ba...

27 Sep 2025 | Saturday | NEWS
AI Boom Drives 44% YoY Growth in Server and Storage Component Market in Q2 2025, Says Dell’Oro Group

According to a recently published report by Dell'Oro Group, the trusted source for market information about the telecommunications, security, networks, and data center industries, the on-going AI expansion cycle drove the server and storage component market to 44 percent year-over-year growth in 2Q 2025. The surging demand for accelerators, HBM, and NICs underpins record expansion across the AI ...

27 Sep 2025 | Saturday | NEWS
SK hynix Announces World’s First HBM4 Mass Production Readiness to Power Next-Gen AI

SK hynix Inc. (or "the company", www.skhynix.com) announced that it has completed development and finished preparation of HBM4*, a next generation memory product for ultra-high performance AI, mass production for the world's first time. SK hynix said that the company has successfully completed development and based on this technological achievement, the company has prepared HBM4 mass production t...

27 Sep 2025 | Saturday | NEWS
OPROCESSOR INC Unveils Breakthrough VCSEL-Based Photonic Interposer to Eliminate GPU–HBM Bottlenecks

OPROCESSOR INC, incorporated in Boston, Massachusetts in 2018 with research operations in Daejeon, South Korea, announced a breakthrough in VCSEL-based Photonic Interposer technology that overcomes the GPU–HBM interconnect bottleneck for next-generation AI and high-performance computing systems. The pioneering work was published in Photonics (MDPI, August 29, 2025) and will be presented a...

27 Sep 2025 | Saturday | NEWS
Marvell to Showcase Cutting-Edge Interconnect Solutions for AI Data Centers at ECOC 2025

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced it will showcase its extensive, industry-leading interconnect portfolio for scale-up and scale-out data center AI deployments at the European Conference on Optical Communication (ECOC), September 28 to October 2 in Copenhagen, Denmark. The rapid evolution of generative AI technologies and larg...

27 Sep 2025 | Saturday | NEWS

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