• Thursday | 09 October 2025
HAP International Advances Toward Agreement with U.S. Customs for TRACE ID Supply Chain Traceability Program

HAP International announced  that following a successful technical assessment of the quality and scope of shipment-level traceability data provided by the TRACE ID program, they are taking steps toward a formal Memorandum of Agreement with U.S. Customs and Border Protection (CBP). The initiative builds on CBP’s ongoing Global Business Identifier (GBI) test and reflects the agency&rsqu...

8 Oct 2025 | Wednesday | NEWS
Amkor Expands $7 Billion Advanced Packaging & Test Campus in Arizona

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration,  announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona. The expanded investment includes additional cleanroom space and a second green...

7 Oct 2025 | Tuesday | NEWS
India’s Semiconductor Revolution Finds Its Backbone in Materials Science

As India’s semiconductor aspirations gather pace, the spotlight is gradually shifting from fabrication plants to the unsung enablers of the chipmaking process — the materials that make every connection possible. From bonding wires and solder pastes to fluxes and adhesives, global materials manufacturers are homing in on India, viewing it as a future hub not just for chip assembly, b...

6 Oct 2025 | Monday | NEWS
PINC Technologies Raises $6.8M to Scale Nonlinear Photonics for Quantum and Industrial Applications

PINC Technologies, a Caltech spinout company developing advanced integrated nonlinear photonic devices and circuits, announced the close of its Seed+ round, bringing total funds raised to date to $6.8M. The funding will accelerate commercialization of the company’s technology, which builds on groundbreaking research from the Caltech Nonlinear Photonics Laboratory. The latest round was led ...

3 Oct 2025 | Friday | NEWS
QuickLogic Wins eFPGA Hard IP Contract for 12 nm Data Center ASIC

QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened, Antifuse and ruggedized FPGAs, announced  that its eFPGA Hard IP was selected for a new high-performance Data Center ASIC design that will be fabricated on an industry-proven 12 nm process technology. IP delivery for this contract is scheduled for Q4 2025. "We are excited...

3 Oct 2025 | Friday | NEWS
Mitsubishi Electric Develops Contactless Sensor for Continuous Monitoring of Vital Body Data

  Mitsubishi Electric Corporation  announced  that it has developed a new type of contactless body data sensor that can detect minute variations in heart rates, respiration, and other vital body indicators with high precision. It will enable the continuous and accurate daily measurement of such data in situations where the use of contact-type sensors, such as smartwatches, may be d...

1 Oct 2025 | Wednesday | NEWS
QuantumScape and Corning Partner to Develop Ceramic Separator Manufacturing for Solid-State Batteries

-QuantumScape Corporation (NYSE: QS), a global leader in next-generation solid-state lithium-metal battery technology, and Corning Incorporated (NYSE:GLW), one of the world’s leading innovators in glass, ceramics, and materials science,  announced an agreement to jointly develop ceramic separator manufacturing capabilities for QS solid-state batteries. The companies will work together...

1 Oct 2025 | Wednesday | NEWS
TSMC Certifies Synopsys Portfolio for Advanced Node AI, HPC, and High-Speed Chip Designs

Collaboration enables workflows for TSMC advanced node technologies, accelerating AI, high-speed data communications, and advanced computing Key Highlights An AI-assisted optimization workflow helps shorten design cycle times on TSMC's compact universal photonic engine (COUPE) platform and strengthens design quality using Ansys optiSLang®, Ansys Zemax OpticStudio®, and Ansys Lu...

1 Oct 2025 | Wednesday | NEWS
Purdue and VMS Solutions Launch Collaboration to Advance Semiconductor Manufacturing Education

Purdue University and VMS Solutions have announced a new collaboration to advance education and research in semiconductor manufacturing and supply chain management. The partnership aims to prepare the next generation of engineering talent to address the chronic workforce gap in the semiconductor industry. Through this partnership, students and researchers at Purdue will gain hands-on exper...

1 Oct 2025 | Wednesday | NEWS
Microelectronics UK Exhibition Launches at Excel London to Unite Industry Leaders and Innovators

Senior engineers, company leaders, investors, researchers and students of microelectronics are to have a new opportunity to meet, discover and learn with the launch of the Microelectronics UK exhibition, to be held on 24-25 September 2025 at the Excel London. The event, the first in the UK to bring together the entire microelectronics value chain, will feature zones and content for semiconducto...

28 Sep 2025 | Sunday | NEWS
Alif Semiconductor Sets New AI MCU Benchmark with Ensemble E4, E6, and E8 Processors

Alif Semiconductor®, the leading global supplier of secure, connected, power efficient Artificial Intelligence and Machine Learning (AI/ML) microcontrollers (MCUs) and fusion processors, today released benchmarks on its latest E4, E6 and E8 microcontrollers and fusion processors, extending Alif's advantage in the AI MCU market. Alif has been a trendsetter in this field since 2021, when it i...

28 Sep 2025 | Sunday | NEWS
Carbice Brings Space-Proven Cooling Tech to Gaming PCs with Launch of Ice Pad

Carbice, a leader in next-generation carbon nanotube-based thermal interface materials (TIMs) and high-performance cooling expertise, is bringing its space-proven cooling tech to the desktop. Starting today, PC builders can select the Carbice® Ice Pad as a premium upgrade option when customizing systems from CyberPowerPC. Engineered with vertically aligned carbon nanotubes, the Ice Pad repl...

28 Sep 2025 | Sunday | NEWS
AP Memory Introduces ApSRAM™ for Edge AI and IoT, with Mass Production Set for Year-End

AP Memory, a leading global design company providing customized memory solutions, announced that its next-generation PSRAM—ApSRAMTM (Attached-pSRAM)—has successfully passed customer validation and is scheduled to begin mass production by the end of the year. ApSRAMTM is an advanced version of AP Memory's PSRAM (Pseudo Static Random Access Memory), featuring a new architecture optimiz...

27 Sep 2025 | Saturday | NEWS

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