• Sunday | 08 February 2026
Wolfspeed Advances Toyota Electrification With Silicon Carbide Power Solutions

  Underscores Wolfspeed’s leadership in silicon carbide power solutions, advancing Toyota’s global electrification strategy with enhanced efficiency and performance for battery electric vehicles. --Wolfspeed Inc. (NYSE: WOLF), a global leader in innovative silicon carbide power solutions, announced that its automotive MOSFETs will power onboard charger systems for Toyo...

10 Dec 2025 | Wednesday | NEWS
Asahi Kasei Divests Daramic Lead Battery Separator Business to Kingswood Capital as Part of Strategic Portfolio Realignment

Asahi Kasei, a diversified global manufacturer in the Healthcare, Homes, and Material sectors, announces its strategic divestiture of Daramic, a lead battery separator business, to Kingswood Capital Management, LP. The Daramic business transfer closed on December 1, 2025. The effect on Asahi Kasei’s consolidated financial results for fiscal 2025 is immaterial. “As we enter a new era...

4 Dec 2025 | Thursday | NEWS
Marvell Technology to Acquire Celestial AI in $3.25 Billion Deal to Accelerate Optical Scale-Up Connectivity for Next-Generation AI Data Centers

Celestial AI’s breakthrough Photonic FabricTM technology platform enables optical I/O for package, system and rack-level connectivity for the next-generation of data center infrastructure Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions,  announced it has entered into a definitive agreement to acquire Celestial AI, a pioneer of a disruptive ...

4 Dec 2025 | Thursday | NEWS
Murata Launches 1.25kV C0G MLCC in Compact 1210 Size for SiC-Based Power Systems

Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces the launch and mass production of its multilayer ceramic capacitor (MLCC) featuring a capacitance of 15nF, a rated voltage of 1.25kV, and C0G characteristics in the compact 1210-inch (3.2mm x 2.5mm) size. This product delivers highly efficient power conversion and stable performance under high-voltage conditions, making ...

3 Dec 2025 | Wednesday | NEWS
Izmo Microsystems Expands Into Advanced Packaging and Silicon Photonics to Serve Next-Gen AI and Cloud Markets

Izmo Microsystems, an India-based technology company,  announced its strategic expansion into semiconductor advanced packaging and silicon-photonics solutions — areas increasingly critical for next-generation AI data centres, telecom networks, and ultra-high-speed interconnects. The announcement drove Izmo’s share price up by nearly 4% in Monday trading, reflecting investor con...

2 Dec 2025 | Tuesday | NEWS
MetaOptics to Raise S$4.85 Million Through Share Placement to Accelerate Global Metalens Expansion

 MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group"), a leading-edge semiconductor optics company, announced that it is proposing to raise S$4.85 million through a placement of 6,685,028 new ordinary shares in the capital of the Company ("Placement Shares") at S$0.7255 per Placement Share ("Share Placement"). The proceeds from the...

2 Dec 2025 | Tuesday | NEWS
Intel Stock Surges as Talk Grows of Potential Apple Partnership

Intel Corporation (NASDAQ: INTC) saw its shares rise more than 10%  as market speculation intensified around a potential manufacturing partnership with Apple Inc. Reports circulating among industry analysts and supply chain observers suggest that Apple may be evaluating Intel’s cutting-edge 18A process node to produce its next-generation M-series processors, including the rumored M6 a...

1 Dec 2025 | Monday | NEWS
TDK Corporation and Nippon Chemical Industrial Begin Discussions on Joint Venture for Advanced Electronic Component Materials

TDK Corporation and Nippon Chemical Industrial Co., Ltd. have announced the signing of an agreement to begin formal discussions toward establishing a joint venture dedicated to next generation electronic component materials. The proposed venture would focus on the co development and manufacturing of ceramic materials for multilayer capacitors as well as other high value materials essential to se...

28 Nov 2025 | Friday | NEWS
W. L. Gore & Associates Opens Shanghai Battery Lab to Accelerate Advanced Battery Materials Innovation

W. L. Gore & Associates announced the opening of its Battery Lab in Shanghai, China, expanding its global R&D capabilities to accelerate advanced battery materials development for customers worldwide. The lab is dedicated to the development, characterization, and rigorous testing of critical materials for battery cells and packs—spanning membranes, venting solutions, moisture and con...

26 Nov 2025 | Wednesday | NEWS
Synopsys, NVIDIA, and Microsoft Unveil Real-Time Simulation Framework to Transform Dynamic Manufacturing Processes

The framework, featuring NVIDIA Omniverse libraries, NVIDIA CUDA-X libraries, Microsoft Azure, and accelerated Synopsys physics, has demonstrated the ability to optimize bottle filling assembly lines in near real time and expand the accessibility of simulation-driven insight  Key Highlights  A blueprint for realizing the promise of digital transformation, the open-source framework ...

25 Nov 2025 | Tuesday | NEWS
Breker Verification Systems Enables Extreme-Coverage Verification of Frontgrade Gaisler’s Fault-Tolerant NOEL-V RISC-V Processor

Breker Verification Systems, whose portfolio solves challenges across the functional verification process for large, complex semiconductors and Frontgrade™ Technologies, a leading provider of high-reliability electronic solutions for space and national security missions today confirmed its RISC-V functional verification solutions were pivotal for verification of the NOEL-V, one of Front...

21 Nov 2025 | Friday | NEWS
iDEAL Semiconductor Unveils SuperQ™ MOSFET with Industry-Leading Short-Circuit Robustness for 72V+ Battery Systems

New 150V/2.5mΩ device delivers industry-leading short-circuit robustness and enables up to 50% component reduction in 72V+ battery management systems  iDEAL Semiconductor, a leader in high-performance power silicon,  announced the availability of its SuperQ™ MOSFET technology, purpose-built to solve the critical safety and efficiency trade-off in high-voltage (72V and higher...

21 Nov 2025 | Friday | NEWS
BAE Systems Expands RH12 Storefront to Accelerate Next Generation Radiation Hardened Chip Development

RH12™ Storefront offers a one-stop-shop for new integrated circuits that withstand the harsh space environment  BAE Systems (LON: BA) has added new capabilities to its next-generation, radiation-hardened 12 nanometer (nm) Storefront. The RH12™ Storefront is an advanced and accessible integrated circuit development capability with a vast technology library to support a wide r...

20 Nov 2025 | Thursday | NEWS
dSPACE Introduces DARTS ARROW for Advanced Functional Testing of Automotive Radar Sensors

dSPACE will demonstrate a new radar solution for functional testing of radar sensors. The DARTS ARROWhas been specially developed for use in end-of-line tests and periodic technical inspections (PTI) of radar-based driver assistance systems. The compact radar target simulator is efficient and easy to use and simulates the range, speed, and radar target cross-section of a radar target in dynamic ...

19 Nov 2025 | Wednesday | NEWS
QuickLogic eFPGA Hard IP Selected by Chipus for High Performance Data Center ASIC on Proven 12 nm Process

 QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP and ruggedized FPGAs, announced  that its eFPGA Hard IP was selected by Chipus for a high performance data center production ASIC that will be fabricated on an industry-proven 12 nm process technology.  eFPGA IP was a central requirement for this high-performance ASIC and underscores how QuickLogic's...

19 Nov 2025 | Wednesday | NEWS
Accton Edgecore, 1Finity and Liqid Forge Collaboration To Deliver Long Distance All Photonic Connectivity for AI Datacenters

Accton/Edgecore Networks, 1Finity (a Fujitsu company), and Liqid are pleased to announce a strategic collaboration to develop and deliver a cutting-edge datacenter solution that enables seamless all-photonic network connectivity across long distances from several kilometers to several hundred kilometers. The solution is designed to maintain high transmission rates, low latency, and zero throughp...

19 Nov 2025 | Wednesday | NEWS
Taiyo Holdings and imec Demonstrate Breakthrough Fine-Pitch RDL Material for Next-Generation Semiconductor Packaging

Taiyo Holdings Co., Ltd. (Securities Code: 4626; hereinafter referred to as "Taiyo Holdings"), based in Tokyo, presented a paper, co-authored with imec, one of the world's largest semiconductor research institutions, at the 14th IEEE CPMT Symposium Japan (ICSJ2025), focusing on the "FPIM (TM) Series" (hereinafter referred to as "this material"), a negative-type photosensitive insula...

14 Nov 2025 | Friday | NEWS
Fabric8Labs Secures $50 Million to Expand U.S. Electrochemical Additive Manufacturing Capacity

Fabric8Labs, the company pioneering Electrochemical Additive Manufacturing, announced a $50 million funding round to expand its U.S.-based advanced manufacturing facilities, boosting capacity to produce tens of millions of components annually. Powered by its breakthrough Electrochemical Additive Manufacturing (ECAM) technology, Fabric8Labs is scaling up production of next-generation electronic...

14 Nov 2025 | Friday | NEWS
SPARK Microsystems Launches Ultra-Low-Power Presence Detection Kit Based on LE-UWB™ Technology

SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, announced a new presence detection kit (PDK) that enables designers to break the barriers of legacy wireless connectivity for next-generation smart devices with advanced presence detection capabilities. Presence-aware IoT devices for applications spanning healthcare,...

13 Nov 2025 | Thursday | NEWS
Pixelworks' Distributed Rendering Solution Powers realme GT8 Series R1 Gaming Chip for PC-Level Visuals

Distributed Rendering Solution Unlocks a New Visual Experience with Low Power Consumption and High Image Quality Pixelworks, Inc. (NASDAQ: PXLW), a leading provider of visual processing solutions,  announced that it offers an advanced distributed rendering solution for the R1 gaming chip equipped in the realme GT8 series smartphones. By integrating ultra-low latency MotionEngi...

10 Nov 2025 | Monday | NEWS

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