HAP International Advances Toward Agreement with U.S. Customs for TRACE ID Supply Chain Traceability Program

HAP International announced  that following a successful technical assessment of the quality and scope of shipment-level traceability data provided by the TRACE ID program, they are taking steps toward a formal Memorandum of Agreement with U.S. Customs and Border Protection (CBP). The initiative builds on CBP’s ongoing Global Business Identifier (GBI) test and reflects the agency&rsqu...

8 Oct 2025 | Wednesday | NEWS
Mitsubishi Electric Unveils Advanced Silicon Carbide Power Semiconductor Facility in Kumamoto

Mitsubishi Electric Corporation  celebrated the completion of its new cutting-edge facility for producing power semiconductors at its Kikuchi Plant in Kumamoto Prefecture. The six-story, 42,000-square-meter facility is slated to begin operations in November 2025, with mass production expected in 2027. The facility will focus on manufacturing silicon carbide (SiC) power semiconductors, whic...

7 Oct 2025 | Tuesday | NEWS
ESD Industry Posts 8.6% Revenue Growth in Q2 2025, Led by Americas, EMEA, and APAC

Geographic Regions Americas and EMEA Reported Double-Digit Increases Electronic System Design (ESD) industry revenue increased 8.6% to $5,089.4 million in the second quarter of 2025 from the $4,685.5 million registered in the second quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced  in its latest Electronic Design Market Data (EDMD) report. ...

7 Oct 2025 | Tuesday | Company results
India’s Semiconductor Revolution Finds Its Backbone in Materials Science

As India’s semiconductor aspirations gather pace, the spotlight is gradually shifting from fabrication plants to the unsung enablers of the chipmaking process — the materials that make every connection possible. From bonding wires and solder pastes to fluxes and adhesives, global materials manufacturers are homing in on India, viewing it as a future hub not just for chip assembly, b...

6 Oct 2025 | Monday | NEWS
Taiwan Rejects U.S. Proposal for 50-50 Split in Global Chip Production

Taiwan has firmly rejected a proposal from the U.S. Trump administration suggesting a 50-50 split in global semiconductor production. The proposal, reportedly introduced by U.S. Commerce Secretary Howard Lutnick, aimed to balance chip manufacturing between the U.S. and Taiwan. However, Taiwan's Vice Premier Cheng Li-chiun clarified that this specific arrangement was "not discussed" during the re...

6 Oct 2025 | Monday | NEWS
Canaan Secures Record U.S. Order for 50,000 Avalon A15 Pro Bitcoin Miners

Largest single order in the past three years includes more than 50,000 Avalon® A15 Pro bitcoin miners scheduled for delivery in fourth quarter 2025 Canaan Inc., an innovator in crypto mining, announced that it has secured a purchase order from a U.S.-based bitcoin miner for more than 50,000 of its latest-generation Avalon A15 Pro mining machines. Representing the largest order in the past t...

3 Oct 2025 | Friday | NEWS
3M Joins JOINT3 Consortium to Advance Next-Generation Semiconductor Packaging

3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, equipment and design.  JOINT3 is a co-creation evaluation platform established by Japan-based Resonac Corporation with the aim of accelerating the development of tools optimized for panel-level organic interposers, the thin layers made from org...

2 Oct 2025 | Thursday | NEWS
GS Microelectronics Acquires Muse Semiconductor to Expand Global MPW Services and Innovation Reach

GS Microelectronics US, Inc. (GSME), a leading-edge global supplier of integrated circuit design and manufacturing solutions, announced that it has acquired Muse Semiconductor. Muse Semiconductor is a recognized provider of multi-project wafer (MPW) services, enabling chip designs built on TSMC technology. This strategic acquisition will expand GSME's reach into key innovation hubs across No...

2 Oct 2025 | Thursday | NEWS
Sony Unveils IMX775: Industry’s Smallest 2.1 µm Pixel RGB-IR Image Sensor for In-Cabin Monitoring

Sony Semiconductor Solutions Corporation (Sony)  announced the upcoming release of the IMX775 CMOS RGB-IR image sensor with the industry's smallest[*1] pixel size of 2.1 µm, delivering both RGB and IR imaging on a single chip and a resolution of approximately 5 effective megapixels,[*2] designed for in-cabin monitoring cameras. *1  Among CMOS image sensor...

2 Oct 2025 | Thursday | NEWS