• Sunday | 09 August 2026
Kioxia Unveils XL1 CXL Memory Expansion Module Powered by XL-FLASH for AI Data Centres at FMS 2026

Kioxia Corporation, a world leader in memory solutions, announced that it will exhibit the KIOXIA XL1 series, a Compute Express Link™ (CXL™) compatible memory expansion module, at the Kioxia booth at FMS: the Future of Memory and Storage, taking place August 4 - 6 in Santa Clara, CA. The product features KIOXIA XL-FLASH™, a low-latency and high-performance flash memory techn...

4 Aug 2026 | Tuesday | NEWS
XCENA Launches MX1 CXL Memory Platform to Eliminate AI Inference Memory Bottlenecks

XCENA, providing memory-centric computing solutions for AI infrastructure, introduced MX1, its production memory lineup built to break through the capacity, utilisation, and data-movement now limiting AI inference at scale. The company is showcasing MX1 at FMS 2026: The Future of Memory and Storage, being held Aug. 4–6 at the Santa Clara Convention Centre. As generative AI drives larger mod...

4 Aug 2026 | Tuesday | NEWS
IonQ Completes SkyWater Acquisition to Strengthen U.S. Quantum Semiconductor Manufacturing

IonQ (NYSE: IONQ), the world’s leading quantum platform company, completed its acquisition of SkyWater Technology (NASDAQ: SKYT), the largest exclusively U.S.-based semiconductor foundry. “Acquiring SkyWater crystallises IonQ’s vision to serve as a technology leader, merchant supplier and ecosystem enabler across the entire quantum industry. We are investing in capabilities from...

4 Aug 2026 | Tuesday | NEWS
Linde to Invest $1.8 Billion in US and Taiwan to Expand Semiconductor Gas Supply

Linde (Nasdaq: LIN) announced that it has been awarded a new long-term agreement to supply ultra-high-purity industrial gases to one of the world’s largest semiconductor manufacturers. The agreement will support the expansion of the customer’s semiconductor manufacturing complex in Phoenix, Arizona. Linde will invest $1 billion to expand its existing on-site industrial gases complex i...

4 Aug 2026 | Tuesday | NEWS
AI, Advanced Packaging and EVs to Drive the Next Decade of Thermal Interface Materials Growth

In this interview with Semicon Leaders Asia,  Nikhil Kaitwade, Associate Vice President at Future Market Insights, Inc., discusses how AI infrastructure, advanced semiconductor packaging and electrification are driving demand for thermal interface materials, while highlighting the role of Asia, material innovation and industry collaboration in shaping the market's future.   Which end...

3 Aug 2026 | Monday | Interaction
Montage Technology Begins Trial Production of Industry-First CXL 3.2 Memory Expander Controller for AI Data Centres

Montage Technology announced the industry's first trial production of its CXL® 3.2 Memory eXpander Controller (MXC) chip, designed to address escalating demands for memory expansion and resource pooling in AI, cloud computing, and data centre environments. Leveraging CXL technology, the MXC chip enables customers to build memory infrastructure with higher capacity, improved reso...

3 Aug 2026 | Monday | NEWS
TrendForce Forecasts Diverging Memory Market in 2027 as AI Sustains DRAM Boom While NAND Faces Oversupply

TrendForce's latest research on the memory industry reveals that AI will remain the primary driver of memory demand in 2027. However, market dynamics are expected to diverge between DRAM and NAND Flash. On the DRAM side, continued HBM capacity allocation, robust AI server demand, and growing procurement of CPU memory and HBM are expected to keep supply constrained and prices on an upward trajecto...

3 Aug 2026 | Monday | NEWS
Korean Researchers Achieve Direct Photon Interference Between Distinct Quantum Light Sources

Large-scale quantum communication networks require both reliable quantum memories and coherent single-photon sources for efficient quantum information exchange. While various single-photon sources have been developed recently, each has inherent limitations, making a scalable and functional quantum network challenging to achieve. Hybrid quantum architectures that combine different quantum light so...

3 Aug 2026 | Monday | NEWS
MetaOptics and Elsoft Partner to Develop 12-Inch Metalens Manufacturing and Test Equipment

MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group") and Elsoft Research Berhad (Bursa Malaysia: 0090) ("Elsoft") jointly announced a strategic partnership to co-develop and mass produce the next generation of 12-inch large format precision, high speed metalens laser writers and leading-edge automatic testers that could sort meta...

3 Aug 2026 | Monday | NEWS
Quectel’s Morse Micro-Based Wi-Fi HaLow Module Achieves Global Certification for Mass Production

Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, announced that Quectel's FGH200M module has passed FCC/IC/CE/RCM certification. Built on Morse Micro's MM8108 system-on-chip, the module is now cleared for mass-market production, giving IoT device makers a validated path to Wi-Fi HaLow at scale. The FGH200M, built around Morse Micro's second-generation MM8108 Wi-Fi HaLow system...

3 Aug 2026 | Monday | NEWS
Renesas Launches Third-Generation DDR5 MRDIMM Chipset for AI and Cloud Servers

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, announced its third-generation (Gen 3) DDR5 Multiplexed Rank Dual In-Line Memory Module (MRDIMM) chipset solutions, delivering DDR5 server-class MRDIMM speeds up to 16,000 megatransfers per second (MT/s). The new solutions are designed to address the growing demand for higher memory bandwidth drive...

31 Jul 2026 | Friday | NEWS
Kioxia Begins Sampling 9th-Generation BiCS FLASH 1Tb TLC Memory for AI Devices

Kioxia Corporation, a world leader in memory solutions, announced it has commenced sample shipments of 1Tb (terabit) Triple-Level Cell (TLC) memory devices incorporating its 9th-generation BiCS FLASH™ 3D flash memory technology. The devices are designed to support applications such as AI-enabled PCs and smartphones with low- to mid-level storage capacities that require high performance. Kio...

31 Jul 2026 | Friday | NEWS
Toshiba Begins Mass Production of TXZ+ M4L Microcontrollers for Smart Motor Control Applications

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has started mass production of TXZ+™ Family Entry‑Class M4L Group, compact microcontrollers featuring an Arm® Cortex®‑M4 core with a floating‑point unit (FPU) for next-generation home appliances, consumer products and industrial equipment. Demand is growing for energy efficiency, compact designs, IoT co...

31 Jul 2026 | Friday | NEWS
Kioxia Introduces UFS 5.0 Flash Memory to Accelerate On-Device AI Performance

Kioxia Corporation, a world leader in memory solutions, announced its UFS(1) 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices. The new solutions will be demonstrated next week at FMS: the Future of Memory and Storage and are now available as commercial samples in 1...

31 Jul 2026 | Friday | NEWS
CXMT Shares Surge 466% in Record Shanghai Debut, Cementing China's DRAM Ambitions

ChangXin Memory Technologies (CXMT), China's largest producer of dynamic random-access memory (DRAM) chips, saw its shares surge 466% in its market debut on the Shanghai Stock Exchange's STAR Market. The company raised 57.9 billion Chinese yuan ($8.6 billion) in what is Asia's biggest initial public offering (IPO) this year, according to a Russia Today (RT) report. [1] At the ...

31 Jul 2026 | Friday | NEWS
Muse Semiconductor and True Circuits Launch University IP Program for TSMC-Based Chip Design

Muse Semiconductor, a subsidiary of GS Microelectronics US, Inc. (GSME) and a leading provider of multi-project wafer (MPW) services, and True Circuits, Inc. (TCI), a leading provider of analog and mixed-signal intellectual property (IP) announced the formation of a University IP Access Program offering TCI Phased-Locked Loop (PLL) hard macros in select TSMC processes to students and research...

31 Jul 2026 | Friday | NEWS
PTSL Expands U.S. Semiconductor Test Business with Acquisition of Rucker and Kolls

Probe Test Solutions Ltd (PTSL), an established high-growth technology company and a world leader in delivering advanced Automated Test Equipment (“ATE”) test hardware solutions, announces the recent acquisition of Rucker and Kolls Inc (“R&K”), a U.S. probe card manufacturer. This represents the third acquisition by PTSL, following the earlier acquisition of Probe Techn...

30 Jul 2026 | Thursday | NEWS
AiBiz Deploys AMD EPYC CPUs to Power GPU-Free AI Defect Detection for Semiconductor Manufacturing

AiBiz, a six-year-old South Korean industrial-AI startup, is deploying AI to catch wafer defects before they cause failures — and it is doing so without the GPUs the industry has long assumed such work requires. AMD EPYC™ Server CPUs provided the performance the company needed to achieve this in a lightweight form without GPU acceleration. “We are a six-year-old startup,” ...

30 Jul 2026 | Thursday | NEWS
KIOXIA Unveils NX1 PCIe 5.0 SSDs with Direct Liquid Cooling for AI Data Centres

KIOXIA America, Inc. announced the KIOXIA NX1 Series of solid-state drives (SSDs), a new generation of E1.S PCIe® 5.0 NVMe™ data centre SSDs, and Kioxia’s first SSD with direct liquid cooling support. The KIOXIA NX1 Series features Kioxia’s next-generation, in-house developed controller architecture enabling unique capabilities today while providing a foundation for...

30 Jul 2026 | Thursday | NEWS
BrainChip Launches AKD1500 M.2 Module for Low-Power Plug-and-Play Edge AI

BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), a global leader in ultra-low power, fully digital, event-based neuromorphic AI, announced that its AKD1500 chip based on the Akida™ neuromorphic processor is now available in the compact M.2 form factor, enabling fanless, plug-and-play edge AI for industrial and commercial designs. The new AKD1500 M.2 module is positioned as a lo...

30 Jul 2026 | Thursday | NEWS

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