• Thursday | 26 March 2026
Polymatech Electronics to Showcase Advanced COB LED Solutions at Light + Building 2026

Polymatech Electronics, a leading innovator in semiconductor and optoelectronic technologies, will showcase its state-of-the-art Chip-on-Board (COB) LED solutions at Light + Building 2026, the world's leading trade fair for lighting and building services technology, taking place in Frankfurt, Germany. Visitors are invited to explore Polymatech's latest LED innov...

23 Mar 2026 | Monday | NEWS
Global 5G Chipset Market Set for Strong Growth as Network Expansion Accelerates

According to Mordor Intelligence, the 5G chipset market is witnessing rapid expansion, driven by increasing global 5G deployment and demand for high-speed connectivity solutions. The 5G chipset market is projected to grow from USD 33.40 billion in 2025 to USD 39.63 billion in 2026, reaching USD 93.05 billion by 2031, with a CAGR of 18.66% over the forecast period. The strong 5...

23 Mar 2026 | Monday | NEWS
pSemi Expands Power Portfolio with Advanced Charging and High-Voltage Conversion Solutions

pSemi, a global leader in capacitor switching power architectures and Murata company, made two major product announcements—the PE26100 multi-level buck converter for direct charging applications and the PE25304 advanced integrated charge pump switching-capacitor power module—that promise to revolutionise the mobile battery charging industry and enable high-efficienc...

23 Mar 2026 | Monday | NEWS
Lumotive Unveils Programmable Two-Dimensional Photonic Beamforming Chip

Lumotive, a pioneer in programmable optical semiconductor technology, announced a landmark breakthrough with the successful demonstration of the world's first programmable two-dimensional (2D) photonic beamforming chip based on its Light Control Metasurface (LCM™) architecture. This leapfrog advance in semiconductor-based photonics enables electronic control of light across two dimensions w...

20 Mar 2026 | Friday | NEWS
Wolfspeed, Inc. Raises Approximately 475 Million Dollars to Strengthen Capital Structure

Wolfspeed, Inc. (NYSE: WOLF) (“Wolfspeed”) announced that on March 19, 2026, it entered into separate, privately negotiated subscription agreements with investors pursuant to which Wolfspeed will place (i) $379,000,000 aggregate principal amount of its 3.5% Convertible 1.5 Lien Senior Secured Notes due 2031 (the “Notes”) and (ii) 3,250,030 shares of common stock, at a purch...

20 Mar 2026 | Friday | NEWS
SimpleChips Technology Inc. Launches 1200V High-Voltage Monitor Integrated Circuit at APEC 2026

APEC 2026 — In booth 2218, SimpleChips Technology Inc., a global provider of analogue and mixed-signal application-specific integrated circuits (ASICs) for automotive, medical, industrial and aerospace applications, announced the availability of the 18SCT005, the industry’s first 1200V high-voltage monitor IC. With a superior output accuracy of 0.7%, this monolithic IC is ide...

20 Mar 2026 | Friday | NEWS
BrainChip Holdings Ltd. Partners with Lockheed Martin Unit to Advance Neuromorphic Artificial Intelligence at the Edge

BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), a leading developer of ultra-low-power, fully digital, event-based neuromorphic AI, announced a strategic collaboration with ForwardEdge ASIC, a wholly owned subsidiary of Lockheed Martin (NYSE: LMT) specialising in advanced ASIC architecture and microelectronics development. Together, the companies are combining best-in-class AI ...

20 Mar 2026 | Friday | NEWS
HyperLight Corporation Launches 400G-per-Lane Photonic Integrated Circuits for Artificial Intelligence Networking

HyperLight Corporation (“HyperLight”), creator of the TFLN Chiplet™ Platform, announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure. The new PIC family delivers low insertion loss, low drive voltage operation, and exceptional electro-optic bandwidth, enabling energ...

20 Mar 2026 | Friday | NEWS
Qnity Electronics Collaborates with NVIDIA to Advance Artificial Intelligence Driven Semiconductor Materials Innovation

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced a collaboration with NVIDIA to accelerate AI-driven innovation using open NVIDIA Nemotron 3 Nano, ALCHEMI BMD NIM, LAMMPS Kokkos, and CUDA-X accelerated Abaqus for modeling and simulation technologies. The collaboration is focused on advancing materials res...

20 Mar 2026 | Friday | NEWS
Longsys Showcases Artificial Intelligence Driven Semiconductor Storage Solutions at Embedded World 2026

At Embedded World 2026, branded semiconductor memory enterprise Longsys (301308.SZ) demonstrated its integrated storage innovation capabilities and dual business-model value under the theme "AI Storage for Embedded World". Automotive-grade Portfolio Powers Intelligent Vehicles With seven years of expertise in automotive-grade storage, Longsys has built comprehensive capabilities across chi...

19 Mar 2026 | Thursday | NEWS
Siemens Launches Autonomous Artificial Intelligence Agent for Semiconductor Design Automation

Siemens announced the Fuse™ EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed circuit board (PCB) system workflows that span across design, verification and manufacturing sign-off. Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the Fuse...

19 Mar 2026 | Thursday | NEWS
Innatera and Joya Design Bring Neuromorphic Semiconductor Technology to Consumer Audio

Innatera, a specialist in neuromorphic computing for ultra-low-power edge AI, has partnered with Joya Design to deliver a commercially viable consumer audio solution powered by its Pulsar chip. The collaboration marks a significant step in transitioning brain-inspired computing from development into real-world product deployment. Joya Design has successfully integrated Innatera’s Pulsar mic...

19 Mar 2026 | Thursday | NEWS
Kinaxis Inc. Accelerates Semiconductor Supply Chain Optimisation with Artificial Intelligence Computing

Kinaxis® Inc. (TSX: KXS), a global leader in supply chain orchestration, announced a new milestone in advancing large-scale supply chain optimisation within the Kinaxis Maestro™ platform. Maestro already delivers high-performance optimisation across complex global supply chains, and Kinaxis is now extending that leadership by leveraging GPU acceleration powered by NVIDIA cuOpt&...

19 Mar 2026 | Thursday | NEWS
Sivers Semiconductors AB Partners with O-Net Technologies and Enablence Technologies Inc. on Optical Interconnect Solution for Artificial Intelligence Data Centres

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a strategic partnership with O-Net Technologies and Enablence Technologies Inc. (TSXV: ENA) to develop an advanced external light source (ELS) module with Sivers laser arrays to support Co-Packaged Optics (CPO) roll-out in AI datacenters and HPC systems. O-Net ...

19 Mar 2026 | Thursday | NEWS
Sony Semiconductor Solutions Corporation Launches 4K Image Sensor with Advanced LOFIC Pixel Technology

Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming launch of the IMX908, a 4K CMOS image sensor for security cameras featuring the industry's smallest 1.45 µm LOFIC pixels. * The new sensor utilises newly developed LOFIC pixels to achieve 96dB high dynamic range images with a single exposure at 4K resolution. This results in improved low-light performance...

18 Mar 2026 | Wednesday | NEWS
Synopsys Showcases Artificial Intelligence Driven Semiconductor Design Collaboration with NVIDIA

At GTC 2026, Synopsys presented the outcomes of its ongoing collaboration with NVIDIA, highlighting how the integration of AI and accelerated computing is reshaping modern engineering and design processes. By combining its expertise in electronic design automation (EDA) and simulation with NVIDIA’s high-performance computing technologies, Synopsys is enabling organisations to tackle increas...

18 Mar 2026 | Wednesday | NEWS
Tower Semiconductor and Oriole Networks Partner to Advance Optical Switching for Artificial Intelligence Infrastructure

Tower Semiconductor has announced a strategic collaboration with Oriole Networks to accelerate the development of next-generation AI infrastructure, leveraging nanosecond optical circuit switching technology. The partnership brings together Oriole’s advanced networking architecture with Tower’s high-volume silicon photonics manufacturing platform. The objective is to commercialise opt...

18 Mar 2026 | Wednesday | NEWS
Qualitas Semiconductor Selects Anritsu Corporation Solution for High-Speed Semiconductor Validation

Qualitas Semiconductor has selected a vector network analyser from Anritsu Corporation as part of its strategy to enhance signal integrity verification in high-speed interface development. As a provider of advanced PHY IP solutions, Qualitas operates in increasingly demanding semiconductor markets, including AI, data centres, automotive and mobile systems. With data transmission speeds continuing...

18 Mar 2026 | Wednesday | NEWS
Wolfspeed, Inc. Positions 300 MM Silicon Carbide Platform for Artificial Intelligence and High Performance Computing

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, announced that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade. “As AI workloads continue to increase package size, power density, and integration complexity, ...

18 Mar 2026 | Wednesday | NEWS
Semtech Corporation Launches 224Gbps Optical Interconnect Chipset for AI Data Centres

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a family of 224Gbps per lane Transimpedance Amplifiers (TIAs) and Mach-Zehnder Modulator (MZM) drivers for half retimed (LRO), LPO, XPO, Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) interconnect applications. ...

17 Mar 2026 | Tuesday | NEWS

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