Micron Technology has announced plans to invest approximately $24 billion to expand its memory chip manufacturing capacity, signalling strong confidence in sustained demand driven by artificial intelligence and data centre workloads. The announcement pushed Micron’s shares higher, reflecting investor optimism around tightening memory markets and long term growth prospects. The investment ...
India’s Union Budget 2026 places rare earth minerals firmly within the country’s strategic materials and supply chain security agenda. While rare earths do not feature as a standalone headline announcement, their importance is clearly embedded across priorities spanning mining reform, clean energy, electronics manufacturing and advanced industrial development. T...
TSMC’s new Global R&D Center in Taiwan reflects Asia’s drive to maintain cutting-edge chip capabilities on home soil. Semiconductor technology has become not just an industry, but an instrument of national power. Semiconductors in 2025 are not merely about cranking out more chips – they have become closely tied to national sovereignty and strategy. Nowhere is this shift more...
Government of India has approved an expanded set of incentives aimed at accelerating domestic manufacturing of compound semiconductors and advanced packaging, marking a significant step in building strategic depth across critical technology supply chains. The enhanced support framework is designed to attract investment into high value segments such as compound semiconductors, wh...
SK Hynix has reaffirmed its long term commitment to semiconductor manufacturing with an expanded investment plan in the Yongin chip cluster, underlining confidence in the future trajectory of the global semiconductor industry. The move strengthens Yongin’s position as a strategic semiconductor hub, with the expanded footprint expected to support advanced memory production,...
United States is pressing ahead with a comprehensive restructuring of its semiconductor industry, signalling a decisive shift towards a more resilient, competitive and strategically aligned national chip ecosystem. The ongoing transformation reflects a clear policy direction to reduce structural vulnerabilities exposed by recent global disruptions. By rebalancing supply chains and strengt...
Wizerr AI today introduced the Agentic BOM Engine, powered by Wizerr’s patent-pending component intelligence engine (ELX). ELX reads and interprets complex component datasheets with engineer-level precision and scales that capability to millions of components, turning unstructured documents into AI-transformed, reasoning-ready data for multi-agent workflows across the electronics manufactu...
-Kioxia America, Inc. announced a collaboration between Kioxia Corporation, Tsubakimoto Chain Co. (Tsubakimoto Chain) and EAGLYS Inc. (EAGLYS) to develop AI-driven image recognition technology that automatically identifies products moving through logistics workflows. This system supports advanced automation and efficiency in logistics, enabling organizations to respond quickly to changing...
Expanding global carbon regulations and Carbon Border Adjustment Mechanism (CBAM) exposure could increase costs and vulnerabilities for the semiconductor and Artificial Intelligence (AI) sectors Expanding global carbon regulations and stricter reporting requirements that include indirect greenhouse gas (GHG) emissions, such as Scope 2 and 3, could substantially in...
Micron Technology, Inc., a global leader in memory and storage solutions, today announced plans to invest $9.6 billion in the construction of a new advanced semiconductor fabrication facility in Hiroshima, Japan. The new plant will focus on producing next-generation high-bandwidth memory (HBM) chips designed to power the world’s rapidly expanding artificial intelligence (AI) and high-perfo...
TDK Corporation and Nippon Chemical Industrial Co., Ltd. have announced the signing of an agreement to begin formal discussions toward establishing a joint venture dedicated to next generation electronic component materials. The proposed venture would focus on the co development and manufacturing of ceramic materials for multilayer capacitors as well as other high value materials essential to se...
Hummink is redefining how the world’s smallest technologies are made, using ultra-precise printing to fix microscopic flaws and power the next generation of chips and displays. As microelectronics underpin the rise of artificial intelligence and high-performance computing, the smallest manufacturing imperfections have become billion-euro problems. Each defect at the sub-micron scale...
-Supplyframe and Orbweaver announced a new strategic collaboration that addresses one of the most pressing challenges facing electronics manufacturers and distributors: the need to harmonize and connect critical data across design, sourcing, and commercial systems. Through this partnership, Supplyframe’s Design-to-Source Intelligence (DSI) platform and SaaS solutions including NPI, ...
Growth in 300 mm Shipments Fueled by AI to Support Advanced Logic, Cloud Computing and Memory Applications The SEMI Silicon Manufacturers Group (SMG) reported , in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 3.1% year-on-year to 3,313 million square inches (MSI) from the 3,214 MSI recorded during the same quarter of 2024. Sequent...
SolarEdge and Infineon are partnering to advance the development of highly efficient next-generation Solid-State Transformer (SST) technology for AI and hyperscale data centers The new SST is designed to enable direct medium-voltage to 800–1500V DC conversion with over 99% efficiency, reducing size, weight, and CO₂ footprint The collaboration combines SolarEdge’s DC expertise...
-Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform. The enhanced platform integrates artificial intelligence (AI) to enable faster design iterations, optimize chip-package interaction (CPI) analysis, and accelerate time-to-market for complex A...
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced the RA8M2 and RA8D2 microcontroller (MCU) groups. Based on a 1 GHz Arm® Cortex®-M85 processor with an optional 250 MHz Arm®Cortex®-M33 processor, the new MCUs are the latest Renesas offerings to deliver an unmatched 7300 Coremarks of raw compute performance, the industry...
International Battery Metals Ltd.(“IBAT”) (TSXV: IBAT) & (OTCQB: IBATF), an advanced technology provider of modular direct lithium extraction (DLE) systems, announced a non-brokered private placement financing, marking the second follow-on investment under the Company’s previously announced binding Letter of Intent (“LOI”) with EV Metals 7 LLC (“EV M...
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona. The expanded investment includes additional cleanroom space and a second green...
Diversifies Portfolio with Complementary Capital Equipment Solutions and Expands Addressable Markets Supported by Secular Tailwinds Greater R&D Scale to Fuel Differentiated, Next-Generation Technologies for Customers Resilient Pro-Forma Operating Profile and Balance Sheet to Support Investment in Organic Growth Initiatives and Share Repurchase Program Expected to be Accretive to Non-GAA...