• Thursday | 09 October 2025
Global X Launches CHPX ETF to Capture AI and Quantum Semiconductor Innovation

Global X Management Company LLC ("Global X"), the New York-based provider of exchange traded funds (ETFs), announced the launch of the Global X AI Semiconductor & Quantum ETF (CHPX), designed to capture innovation in the semiconductor industry. The fund is passively managed and priced at 50 bps. The semiconductor industry is evolving to cater to demands of next-gen computing, including AI a...

2 Oct 2025 | Thursday | NEWS
GS Microelectronics Acquires Sinble Technology Vietnam to Accelerate TSMC-Based Design Capabilities

GS Microelectronics US, Inc. (GSME), the fastest-growing semiconductor service provider from North America, announced the acquisition of Sinble Technology Vietnam Company Limited, a strategic move to enhance its design expertise in TSMC-based advanced process nodes. "This acquisition aligns seamlessly with our strategic growth roadmap," - Farhat Jahangir, President and CEO of GSME The acquisitio...

28 Sep 2025 | Sunday | NEWS
DuPont Spin-Off Qnity Electronics Plans $2.5B Bond Offering Ahead of Separation

DuPont de Nemours, Inc.("DuPont") and Qnity Electronics, Inc. ("Qnity") announced today Qnity's intention to offer, subject to market and customary conditions, (i) $1.5 billion aggregate principal amount of senior secured notes due 2032 (the "Secured Notes") and (ii) $1.0 billion aggregate principal amount of senior notes due 2033 (the "Unsecured Notes" and, together with the Secured Notes, the ...

28 Sep 2025 | Sunday | NEWS
Aion Silicon Joins Intel Foundry’s Value Chain Alliance to Deliver Full-Stack Custom SoC Solutions

Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture partner, announced its membership in the Intel Foundry Accelerator Value Chain Alliance (VCA). As a VCA partner, Aion Silicon expands its existing turnkey service offerings to deliver full-stack custom silicon—from architecture through packaged silicon—across multiple market segments and geographies. This new allia...

28 Sep 2025 | Sunday | NEWS
Socionext Advances 3DIC Innovation with TSMC SoIC-X Tape-Out for AI and HPC Applications

Socionext, the Solution SoC company, announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of complete solutions for consumer, AI, and HPC data center applications that include chiplets, 2.5D, 3D, and 5.5D packaging. Socionext empowers customers with a proven development process and unmatched expertise delivering high-performance, high-quality sol...

28 Sep 2025 | Sunday | NEWS
d-Matrix Unveils JetStream™ I/O Card to Power Ultra-Low Latency, Scalable AI Inference at Data Center Scale

d-Matrix® announced the expansion of its AI product portfolio with d-Matrix JetStream™, a custom I/O card designed from the ground up to deliver industry-leading, data center–scale AI inference. With millions of people now using AI services – and the rise of agentic AI, reasoning, and multi-modal interactive content – the industry's focus is quickly shifting fro...

27 Sep 2025 | Saturday | NEWS

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