• Sunday | 10 May 2026
Liftr Insights Launches Predictive AI Scorecard for Hedge Funds and Semiconductor Markets

Liftr Insights announces the release of the Liftr® Indicator Scorecard™, a next-generation market intelligence index. This unique tool will fundamentally change how hedge funds and financial services firms identify, evaluate, and act on emerging signals across semiconductors, cloud providers, and AI infrastructure. The Indicator Scorecard introduces a scoring-based framew...

8 May 2026 | Friday | NEWS
Cadence and NVIDIA Deepen AI Engineering Partnership

Expanded collaboration combines agentic AI, physics-based simulation, and digital twins to accelerate engineering and unlock new levels of productivity across semiconductors, physical AI systems and AI factories At CadenceLIVE Silicon Valley 2026, Cadence (Nasdaq: CDNS) announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based ...

29 Apr 2026 | Wednesday | NEWS
Flex and Teradyne Robotics Expand Partnership to Scale Intelligent Automation

Flex (NASDAQ: FLEX) and Teradyne Robotics are expanding their collaboration to accelerate intelligent automation across global manufacturing. Under the expanded relationship, Flex plays a dual role by deploying Teradyne Robotics solutions within its own production facilities while manufacturing key robotics components that enable scalable automation deployments for Teradyne Robotics customers...

24 Apr 2026 | Friday | NEWS
Cadence Design Systems and NVIDIA Expand Partnership to Accelerate AI-Driven Engineering

At CadenceLIVE Silicon Valley 2026, Cadence (Nasdaq: CDNS) announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories. By combining Cadence&rsquo...

20 Apr 2026 | Monday | NEWS
Silicon Box Expands Automotive Strategy with imec Chiplet Consortium Membership

Silicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles. Chiplet technology is recognised as a critical solution to address rising costs and bottlenec...

17 Apr 2026 | Friday | NEWS
Tageos and Pragmatic Semiconductor Expand Partnership with Sustainable NFC Inlay Solutions

Tageos, a global leader in RFID and BLE inlays, and Pragmatic Semiconductor, a pioneer in flexible semiconductor technology, announced the expansion of their long-term strategic partnership with the launch of Tageos' latest product portfolio based on Pragmatic's flexible and sustainable NFC Connect product line. The new Tageos EOS Lite and EOS Zero Lite lines deliver innovative antenna d...

16 Apr 2026 | Thursday | NEWS
Park Systems Opens New Global Headquarters to Support Semiconductor Growth

Park Systems Corp., the world's leading provider of atomic force microscopy (AFM) solutions, announced the opening of its new global headquarters in Gwacheon City, South Korea. The new campus marks the culmination of three decades of growth and the beginning of a new phase of global expansion. The Gwacheon campus reflects Park Systems' evolution from a Stanford-born research venture into a global...

8 Apr 2026 | Wednesday | NEWS
Eltek Secures $5.3m PCB Orders to Strengthen Global Presence

Eltek Ltd. (NASDAQ: ELTK), a leading global manufacturer of high-quality printed circuit boards, announced that it has received purchase orders totalling approximately $5.3 million from an international customer. The orders are scheduled for delivery beginning in the second quarter of 2026, with the final shipment expected in September 2027. "We are pleased with this award, which supports ou...

7 Apr 2026 | Tuesday | NEWS
Roundhill Launches DRAM ETF to Capitalise on AI Memory Demand

Roundhill Investments, an ETF sponsor focused on innovative financial products, announced the launch of the Roundhill Memory ETF (Ticker: DRAM). DRAM seeks to provide investors with targeted exposure to global companies operating within the memory segment of the semiconductor industry, including manufacturers of DRAM, High-Bandwidth Memory (HBM), NAND flash, and solid-state storage devices (SSD)....

7 Apr 2026 | Tuesday | NEWS
ACCM Launches Zero-Skew Laminate for Next-Generation High-Speed Designs

Advanced Chip & Circuit Materials, Inc. (ACCM) introduced Celeritas SF1600, a laminate and prepreg material that eliminates fiber weave skew at its root. Fiber weave skew is a materials problem, not a routing one. Woven glass creates a spatially periodic dielectric in which differential pairs travel alternately through resin-rich and glass-rich regions. In a differential pair, the two conducto...

7 Apr 2026 | Tuesday | NEWS
Corning and Meta Expand Manufacturing to Support AI Infrastructure Growth

Corning and Meta have commenced construction on an expanded cable manufacturing facility in North Carolina to support the growing demand for artificial intelligence (AI) infrastructure. The project is part of a broader multi-year partnership between the two companies, under which Corning will provide advanced optical fibre, cable and connectivity solutions for Meta’s data centres. The agree...

3 Apr 2026 | Friday | NEWS
Tower Semiconductor Targets Capacity Growth with Japan Fab Expansion

Tower Semiconductor has announced plans to increase its 300mm wafer production capacity in Japan as part of a broader strategy to meet rising customer demand and strengthen its position in specialised semiconductor technologies. The initiative forms part of a restructuring of the company’s Japanese operations, currently organised under TPSCo, a joint venture with Nuvoton Technology Corporat...

3 Apr 2026 | Friday | NEWS
GS Microelectronics U.S., Inc. and Tarana Wireless, Inc. Expand Strategic RF Partnership to Accelerate Next-Gen Wireless Innovation

GS Microelectronics U.S., Inc. (GSME) announced a strategic partnership with Tarana Wireless, Inc. to support RF transceiver products and accelerate the future roadmap of wireless technologies. The deal strengthens the long-standing partnership between GSME and Tarana, enhancing the overall market value by providing dedicated RF-Analogue engineering support for Tarana's products. The team will sup...

30 Mar 2026 | Monday | NEWS
Nox Group Expands into Reno with Major Data Centre Development

Nox Group, a hyper-scale industrial builder, is making a new home in Reno through a major data centre development, driving investment in the region’s workforce as it enters one of the country’s most sought-after markets for mission-critical infrastructure. Nox Group is one of the fastest-growing construction enterprises in the United States with four operating companies, including ele...

27 Mar 2026 | Friday | NEWS
EPIC Microsystems Secures $21M Series A to Advance AI Data Centre Power Delivery

 EPIC Microsystems, a semiconductor company developing breakthrough power delivery solutions for AI infrastructure, announced it has raised an oversubscribed $21 million in Series A funding to accelerate the development and commercialisation of its vertical power delivery technology for next-generation AI compute platforms. The funding round was led by Seligman Ventures, with participation fr...

26 Mar 2026 | Thursday | NEWS
OKI Launches Comprehensive EMS for AI Server Manufacturing

OKI (TOKYO: 6703) will launch Comprehensive Electronics Manufacturing Services (EMS) for AI server equipment on March 25, 2026. These comprehensive services will cover all processes, from the design and production of large-size multi-layer printed circuit boards (PCBs) incorporating OKI’s proprietary high heat dissipation technology supporting high-speed high-capacity data transmission, to c...

26 Mar 2026 | Thursday | NEWS
Kulicke and Soffa Industries Expands Memory Interconnect Portfolio with ProMEM Suite Launch

Kulicke and Soffa Industries, Inc. ("K&S", "Company") announced an expanded portfolio of memory–focused interconnect solutions, reinforcing its leadership across Ball, Vertical Wire, Advanced Thermo–Compression, and Hybrid Bonding technologies. As memory assembly evolves to support higher bandwidth, greater power efficiency, and tighter integration for AI-driven workloads, manufac...

25 Mar 2026 | Wednesday | NEWS
Kulicke and Soffa Industries Expands Interconnect Portfolio with ASTERION™-TW Ultrasonic Welding System

Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("K&S" or the "Company"), a global leader in semiconductor assembly solutions and wedge bonding technology, announced ASTERION™-TW, a new ultrasonic terminal welding system designed to support next-generation power module manufacturing. ASTERION™‑TW leverages K&S's longstanding leadership in interconnect innovation, expan...

25 Mar 2026 | Wednesday | NEWS
Advanced Micro Devices Expands Strategic Collaboration with Samsung Electronics for AI Infrastructure

Advanced Micro Devices has expanded its strategic collaboration with Samsung Electronics, reinforcing supply chain alignment for next-generation AI and data centre technologies. The agreement focuses on securing advanced memory solutions while also exploring potential manufacturing partnerships. Under the arrangement, Samsung is expected to supply its latest high-bandwidth memory (HBM4) for AMD&r...

24 Mar 2026 | Tuesday | NEWS
University of Warwick Secures Funding to Expand Semiconductor Reliability Testing Capabilities

The University of Warwick has secured new funding to strengthen the UK’s capacity for testing the reliability of advanced power semiconductors, supporting critical applications across electrification and energy systems. The investment will enable the acquisition of a state-of-the-art wide-bandgap (WBG) reliability and robustness testing platform, supplied by UK-based ipTEST. The system is d...

24 Mar 2026 | Tuesday | NEWS

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