• Sunday | 10 May 2026
Mouser Electronics Named Americas Distributor of the Year by Harwin

Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, announces that it has been awarded the Americas Distributor of the Year Award from Harwin, a world leader in the manufacture of interconnect components. Harwin cited Mouser's continued sales and customer growth for the fiscal year (April 2025 to March 2026), co...

14 Apr 2026 | Tuesday | NEWS
Parade Technologies Launches DP 2.1a MST Hub for Automotive and Display Expansion

Parade Technologies, Ltd. (Taiwan OTC: 4966.TWO), a leading high-speed interface, video display, and touch controller IC supplier, announces the availability of PS8651V DP 2.1a/HBR3 1:2 MST hub controller for automotive, accessories and video display designs that need DP/eDP port expansion. It adds to Parade’s DP MST Hub solutions, which include the PS8650 DP 2.1a/UHBR20 1:4 MST hub controll...

6 Apr 2026 | Monday | NEWS
NUBURU Secures Initial Counter-Drone Deployment in Asia-Pacific

NUBURU, Inc. (NYSE American: BURU – the “Company”), a dual-use Defense & Security platform company focused on non-kinetic effects, directed-energy technologies, electronic warfare and software-orchestrated defense systems,  announced that its wholly owned subsidiary, Lyocon S.r.l. (“Lyocon”), has secured an initial deployment order for its portable directed-e...

6 Apr 2026 | Monday | NEWS
L Squared Launches Continuation Fund to Accelerate BTX Precision Growth

L Squared Capital Partners (“L Squared”) is pleased to announce the successful closing of a single-asset continuation fund for BTX Precision (“BTX” or the “Company”), a leading high-precision manufacturer of mission-critical components and assemblies. The platform’s unmatched breadth of additive and subtractive manufacturing capabilities – including ...

3 Apr 2026 | Friday | NEWS
UK Launches £10.4M EXPRESS Programme to Advance Next-Generation Semiconductor Materials

A new UK research initiative led by the University of Warwick and the University of Southampton aims to accelerate the development of advanced semiconductor materials for future electronic applications. The five-year EXPRESS programme, supported by £10.4 million in funding from the Engineering and Physical Sciences Research Council (EPSRC), will focus on enabling next-generation transistor ...

1 May 2026 | Friday | NEWS
Toshiba, ROHM and Mitsubishi Electric Explore Semiconductor Integration

Japan’s Toshiba, ROHM, and Mitsubishi Electric have signed a memorandum of understanding (MoU) to begin discussions on potentially combining parts of their semiconductor operations. The proposed collaboration would involve integrating the semiconductor activities of Toshiba’s subsidiary, Toshiba Electronic Devices & Storage Corporation, alongside ROHM’s chip business and Mit...

1 May 2026 | Friday | NEWS
EPIC Microsystems Secures $21M Series A to Advance AI Data Centre Power Delivery

 EPIC Microsystems, a semiconductor company developing breakthrough power delivery solutions for AI infrastructure, announced it has raised an oversubscribed $21 million in Series A funding to accelerate the development and commercialisation of its vertical power delivery technology for next-generation AI compute platforms. The funding round was led by Seligman Ventures, with participation fr...

26 Mar 2026 | Thursday | NEWS
Shenzhen Jewellok Technology Co., Ltd. Expands Ultra-High Purity Chemical Delivery Systems for Advanced Semiconductor Manufacturing

Shenzhen Jewellok Technology Co., Ltd., a leading innovator in high-precision fluid control, announced the expansion of its Ultra-High Purity (UHP) Liquid Chemical Delivery Systems. Engineered specifically for the rigorous demands of sub-micron semiconductor fabrication and photovoltaic production, these systems provide the extreme contamination control and automation required for modern wafe...

23 Mar 2026 | Monday | NEWS
OMRON Electronic Components Launches Cleanroom-Optimised Human Detection Module

OMRON Electronic Components announced the launch of the B5T-007003 Human Vision Component (B5T HVC-P2), a module specialised for human body detection in cleanroom environments where workers wear protective garments. As robotics and autonomous mobile robots (AMRs) become more deeply integrated into semiconductor, inspection, and food processing facilities to maintain productivity an...

23 Mar 2026 | Monday | NEWS
pSemi Expands Power Portfolio with Advanced Charging and High-Voltage Conversion Solutions

pSemi, a global leader in capacitor switching power architectures and Murata company, made two major product announcements—the PE26100 multi-level buck converter for direct charging applications and the PE25304 advanced integrated charge pump switching-capacitor power module—that promise to revolutionise the mobile battery charging industry and enable high-efficienc...

23 Mar 2026 | Monday | NEWS
HyperLight Corporation Launches 400G-per-Lane Photonic Integrated Circuits for Artificial Intelligence Networking

HyperLight Corporation (“HyperLight”), creator of the TFLN Chiplet™ Platform, announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure. The new PIC family delivers low insertion loss, low drive voltage operation, and exceptional electro-optic bandwidth, enabling energ...

20 Mar 2026 | Friday | NEWS
Qnity Electronics Collaborates with NVIDIA to Advance Artificial Intelligence Driven Semiconductor Materials Innovation

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced a collaboration with NVIDIA to accelerate AI-driven innovation using open NVIDIA Nemotron 3 Nano, ALCHEMI BMD NIM, LAMMPS Kokkos, and CUDA-X accelerated Abaqus for modeling and simulation technologies. The collaboration is focused on advancing materials res...

20 Mar 2026 | Friday | NEWS
Sivers Semiconductors AB Partners with O-Net Technologies and Enablence Technologies Inc. on Optical Interconnect Solution for Artificial Intelligence Data Centres

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a strategic partnership with O-Net Technologies and Enablence Technologies Inc. (TSXV: ENA) to develop an advanced external light source (ELS) module with Sivers laser arrays to support Co-Packaged Optics (CPO) roll-out in AI datacenters and HPC systems. O-Net ...

19 Mar 2026 | Thursday | NEWS
Halo Industries Selects Eyelit Technologies MES Platform for SiC Wafer Production

Eyelit Technologies (Eyelit), a leader in optimised planning, scheduling, and execution systems for manufacturers, announced that Halo Industries, an innovator in laser-based silicon carbide (SiC) wafering, has selected Eyelit’s solution suite to support its rapidly scaling production needs. Eyelit was chosen following a competitive evaluation, with Halo Industries selecting the platfo...

17 Mar 2026 | Tuesday | NEWS
Semtech Corporation Launches 224Gbps Optical Interconnect Chipset for AI Data Centres

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a family of 224Gbps per lane Transimpedance Amplifiers (TIAs) and Mach-Zehnder Modulator (MZM) drivers for half retimed (LRO), LPO, XPO, Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) interconnect applications. ...

17 Mar 2026 | Tuesday | NEWS
HyperLight Corporation Launches 145 GHz Packaged Intensity Modulator

HyperLight Corporation, creator of the TFLN Chiplet™  platform, announced the release of its 145 GHz Packaged Intensity Modulator (IM), expanding the company‘s high-speed modulator portfolio. The new device is designed for ultra-wide modulation bandwidth, high signal fidelity, and stable operation control, enabling 448 Gbps per lane intensity-modulated-direct-detection (IMDD)...

17 Mar 2026 | Tuesday | NEWS
HyperLight Corporation, United Microelectronics Corporation Partner on TFLN Photonics Foundry Production

HyperLight Corporation (“HyperLight”), United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, announced a strategic manufacturing partnership for high-volume foundry production of HyperLight’s TFLN (thin-film lithium niobate) Chiplet™ Platform on both...

16 Mar 2026 | Monday | NEWS
Mouser Electronics Returns as Platinum Sponsor of Create the Future Design Contest

Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, announces it is once again a Platinum sponsor of the Create the Future Design Contest. Create the Future is a global challenge for engineers and innovators to design the next great thing, with a chance to win the grand prize. Mouser, which has sponsored the contest for over a decade, is joined ag...

16 Mar 2026 | Monday | NEWS
Gateworks Corporation Expands Catalina SBC Family with NXP Semiconductors i.MX 95 Processor

Gateworks Corporation, a leader in industrial embedded technology, announced the expansion of its Catalina Single Board Computer (SBC) family. Engineered around the high-performance NXP® Semiconductors i.MX 95 applications processor, the Catalina platform is designed to bring transformative Edge AI, machine vision and autonomous capabilities to the harshest industrial environments. NXP w...

12 Mar 2026 | Thursday | NEWS
Nanopower Semiconductor Begins Volume Production of nPZero Power-Saving IC

Nanopower Semiconductor, a European fabless semiconductor manufacturer, announces that its award-winning nPZero power-saving integrated circuit (PSIC) is now in volume production, enabling original equipment manufacturers (OEMs) to move from evaluation to high-volume deployment in power-constrained Internet of Things (IoT) products. Nanopower's nPZero is a power-saving integrated circuit (PSIC) de...

12 Mar 2026 | Thursday | NEWS

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