• Thursday | 24 September 2026
Stäubli Showcases Connectivity and Automation Solutions for Semiconductor Manufacturing

Building on decades of semiconductor expertise, Stäubli delivers electrical and fluid connectivity solutions that help OEMs maintain process stability, protect yield, and maximise tool availability. As an industry leader, Stäubli will highlight these capabilities this October when Semicon West takes place in San Francisco, California. Visitors will have the opportunit...

14 Sep 2026 | Monday | NEWS
Samsung and Mistral AI Partner to Advance Semiconductor Design and Manufacturing

Samsung Electronics Co., Ltd. announced it has entered into a strategic partnership with Mistral AI to enhance its semiconductor engineering and manufacturing capabilities, which will reinforce its leadership in AI chip technologies. The announcement of the partnership was made during the state summit held in Paris between South Korea and France. Under the agreement, Samsung will integrate Mistra...

11 Sep 2026 | Friday | NEWS
Panmnesia and Meta Propose CXL Architecture to Turn AI Datacentres into a Single Computing System

Panmnesia, a fabless semiconductor company, and Meta, a global hyperscaler, have jointly proposed a next-generation artificial intelligence datacenter architecture in which an entire datacenter operates like a single chip. The work appears as an invited Review in Nature Reviews Electrical Engineering (NREE), a Nature Portfolio journal. The unit of AI execution is moving from one chip to the whole...

10 Sep 2026 | Thursday | NEWS
Global Semiconductor Equipment Billings Hit Record US$40.53 Billion in Q2 2026

SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report that global semiconductor equipment billings increased 23% year-over-year to US$40.53 billion in the second quarter of 2026. Second-quarter 2026 billings registered an 11% quarter-over...

7 Sep 2026 | Monday | NEWS
EverProX Launches MSDL 20G Chipset for Low-Power Multi-Camera Vision Systems

EverProX Technologies Munich GmbH, under its Silicon Line® brand—a pioneer in ultra-low-power optical and electrical interconnect technology announced the launch of "MSDL™ 20G", which is the first product in the new MSDL™ family, an end-to-end interconnect chipset comprising the SL8582x serializer and SL8581x deserializer. Engineered to overcome the bandwidth, EMI, and reach ...

7 Sep 2026 | Monday | NEWS
Mouser and Qorvo Advance Agile RF Solutions for Drones and Satellite Communications

Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, announces a new eBook in collaboration with Qorvo, exploring next-generation RF wireless designs for drones, satellite communications and industrial IoT. High-Performance RF Solutions for Agile New Markets addresses time-to-market pressures, coexistence issues, power-efficienc...

4 Sep 2026 | Friday | NEWS
ACES and Movandi Partner to Advance 5G and 6G Wireless Infrastructure in Saudi Arabia

Advanced Communications and Electronic Systems Company (ACES) and Movandi, the semiconductor and systems connectivity company powering intelligent wireless infrastructure, announced a strategic partnership, formalised through a Memorandum of Understanding (MoU) during LEAP 2026 in Riyadh, to advance the development, validation and commercialisation of next-generation 5G and future 6G wireless...

1 Sep 2026 | Tuesday | NEWS
Mitsubishi Electric and Sony Semiconductor Form AI Vision Joint Venture for Smart Manufacturing

Mitsubishi Electric Corporation and Sony Semiconductor Solutions Corporation have signed a definitive agreement to establish a strategic partnership aimed at accelerating the automation and digital transformation of manufacturing operations through advanced AI-powered vision technologies. As part of the collaboration, the two companies will create a new joint venture, Advanced Vision Solutions Co...

23 Jul 2026 | Thursday | NEWS
Micro-Transfer Printing Advances Silicon Photonics Integration for Next-Generation AI Infrastructure

Silicon photonics has emerged as a promising technology for addressing bandwidth and latency bottlenecks of conventional electrical interconnects and therefore are being explored for future artificial intelligence infrastructure. However, heterogenous integration of multiple material systems remains a challenge. Now, researchers show how micro-transfer printing can enable highly versatile heteroge...

21 Jul 2026 | Tuesday | NEWS
Tata Electronics Bets on Mature Semiconductor Nodes to Build India's First Commercial Chip Fab

Tata Electronics is focusing on mature semiconductor process technologies as it prepares to establish India's first commercial wafer fabrication facility, adopting a phased approach aimed at building a sustainable domestic chip manufacturing ecosystem rather than competing immediately in leading-edge production. The company's fabrication plant at Dholera, Gujarat, will initially manufacture chips...

20 Jul 2026 | Monday | NEWS
Mitsubishi Electric, Rohm and Toshiba Target September Deal to Merge Power Semiconductor Businesses

Mitsubishi Electric is aiming to reach an agreement by September to combine its power semiconductor business with those of Rohm and Toshiba, as the three Japanese companies seek to strengthen their competitiveness in the rapidly expanding global market for power chips. The proposed integration would bring together three of Japan's leading power semiconductor manufacturers, creating one of the wor...

20 Jul 2026 | Monday | NEWS
Penguin Solutions Closes US$750 Million Convertible Notes Offering to Accelerate AI Infrastructure Growth

Penguin Solutions, Inc., the AI Factory Platform Company (“Penguin,” “we” or the “Company”) (Nasdaq: PENG), announced that it has closed its previously announced private offering of $750.0 million aggregate principal amount of 0.00% convertible senior notes due 2031 (the “Notes”) to persons reasonably believed to be qualified institutional buyers as ...

20 Jul 2026 | Monday | NEWS
Researchers Develop Solvent-Based Method to Improve Organic Semiconductor Doping

Organic semiconductors are paving the way for a new generation of lightweight, flexible electronics, including bendable displays, printable circuits, wearable sensors, and devices that harvest energy from their surroundings. A key factor behind the performance of these technologies is doping—a process by which molecules are introduced into a semiconductor to control the number of charge carr...

13 Jul 2026 | Monday | NEWS
Samsung Begins Mass Production of PCIe 6.0 PM1763 Enterprise SSD for AI Servers and High-Performance Computing

Samsung Electronics Co., Ltd., a global leader in advanced memory technology,  announced mass production of PM1763, the company’s PCIe® 6.0-based enterprise solid-state drive (SSD) optimised for next-generation AI and HPC server environments. As the volume of data required for AI training and inference continues to grow rapidly, enterprise SSDs (eSSDs) that deliver data quickly and...

9 Jul 2026 | Thursday | NEWS
Mouser Electronics Wins HARTING Global High Service Distributor of the Year Award for Second Consecutive Year

Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, announced it has received the prestigious Global High Service Distributor of the Year Award from HARTING. Mouser also received the Distinguished Award for New Product Sales Growth. This is the second consecutive year that Mouser has received these prestigious d...

3 Jul 2026 | Friday | NEWS
LG Innotek Targets AI Semiconductor Boom with High-Value Substrate Portfolio Expansion

LG Innotek, renowned for its optical solution business and leadership in high-performance camera modules, is quickly establishing itself as a key player in package solutions, including high-value-added semiconductor substrates. Backed by a combination of structural growth drivers—including the rollout of 5G networks, trend toward higher-performing components in premium smartphones, ongoing ...

1 Jul 2026 | Wednesday | NEWS
Toshiba Launches 80V Power MOSFET to Boost AI Data Centre Power Supply Efficiency

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched “TPM1R408RH,” an 80V N-channel power MOSFET fabricated using U-MOS11-H, Toshiba’s latest-generation process[1]. The MOSFET targets applications such as switched-mode power supplies for industrial equipment used in AI data centres and communications base stations. Shipments start. The ongoing expan...

1 Jul 2026 | Wednesday | NEWS
Samsung Unveils Industry’s First UFS 5.0 Storage, Advancing On-Device AI Performance

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced that, for the first time in the industry, it has developed the industry's fastest Universal Flash Storage (UFS) 5.0 solution, which will help enable seamless and highly efficient AI services on future mobile devices. The milestone sets a new benchmark for the next-generation mobile memory market as the enhanc...

24 Jun 2026 | Wednesday | NEWS
Qnity Launches Advanced Packaging Innovation Hub to Accelerate AI and Next-Generation Semiconductor Growth

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company. The new online platform showcases Qnity’s breadth of material and technology solutions desi...

24 Jun 2026 | Wednesday | NEWS
Magnachip Launches 6th-Generation 600V SJ MOSFETs to Address Rising AI Server and EV Charging Demand

Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the introduction of two new 6th-generation 600V Super Junction (SJ) MOSFETs designed to meet the growing performance and efficiency requirements of AI servers, EV charging systems and industrial power applications. The new products feature low RDS(ON) values of 36mΩ and 37mΩ, helping reduce conduction lo...

24 Jun 2026 | Wednesday | NEWS

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