Omni Design Technologies, a leading provider of high-performance, low-power Wideband Signal Processing™ solutions, announced the tape out of its new ODT-ADS-7B64G-3T, an ultra-high-speed 64 GSPS SWIFT™ analog-to-digital converter (ADC) supporting 7- and 8-bit output modes, designed in TSMC’s 3nm process. This time-interleaved ADC provides the breakthrough speed and perfor...
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona. The expanded investment includes additional cleanroom space and a second green...
Phaidra, the company building AI agents for AI factories, announced a Series B funding round of more than $50 million led by Collaborative Fund, with participation from Helena, Index Ventures, NVIDIA, Sony Innovation Fund, and others. The funding will be used to make AI factories — the data center infrastructure purpose-built for AI workloads — radically more resource-efficient via A...
Collaboration includes a strategic investment from UST as the companies look to build manufacturing base through the 'Make in India' initiative UST, a leading AI and technology transformation solutions company, has announced a strategic investment in Kaynes Semicon, a prominent Indian semiconductor manufacturer. The investment arrangement lays the foundation for g...
Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, announced the immediate availability of its Total IP for eUSB with the eUSB v2 Controller and eUSB v2 PHY IP. Arasan's eUSB2 has been designed to target SoCs operating at 1.2V as the interface operating voltage. Arasan is one of the pioneers in the USB IP business having started with USB 1.0 as the compan...
As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing...
As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing...
InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement in enabling high-speed interconnects for heterogene...
Frost & Sullivan is pleased to announce that Baya Systems has been recognized with the 2025 Global Technology Innovation Leadership Recognition in the semiconductor IP interconnect solutions industry for its outstanding achievements in product innovation, strategic execution, and customer impact. This recognition highlights Baya Systems' consistent leadership in driving measurable ...
Efficient Computer, the company building the world's most energy-efficient general-purpose processors, announced that its Electron E1 processor is now available for developers looking to work hands-on with its latest chip and effcc Compiler, together. This marks Efficient's first standalone hardware release, unlocking the ability for developers to build intelligent applications that were prev...
Reinforcing the company's pivotal role in enabling the intelligent, connected world, Ceva, Inc., the leading licensor of silicon and software IP for the Smart Edge, announced it has once again been named the #1 vendor in Wireless Connectivity IP by IPnest in its latest 2025 Design IP Report. Ceva grew its wireless connectivity IP market share to 68% in 2024 - more than 10 times la...
LG Innotek has teamed up with Aeva, an American company specializing in LiDAR (Light Detection And Ranging) technology, to preempt the LiDAR market. LG Innotek announced on July 29, 2025, the signing of a strategic partnership outlining the strategic supply and joint development of next-generation LiDAR technology. Aeva developed the world's first 4D LiDAR based on the frequency modulate...
Rebellions Inc., a leading AI semiconductor company based in South Korea, announced a collaboration with Marvell Technology, Inc. to offer high-performance, energy-efficient AI systems tailored for regionally driven and sovereign-backed AI initiatives across APAC and the Middle East. As AI infrastructure becomes increasingly central to national competitiveness, a shift is underway from sta...
MetaOptics Ltd (the "Company", together with its subsidiary, the "Group") is a cutting-edge semiconductor optics company pioneering glass-based metalenses with AI-enhanced imaging. The Group is a vertically integrated frontrunner in metalens technology headquartered in Singapore, and has lodged its preliminary offer document for its upcoming initial public offering (the "IPO") on the Catali...
Quantum Computing Inc. ("QCi" or the "Company"), an innovative, integrated photonics and quantum optics technology company, announced it has been awarded a contract by the National Institute of Standards and Technology (NIST), part of the U.S. Department of Commerce, for the design and fabrication of thin-film lithium niobate (TFLN) photonic integrated circuits (PICs). In addition, the Comp...
In a world increasingly shaped by intelligent devices that connect, sense, and perceive our surroundings, Ceva, Inc., the leading licensor of silicon and software IP for the Smart Edge, today announced it has surpassed 20 billion Ceva-powered devices shipped globally. This milestone not only cements Ceva's legacy as a foundational technology provider of the mobile and IoT eras, but sets the...
According to a newly published forecast report by Dell'Oro Group, the trusted source for market information about the telecommunications, security, networks, and data center industries, the global Data Center Accelerator market is projected to reach $446 billion by 2029. Accelerators now account for roughly one third of total data center capex, making them the single largest driver of growth. "...
As demand surges for precise monitoring in darkness, predictive industrial maintenance, and safe nighttime driving, thermal imaging has become a critical enabler of intelligent perception. Yet, the widespread adoption of thermal imaging has long been held back by high costs, unclear images and complex integration. Raytron, a global leader in infrared thermal imaging, is transforming this landsca...
SK hynix Inc. (or 'the company', www.skhynix.com) announced that it has completed development of its 321-layer 2Tb QLC NAND flash product and has begun mass production. This achievement marks the world's first implementation of more than 300 layers using QLC technology, setting a new benchmark in NAND density. The company plans to release the product in the first half of next year foll...
Acer introduced the Veriton GN100 AI Mini Workstation, a compact yet powerful computer designed to run large AI models locally, minimizing dependence on cloud services and helping reduce associated costs. The device is built on the NVIDIA® GB10 Grace Blackwell Superchip, delivering up to 1 PFLOPS of FP4 AI performance. This powerhouse combines next-generation CUDA® cores, fifth-gen Tens...