Global Semiconductor Wafer Polishing and Grinding Equipment Market to Reach USD 890.6 Million by 2032

The "Semiconductor Wafer Polishing & Grinding Equipment Market - Global Forecast 2025-2032" report has been added to ResearchAndMarkets.com's offering. The Semiconductor Wafer Polishing & Grinding Equipment Market grew from USD 582.82 million in 2024 to USD 612.25 million in 2025. It is expected to continue its upward trajectory at a CAGR of 5.44%, ultimately reaching USD 890.64 million b...

24 Dec 2025 | Wednesday | NEWS
Asahi Kasei Divests Daramic Lead Battery Separator Business to Kingswood Capital as Part of Strategic Portfolio Realignment

Asahi Kasei, a diversified global manufacturer in the Healthcare, Homes, and Material sectors, announces its strategic divestiture of Daramic, a lead battery separator business, to Kingswood Capital Management, LP. The Daramic business transfer closed on December 1, 2025. The effect on Asahi Kasei’s consolidated financial results for fiscal 2025 is immaterial. “As we enter a new era...

4 Dec 2025 | Thursday | NEWS