• Thursday | 09 October 2025
Semtech Launches Next-Generation 5G AirLink® Routers with Network Slicing for Mission-Critical Public Safety Operations

New Generation of Purpose-Built Routers With 5G Network Slicing Support Enables Dedicated Connectivity Lanes for Mission-Critical First Responder Operations Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today announced the availability of the AirLink® XR80 and XR9...

8 Oct 2025 | Wednesday | NEWS
SmartSoC Solutions and France’s Cortus Forge Strategic Partnership to Build India’s Secure Chip Ecosystem

SmartSoC Solutions Private Limited, an Indian semiconductor design and product engineering company, today announced a strategic partnership with Cortus S.A.S., a French semiconductor company renowned for its cutting-edge Intellectual Property (IP) solutions in secure identification technologies. This partnership aims to drive innovation and accelerate the development and manufacturing of SIM car...

6 Oct 2025 | Monday | NEWS
Fourier Cooling Introduces Modular, High-Density Liquid-Cooled Data Centers for AI and HPC Workloads

Fourier Cooling Solutions ("Fourier"), a next-generation company dedicated to AI and HPC data center infrastructure, announced its official launch. Fourier introduces a portfolio of prefabricated, containerized data center solutions engineered to scale in step with the rapid evolution of GPUs, CPUs, and high-computing servers, meeting the accelerating demands of artificial intelligence (AI) and ...

1 Oct 2025 | Wednesday | NEWS
ShunYun Technology and NewPhotonics Forge Strategic OSAT Partnership to Accelerate High-Volume PIC Manufacturing

ShunYun Technology Ltd (SYT), a world-class manufacturer of optical transceivers, and NewPhotonics, a leading designer of highly integrated photonic integrated circuit (PIC) chips for data center optical interconnect, today announced a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line. Ethernet pluggable optics are forecasted to scale to >100 million by...

1 Oct 2025 | Wednesday | NEWS
scia Systems Expands Ion Beam Etching Capabilities to Advance Whole-Wafer Failure Analysis and Semiconductor Packaging

scia Systems GmbH, the industry leader in advanced ion beam and plasma process equipment for the microelectronics, MEMS, and precision optics industries, announced new capabilities supporting high-precision, high-throughput semiconductor device manufacturing and failure analysis (FA) on its industry-leading scia Mill series of ion beam etching (IBE) systems.     Fi...

1 Oct 2025 | Wednesday | NEWS
SK keyfoundry and LB Semicon Co-Develop High-Reliability Direct RDL Technology for Automotive and Next-Gen Semiconductor Packaging

SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on 8-inch wafers – in collaboration with LB Semicon. This achievement marks a significant step forward in advancing next-generation semiconductor pa...

28 Sep 2025 | Sunday | NEWS
InPsytech Tapes Out UCIE 2.0-Compliant Design on TSMC's SoIC F2F Technology

InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement in enabling high-speed interconnects for heterogene...

28 Sep 2025 | Sunday | NEWS
IdentifySensors Biologics' Digital Biosensor Shows Early Promise for Cancer Detection

IdentifySensors Biologics, a leader in digital diagnostic technologies, has demonstrated that its electronic biosensors used to detect pathogens can also detect cancer cells. As the company advances toward commercialization and regulatory review of its diagnostic platform, Check4, researchers began pursuing new applications for the technology. A major pharmaceutical company provided samples of ...

28 Sep 2025 | Sunday | NEWS
SEMI Foundation Opens Applications for Regional Nodes in National Microelectronics Education Network

The SEMI Foundation is thrilled to announce the launch of the application process for organizations seeking to become Regional Nodes in the National Network for Microelectronics Education (NNME), a nationwide initiative funded by the U.S. National Science Foundation and supported by the U.S. Department of Commerce that aims to advance education, training, and employment pathways in the U.S. micr...

28 Sep 2025 | Sunday | NEWS
Rebellions and Marvell Partner to Deliver Custom AI Infrastructure for Sovereign and Regional Cloud Initiatives

Rebellions Inc., a leading AI semiconductor company based in South Korea, announced a collaboration with Marvell Technology, Inc. to offer high-performance, energy-efficient AI systems tailored for regionally driven and sovereign-backed AI initiatives across APAC and the Middle East. As AI infrastructure becomes increasingly central to national competitiveness, a shift is underway from sta...

28 Sep 2025 | Sunday | NEWS
Zettabyte Secures Strategic Investment from Lam Capital and Leading Industry Players to Accelerate AI Data Center Innovation

Zettabyte, a fast-growing innovator in AI data center infrastructure software, jointly announced a new strategic investment by Lam Capital, the corporate venture arm of Lam Research Corp., a global supplier of innovative wafer fabrication equipment and services for the semiconductor industry. The funding round also included participation from Wistron, Foxconn and Pegatron. Zettabyte is transfor...

28 Sep 2025 | Sunday | NEWS
NEO Semiconductor Unveils World’s First Extreme High Bandwidth Memory (X-HBM) Architecture for Next-Gen AI Chips

NEO Semiconductor, a leading developer of breakthrough memory technologies, introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips. Built to meet the growing demands of generative AI and high-performance computing, X-HBM delivers unmatched performance with a 32K-bit data bus and potentially 512 Gbit per die, dramatically surpassing the limitations of tra...

28 Sep 2025 | Sunday | NEWS
Lightium, MPI, and Axiomatic_AI Partner to Develop World’s First Intelligent Autonomous Test Platform for Photonics

Lightium AG, MPI Corporation, and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices. This strategic collaboration aims to revolutionize the testing and qualification processes of photonic integrated circuit (PIC) devices by uniting state-of-the-art artifi...

28 Sep 2025 | Sunday | NEWS
ALi Corporation and Ceva Join Forces to Deliver AI-Enhanced Smart Edge Devices

As demand accelerates for intelligent, video-centric devices across consumer and industrial markets, ALi Corporation and Ceva, Inc. announced a strategic licensing partnership to integrate Ceva's advanced NeuPro-Nano and NeuPro-M Neural Processing Units (NPUs) into ALi's next-generation Video Display Sub-System (VDSS) platform. This collaboration combines ALi's expertise in multimedia SoCs ...

28 Sep 2025 | Sunday | NEWS
Cyient Semiconductors and GlobalFoundries Forge Strategic Channel Partnership to Accelerate Custom Silicon Innovation

Cyient Semiconductors Private Limited, a fast-growing custom silicon company, announced a strategic Channel Partner Agreement with GlobalFoundries (GF), one of the world's leading pure-play semiconductor foundries. Under the agreement, Cyient Semiconductors becomes an authorized reseller of GF's semiconductor manufacturing services and technologies. This collaboration is a significant step towa...

28 Sep 2025 | Sunday | NEWS
SiMa.ai Launches Modalix™ MLSoC to Power Physical AI at the Edge Under 10 Watts

Modalix™, a second-generation Machine Learning System on a Chip (MLSoC™) purpose built to lead the Physical AI industry, delivers industry-leading performance and accuracy without sacrificing power—supporting LLMs, transformers, CNNs, and GenAI workloads under 10 watts. Its flexible, Arm-based architecture with a native GenAI stack enables real-time perception, decision-making,...

28 Sep 2025 | Sunday | NEWS
Axcelis and GE Aerospace Launch Joint Program to Advance High-Voltage Silicon Carbide Power Devices

Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced a Joint Development Program (JDP) with GE Aerospace focused on the development of production-worthy 6.5 to 10kV superjunction power devices. Processes will be developed on Axcelis' Purion XEmax™ high energy implanter, which provides the industry's highest beam cur...

28 Sep 2025 | Sunday | NEWS
Clarkson University Launches Open-Source Tool to Tackle Chip Overheating in AI and HPC Systems

From smartphones and gaming consoles to artificial intelligence, the powerful chips that drive modern technology generate intense heat. When temperatures rise too high, performance suffers, energy is wasted, and hardware can fail. A research team at Clarkson University is developing a new tool to combat this challenge. Thermal Analysis of Semiconductor Chips, known as TASChips, is an open-sourc...

28 Sep 2025 | Sunday | NEWS
SK hynix Begins Mass Production of World’s First 321-Layer 2Tb QLC NAND Flash

SK hynix Inc. (or 'the company', www.skhynix.com) announced that it has completed development of its 321-layer 2Tb QLC NAND flash product and has begun mass production. This achievement marks the world's first implementation of more than 300 layers using QLC technology, setting a new benchmark in NAND density. The company plans to release the product in the first half of next year foll...

28 Sep 2025 | Sunday | NEWS
Sony Showcases Real-World Edge AI Traffic Solutions at ITS World Congress 2025

ITS WORLD (Booth #1605) – Sony Semiconductor Solutions announced its participation at the upcoming ITS World Congress, where it will highlight two groundbreaking municipal deployments of its advanced edge AI sensing technologies a road safety initiative in Lakewood, Colorado, and a comprehensive traffic management pilot with the City of San José, California. These real-world e...

28 Sep 2025 | Sunday | NEWS

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