• Sunday | 08 February 2026
ALi Corporation and Ceva Join Forces to Deliver AI-Enhanced Smart Edge Devices

As demand accelerates for intelligent, video-centric devices across consumer and industrial markets, ALi Corporation and Ceva, Inc. announced a strategic licensing partnership to integrate Ceva's advanced NeuPro-Nano and NeuPro-M Neural Processing Units (NPUs) into ALi's next-generation Video Display Sub-System (VDSS) platform. This collaboration combines ALi's expertise in multimedia SoCs ...

28 Sep 2025 | Sunday | NEWS
Cyient Semiconductors and GlobalFoundries Forge Strategic Channel Partnership to Accelerate Custom Silicon Innovation

Cyient Semiconductors Private Limited, a fast-growing custom silicon company, announced a strategic Channel Partner Agreement with GlobalFoundries (GF), one of the world's leading pure-play semiconductor foundries. Under the agreement, Cyient Semiconductors becomes an authorized reseller of GF's semiconductor manufacturing services and technologies. This collaboration is a significant step towa...

28 Sep 2025 | Sunday | NEWS
SiMa.ai Launches Modalix™ MLSoC to Power Physical AI at the Edge Under 10 Watts

Modalix™, a second-generation Machine Learning System on a Chip (MLSoC™) purpose built to lead the Physical AI industry, delivers industry-leading performance and accuracy without sacrificing power—supporting LLMs, transformers, CNNs, and GenAI workloads under 10 watts. Its flexible, Arm-based architecture with a native GenAI stack enables real-time perception, decision-making,...

28 Sep 2025 | Sunday | NEWS
Axcelis and GE Aerospace Launch Joint Program to Advance High-Voltage Silicon Carbide Power Devices

Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced a Joint Development Program (JDP) with GE Aerospace focused on the development of production-worthy 6.5 to 10kV superjunction power devices. Processes will be developed on Axcelis' Purion XEmax™ high energy implanter, which provides the industry's highest beam cur...

28 Sep 2025 | Sunday | NEWS
Clarkson University Launches Open-Source Tool to Tackle Chip Overheating in AI and HPC Systems

From smartphones and gaming consoles to artificial intelligence, the powerful chips that drive modern technology generate intense heat. When temperatures rise too high, performance suffers, energy is wasted, and hardware can fail. A research team at Clarkson University is developing a new tool to combat this challenge. Thermal Analysis of Semiconductor Chips, known as TASChips, is an open-sourc...

28 Sep 2025 | Sunday | NEWS
SK hynix Begins Mass Production of World’s First 321-Layer 2Tb QLC NAND Flash

SK hynix Inc. (or 'the company', www.skhynix.com) announced that it has completed development of its 321-layer 2Tb QLC NAND flash product and has begun mass production. This achievement marks the world's first implementation of more than 300 layers using QLC technology, setting a new benchmark in NAND density. The company plans to release the product in the first half of next year foll...

28 Sep 2025 | Sunday | NEWS
Sony Showcases Real-World Edge AI Traffic Solutions at ITS World Congress 2025

ITS WORLD (Booth #1605) – Sony Semiconductor Solutions announced its participation at the upcoming ITS World Congress, where it will highlight two groundbreaking municipal deployments of its advanced edge AI sensing technologies a road safety initiative in Lakewood, Colorado, and a comprehensive traffic management pilot with the City of San José, California. These real-world e...

28 Sep 2025 | Sunday | NEWS
OpenLight Closes $34M Series A to Accelerate Photonic Chip Innovation for AI-Driven Data Centers

OpenLight, a leader in custom Photonic Application-Specific Integrated Circuit (PASIC) chip design and manufacturing based on heterogeneous integration, today announced the close of its oversubscribed $34MSeries A. The round is co-led by Xora Innovation and Capricorn Investment Group. Other participants include Mayfield; Juniper Networks, now part of HPE; Lam Capital, the corporate venture ...

28 Sep 2025 | Sunday | NEWS
Aion Silicon Joins Intel Foundry’s Value Chain Alliance to Deliver Full-Stack Custom SoC Solutions

Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture partner, announced its membership in the Intel Foundry Accelerator Value Chain Alliance (VCA). As a VCA partner, Aion Silicon expands its existing turnkey service offerings to deliver full-stack custom silicon—from architecture through packaged silicon—across multiple market segments and geographies. This new allia...

28 Sep 2025 | Sunday | NEWS
Socionext Advances 3DIC Innovation with TSMC SoIC-X Tape-Out for AI and HPC Applications

Socionext, the Solution SoC company, announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of complete solutions for consumer, AI, and HPC data center applications that include chiplets, 2.5D, 3D, and 5.5D packaging. Socionext empowers customers with a proven development process and unmatched expertise delivering high-performance, high-quality sol...

28 Sep 2025 | Sunday | NEWS
Acer Unveils Veriton GN100 — Ultra Compact AI Workstation with Server Level Performance

Acer introduced the Veriton GN100 AI Mini Workstation, a compact yet powerful computer designed to run large AI models locally, minimizing dependence on cloud services and helping reduce associated costs. The device is built on the NVIDIA® GB10 Grace Blackwell Superchip, delivering up to 1 PFLOPS of FP4 AI performance. This powerhouse combines next-generation CUDA® cores, fifth-gen Tens...

28 Sep 2025 | Sunday | NEWS
Axcelis Launches GSD Ovation™ ES Ion Implanter for Advanced Engineered Substrate Applications

Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, has announced the launch of the Company's GSD Ovation™ ES high current ion implanter, targeted specifically for engineered substrates.  Executive Vice President Dr. Greg Redinbo, commented, "We're excited to introduce the GSD Ovation ES. The GSD Ovation ES enable...

27 Sep 2025 | Saturday | NEWS
PI Launches Nanopositioning & Micropositioning Essentials Portfolio for Fast, Scalable Precision Motion Solutions

PI (Physik Instrumente), a global leader in precision motion control and nano-positioning technologies, offers its Nanopositioning & Micropositioning Essentials portfolio, delivering core components with reduced lead times and volume discounts tailored for OEMs in research, automation, and advanced manufacturing. This curated Essentials product line features high-precision building blo...

27 Sep 2025 | Saturday | NEWS
Lam Research Debuts VECTOR® TEOS 3D to Power Advanced Chip Packaging for AI and HPC

Lam Research Corp.  unveiled VECTOR® TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence (AI) and high-performance computing (HPC) applications. TEOS 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. It provides ultra-thick, ...

27 Sep 2025 | Saturday | NEWS
DB HiTek Nears Completion of 650V GaN HEMT Process, Launches MPW Program to Accelerate Power Semiconductor Innovation

DB HiTek, a leading 8-inch specialty foundry, announced it is in the final stages of development of its 650V E-Mode GaN HEMT (Gallium Nitride High-Electron Mobility Transistor) process, a next-generation power semiconductor platform. The company is also to offer a dedicated GaN MPW (multi-project wafer) program at the end of October. Compared with traditional silicon-ba...

27 Sep 2025 | Saturday | NEWS
SK hynix Announces World’s First HBM4 Mass Production Readiness to Power Next-Gen AI

SK hynix Inc. (or "the company", www.skhynix.com) announced that it has completed development and finished preparation of HBM4*, a next generation memory product for ultra-high performance AI, mass production for the world's first time. SK hynix said that the company has successfully completed development and based on this technological achievement, the company has prepared HBM4 mass production t...

27 Sep 2025 | Saturday | NEWS
Axera Unveils Global ADAS Solution Powered by M57 SoC at IAA Mobility 2025

Axera, a leading Chinese AI chip developer, made its debut at IAA Mobility this year, globally launching an ADAS solution based on its M57 SoC, aiming to disrupt the worldwide ADAS market landscape. This solution was developed by Axera in collaboration with industry-leading AI visual perception company STRADVISION, and is compatible with the global ADAS market. This is an all-in-one front-view...

27 Sep 2025 | Saturday | NEWS
Lam Research and JSR/Inpria Form Strategic Collaboration to Accelerate Next-Gen Semiconductor Patterning

Lam Research Corp. a global leader in semiconductor fabrication equipment and services, and JSR Corporation, a leading technology company focused on materials innovation solutions and the parent company of Inpria Corporation, a metal oxide photoresist solution provider, today announced that Lam and JSR/Inpria have entered into a non-exclusive cross-licensing and collaboration...

27 Sep 2025 | Saturday | NEWS
LA Semiconductor Engages Macquarie to Lead Sale of Fully Operational Idaho Wafer Fab

LA Semiconductor LLC ("LA Semiconductor" or "the Company"), a US-owned, fully operational pure-play semiconductor foundry for analog, digital and mixed-signal products, announced it has engaged Macquarie Group to oversee the marketing and sale of its wafer fabrication facility with backend capability located in Pocatello, Idaho. Located on a 31-acre campus, the Pocatello, Idaho fab stands as a ...

27 Sep 2025 | Saturday | NEWS
Grinn Partners with MediaTek to Launch World’s Smallest Genio-Based SOMs for Advanced AI and IoT Applications

Grinn, a full-cycle technology company specializing in the design and development of advanced IoT and embedded solutions, has announced the launch of a strategic partnership with MediaTek which will help it to extend the implementation of advanced AI and IoT technologies based on its off-the-shelf embedded computing systems.  The first fruit of the partnership is the creation of a family of ...

27 Sep 2025 | Saturday | NEWS

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