• Wednesday | 23 September 2026
TetraMem and SK hynix Demonstrate Memristor-Based AI Chip for Energy-Efficient In-Memory Computing

TetraMem Inc., a leader in Analog In-Memory Computing (A-IMC) technology, and SK hynix Inc., a global leader in AI memory and semiconductor technologies, announced the successful completion of a joint technology collaboration, highlighted by the publication of their research paper, “A Memristor-based In-Memory Computing SoC with Efficient Depthwise Convolution,” in Advanced I...

9 Jul 2026 | Thursday | NEWS
AOS Launches 80V Half-Bridge MOSFET with AmpStack™ Packaging for AI Data Centres and High-Power Applications

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide-bandgap power devices, power management ICs, and modules, introduced its AOPL66801 80V MOSFET in a half-bridge configuration available in a state-of-the-art DFN6x5 AmpStack™ MOSFET package. This breakthrough packaging technolog...

8 Jul 2026 | Wednesday | NEWS
India to Have Five Operational Semiconductor Manufacturing Plants by End of 2026, Says Ashwini Vaishnaw

India is expected to have five semiconductor manufacturing facilities in operation by the end of 2026, marking a significant step in the country's efforts to establish a strong domestic chip manufacturing ecosystem. Union Minister for Electronics and Information Technology Ashwini Vaishnaw said the government has approved 12 semiconductor projects under its national semiconductor programme. Of th...

7 Jul 2026 | Tuesday | NEWS
Disco Balances Semiconductor Equipment Demand as AI, Advanced Packaging and Power Chip Markets Drive Growth

Japanese semiconductor equipment manufacturer Disco is maintaining a balanced approach to growth as chipmakers adjust investment plans in response to changing market conditions across the global semiconductor industry. The company continues to see steady demand for its ultra-precision dicing, grinding and polishing equipment, which is widely used in wafer processing and advanced semiconductor man...

7 Jul 2026 | Tuesday | NEWS
India Inaugurates CG Semi OSAT Facility in Gujarat, Strengthening Domestic Semiconductor Manufacturing

India has strengthened its position in the global semiconductor landscape with the inauguration of CG Semi's Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat, the country's third semiconductor manufacturing plant. The facility was inaugurated by Prime Minister Narendra Modi as part of India's broader strategy to build a resilient, self-reliant semiconductor ecosystem.T...

6 Jul 2026 | Monday | NEWS
Tema ETFs and SemiAnalysis Partner to Launch Research-Driven Semiconductor and AI Infrastructure ETFs

Tema ETFs (“Tema”), a leader in institutional-quality and actively managed exchange-traded funds, announced an exclusive ETF partnership with SemiAnalysis, the leading independent research firm specialising in semiconductors and AI infrastructure, founded by Dylan Patel. Through the partnership, Tema and SemiAnalysis will launch the first suite of institutional-grade, research-driven ...

1 Jul 2026 | Wednesday | NEWS
DEEPX Brings Ultra-Low-Power AI Acceleration to Raspberry Pi 5 with Sixfab AI HAT+

DEEPX, an on-device AI semiconductor pioneer, announced that its ultra-low-power NPU technology is powering the Sixfab AI HAT+ for Raspberry Pi 5, a new edge AI acceleration board developed by Sixfab, an edge AI hardware solutions company and Official Raspberry Pi Design Partner. Marked as "Intelligentized by DEEPX," the product brings high-performance, low-power AI inference capabilities to the ...

29 Jun 2026 | Monday | NEWS
ChipAgents Joins AWS Partner Network to Expand AI-Driven Semiconductor Engineering Capabilities

ChipAgents, a leading provider of Agentic AI platforms in the semiconductor design industry, announced that it has joined the Amazon Web Services (AWS) Partner Network (APN), a global community of AWS Partners that leverage programs, expertise and resources to build, market and sell customer offerings. “AI has enormous potential in semiconductor engineering, but the industry’s biggest...

26 Jun 2026 | Friday | NEWS
QCi Acquires NHanced to Expand Photonics Manufacturing and Accelerate Commercialisation Strategy

Quantum Computing Inc. ("QCi" or the "Company") (Nasdaq: QUBT), an innovative, quantum optics and integrated photonics technology company, announced the completion of acquiring NHanced Semiconductors, Inc. ("NHanced"), for a combination of cash and QCi stock valued at $73.1 million, subject to customary adjustments, and up to an additional $72.0 million if certain performance target...

26 Jun 2026 | Friday | NEWS
European Semiconductor Firms Prioritise End-to-End Partners as AI and Supply Chain Demands Intensify, ISG Finds

Semiconductor enterprises in Europe are seeking partners that can deliver integrated capabilities across the semiconductor lifecycle as they pursue greater resilience, efficiency and regional alignment, according to a new research report published by Information Services Group (ISG) (Nasdaq: III), a global AI-centred technology research and advisory firm. The 2026 ISG Provider Lens®...

25 Jun 2026 | Thursday | NEWS
UNIST Develops Multifunctional Memristor for Low-Power 6G and Satellite Communications

Researchers at South Korea's Ulsan National Institute of Science and Technology (UNIST) have developed a new semiconductor device designed to reduce power consumption and hardware complexity in next-generation communication systems, including satellite networks, defence applications and future 6G infrastructure. The breakthrough centres on a multifunctional memristor capable of performing both sig...

23 Jun 2026 | Tuesday | NEWS
SurplusGLOBAL Secures Patents for AI-Powered Semiconductor Marketplace Technology

SurplusGLOBAL (CEO: Bruce Kim) announced that it has secured Korean patents covering two core technologies implemented within its global semiconductor equipment and parts marketplace, SemiMarket (www.SemiMarket.com): Demand & Supply Predictive Matching and Global Transaction Risk Management. The significance of these patents lies in their approach to treating export control compliance and tra...

4 Jun 2026 | Thursday | NEWS
Imec and EVG Advance Hybrid Bonding Technology for Next-Generation 3D Chip Architectures

IEEE Electronic Components and Technology Conference (ECTC), imec, a world-leading research and innovation hub in advanced semiconductor technologies, and EV Group (EVG), leading provider of semiconductor manufacturing equipment and process solutions, present a robust and highly yielding wafer-to-wafer hybrid bonding technology at 200nm Cu interconnect pad pitch, demonstrated on a test vehicl...

3 Jun 2026 | Wednesday | NEWS
Cyient Semiconductors Private Limited Launches First GaN Power IC Portfolio for India in Partnership with Navitas Semiconductor

Cyient Semiconductors Private Limited announced the launch of seven new gallium nitride (GaN) power devices for the Indian market, developed using Navitas Semiconductor's (Nasdaq: NVTS) industry-leading GaN technology.   The launch marks Cyient Semiconductors' first commercial GaN product family and a major milestone in advancing India's domestic power semiconductor ecosystem. The new p...

12 May 2026 | Tuesday | NEWS
ROHM Co., Ltd. Launches NFC Wireless Power Chipset for Smart Rings and Compact Wearables

ROHM Co., Ltd. has developed a wireless power supply IC chipset consisting of the receiver (ML7670) and transmitter (ML7671) compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands. The smart ring market has seen rapid growth in recent years. However, for extremely small ring-shaped devices worn on the finger, wired charging is impr...

29 Apr 2026 | Wednesday | NEWS
Kyocera Corporation Launches Ceramic Core Substrate for Next-Generation AI Semiconductor Packaging

Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) announced that it is commercialising a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs(1) and switch ASICs, which are rapidly scaling in complexity as AI data centre architectures evolve. The new product will be unveiled at ECTC 2026, an international conference ...

29 Apr 2026 | Wednesday | NEWS
Bruker Advances NanoIR Technology to Support Next-Gen Semiconductor Research

Bruker Corporation (Nasdaq: BRKR) announced accelerated development of its photothermal AFM-IR spectroscopy capabilities to address research challenges facing the semiconductor industry as device architectures continue to shrink and systems become increasingly more complex. As the largest supplier of nanoscale infrared (nanoIR) spectroscopy technology to the semiconductor industry, Bruker is ...

8 Apr 2026 | Wednesday | NEWS
Cognichip Secures $60m Series A to Advance AI-Driven Chip Design

Cognichip, the company pioneering ACI® – Artificial Chip Intelligence – for semiconductor design, announced an oversubscribed $60 million Series A financing led by Seligman Ventures, with participation from SBI Investment and additional semiconductor-focused investors. All seed investors, including Mayfield, Lux Capital, FPV, and Candou Ventures, participated above pro rata allocat...

6 Apr 2026 | Monday | NEWS
SkyWater Technology Appoints Christine Dunbar to Lead Sales and Drive Foundry Expansion

SkyWater Technology (NASDAQ: SKYT), the largest exclusively U.S.-based pure-play semiconductor foundry, announced the appointment of Christine Dunbar as senior vice president of sales and solutions engineering, reporting directly to President and COO John Sakamoto. In her role, Dunbar will focus on accelerating customer acquisition and scaling growth across the company’s core platforms....

17 Feb 2026 | Tuesday | NEWS
MIPS to Showcase RISC-V Innovation and Physical AI Advances at Chiplet Summit 2026

Chiplet Summit, the industry’s largest chiplet event, today announced that MIPS, a GlobalFoundries company, will participate in Chiplet Summit 2026, February 17-19 at the Santa Clara Convention Center. Drew Barbier, VP Products at MIPS, will deliver a presentation titled “Safety-Critical Physical AI Applications Using RISC-V.” He will also be on the panel “S...

16 Feb 2026 | Monday | NEWS

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