Lightium AG, MPI Corporation, and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices. This strategic collaboration aims to revolutionize the testing and qualification processes of photonic integrated circuit (PIC) devices by uniting state-of-the-art artifi...
Carbice, a leader in next-generation carbon nanotube-based thermal interface materials (TIMs) and high-performance cooling expertise, is bringing its space-proven cooling tech to the desktop. Starting today, PC builders can select the Carbice® Ice Pad as a premium upgrade option when customizing systems from CyberPowerPC. Engineered with vertically aligned carbon nanotubes, the Ice Pad repl...
Lam Research Corp. unveiled VECTOR® TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence (AI) and high-performance computing (HPC) applications. TEOS 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. It provides ultra-thick, ...
Axera, a leading Chinese AI chip developer, made its debut at IAA Mobility this year, globally launching an ADAS solution based on its M57 SoC, aiming to disrupt the worldwide ADAS market landscape. This solution was developed by Axera in collaboration with industry-leading AI visual perception company STRADVISION, and is compatible with the global ADAS market. This is an all-in-one front-view...