• Thursday | 09 October 2025
Semtech Launches Next-Generation 5G AirLink® Routers with Network Slicing for Mission-Critical Public Safety Operations

New Generation of Purpose-Built Routers With 5G Network Slicing Support Enables Dedicated Connectivity Lanes for Mission-Critical First Responder Operations Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today announced the availability of the AirLink® XR80 and XR9...

8 Oct 2025 | Wednesday | NEWS
L&T Technology Services Secures $100 Million Multi-Year Deal to Accelerate AI-Driven Innovation for Semiconductor Equipment Client

-L&T Technology Services Limited , a global leader in AI, Digital & ER&D Consulting Services,  announced a major milestone in its Sustainability segment with the signing of a $100 million multi-year agreement with a US-based industrial equipment manufacturer catering to the semiconductor value chain. Under the terms of the agreement, LTTS will support the clients’ initiat...

2 Oct 2025 | Thursday | NEWS
QuantumScape and Corning Partner to Develop Ceramic Separator Manufacturing for Solid-State Batteries

-QuantumScape Corporation (NYSE: QS), a global leader in next-generation solid-state lithium-metal battery technology, and Corning Incorporated (NYSE:GLW), one of the world’s leading innovators in glass, ceramics, and materials science,  announced an agreement to jointly develop ceramic separator manufacturing capabilities for QS solid-state batteries. The companies will work together...

1 Oct 2025 | Wednesday | NEWS
InPsytech Tapes Out UCIE 2.0-Compliant Design on TSMC's SoIC F2F Technology

InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement in enabling high-speed interconnects for heterogene...

28 Sep 2025 | Sunday | NEWS
SiMa.ai Launches Modalix™ MLSoC to Power Physical AI at the Edge Under 10 Watts

Modalix™, a second-generation Machine Learning System on a Chip (MLSoC™) purpose built to lead the Physical AI industry, delivers industry-leading performance and accuracy without sacrificing power—supporting LLMs, transformers, CNNs, and GenAI workloads under 10 watts. Its flexible, Arm-based architecture with a native GenAI stack enables real-time perception, decision-making,...

28 Sep 2025 | Sunday | NEWS
LG Innotek Unveils Next-Generation Digital Key Solution for Smarter, Safer Vehicle Access

LG Innotek recently held an event to unveil its newly developed 'Next-generation Digital Key Solution' for the first time to the media. The 'Next-generation Digital Key Solution' is a flagship product of LG Innotek's automotive connectivity business, a key pillar of its automotive components business, along with 5G communication modules and automotive AP modules. The digital key is touted as a...

28 Sep 2025 | Sunday | NEWS
Acer Unveils Veriton GN100 — Ultra Compact AI Workstation with Server Level Performance

Acer introduced the Veriton GN100 AI Mini Workstation, a compact yet powerful computer designed to run large AI models locally, minimizing dependence on cloud services and helping reduce associated costs. The device is built on the NVIDIA® GB10 Grace Blackwell Superchip, delivering up to 1 PFLOPS of FP4 AI performance. This powerhouse combines next-generation CUDA® cores, fifth-gen Tens...

28 Sep 2025 | Sunday | NEWS
EV Group Unveils EVG®40 D2W, First Dedicated Die-to-Wafer Overlay Metrology Platform for 300-mm Production

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With...

27 Sep 2025 | Saturday | NEWS
Lam Research and JSR/Inpria Form Strategic Collaboration to Accelerate Next-Gen Semiconductor Patterning

Lam Research Corp. a global leader in semiconductor fabrication equipment and services, and JSR Corporation, a leading technology company focused on materials innovation solutions and the parent company of Inpria Corporation, a metal oxide photoresist solution provider, today announced that Lam and JSR/Inpria have entered into a non-exclusive cross-licensing and collaboration...

27 Sep 2025 | Saturday | NEWS
Qnity Hosts Inaugural Investor Day Ahead of DuPont Separation and Public Debut

Qnity, DuPont Electronics, ("Qnity"), a premier technology solutions leader across the semiconductor value chain, hosted an Investor Day at the New York Stock Exchange. Video recordings of the presentation are now available to view via web replay on Qnity's Investor Relations site: https://ir.qnityelectronics.com/. This was Qnity's inaugural Investor Day, in advance of the intended separation f...

27 Sep 2025 | Saturday | NEWS
LG Innotek Secures $200M Sustainability-Linked Loan from IFC, Marking Milestone in Global ESG Leadership

LG Innotek (CEO Moon Hyuksoo) announced on 24th September the successful acquisition of large-scale funding from the International Finance Corporation (IFC) in recognition of its outstanding performance in ESG (environmental, social, and governance) management. The IFC, a member of the World Bank Group, is an international financial institution that supports private sector investment. LG ...

27 Sep 2025 | Saturday | NEWS

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