Micron Technology has announced plans to invest approximately $24 billion to expand its memory chip manufacturing capacity, signalling strong confidence in sustained demand driven by artificial intelligence and data centre workloads. The announcement pushed Micron’s shares higher, reflecting investor optimism around tightening memory markets and long term growth prospects. The investment ...
India’s Union Budget 2026 places rare earth minerals firmly within the country’s strategic materials and supply chain security agenda. While rare earths do not feature as a standalone headline announcement, their importance is clearly embedded across priorities spanning mining reform, clean energy, electronics manufacturing and advanced industrial development. T...
TSMC’s new Global R&D Center in Taiwan reflects Asia’s drive to maintain cutting-edge chip capabilities on home soil. Semiconductor technology has become not just an industry, but an instrument of national power. Semiconductors in 2025 are not merely about cranking out more chips – they have become closely tied to national sovereignty and strategy. Nowhere is this shift more...
Government of India has approved an expanded set of incentives aimed at accelerating domestic manufacturing of compound semiconductors and advanced packaging, marking a significant step in building strategic depth across critical technology supply chains. The enhanced support framework is designed to attract investment into high value segments such as compound semiconductors, wh...
SK Hynix has reaffirmed its long term commitment to semiconductor manufacturing with an expanded investment plan in the Yongin chip cluster, underlining confidence in the future trajectory of the global semiconductor industry. The move strengthens Yongin’s position as a strategic semiconductor hub, with the expanded footprint expected to support advanced memory production,...
Wizerr AI today introduced the Agentic BOM Engine, powered by Wizerr’s patent-pending component intelligence engine (ELX). ELX reads and interprets complex component datasheets with engineer-level precision and scales that capability to millions of components, turning unstructured documents into AI-transformed, reasoning-ready data for multi-agent workflows across the electronics manufactu...
-Kioxia America, Inc. announced a collaboration between Kioxia Corporation, Tsubakimoto Chain Co. (Tsubakimoto Chain) and EAGLYS Inc. (EAGLYS) to develop AI-driven image recognition technology that automatically identifies products moving through logistics workflows. This system supports advanced automation and efficiency in logistics, enabling organizations to respond quickly to changing...
Micron Technology, Inc., a global leader in memory and storage solutions, today announced plans to invest $9.6 billion in the construction of a new advanced semiconductor fabrication facility in Hiroshima, Japan. The new plant will focus on producing next-generation high-bandwidth memory (HBM) chips designed to power the world’s rapidly expanding artificial intelligence (AI) and high-perfo...
TDK Corporation and Nippon Chemical Industrial Co., Ltd. have announced the signing of an agreement to begin formal discussions toward establishing a joint venture dedicated to next generation electronic component materials. The proposed venture would focus on the co development and manufacturing of ceramic materials for multilayer capacitors as well as other high value materials essential to se...
PowerLattice, the company reimagining power delivery for next-generation AI accelerators, announced its emergence from stealth with $25 million in Series A funding jointly led by Playground Global and Celesta Capital. The company’s breakthrough power delivery chiplet tightly couples power and compute, reducing total compute power needs by more than 50%, effectively doubling performance. Powe...
Hummink is redefining how the world’s smallest technologies are made, using ultra-precise printing to fix microscopic flaws and power the next generation of chips and displays. As microelectronics underpin the rise of artificial intelligence and high-performance computing, the smallest manufacturing imperfections have become billion-euro problems. Each defect at the sub-micron scale...
United Micro integrates Ceva-PentaG Lite 5G platform IP in RedCap SoC, delivering cost–efficient, secure, and scalable connectivity for next–generation vehicles As automakers expand connected vehicle offerings, 5G RedCap is emerging as a cost–efficient complement to traditional 5G, enabling mass–market adoption of vehicle connectivity without compromi...
-Supplyframe and Orbweaver announced a new strategic collaboration that addresses one of the most pressing challenges facing electronics manufacturers and distributors: the need to harmonize and connect critical data across design, sourcing, and commercial systems. Through this partnership, Supplyframe’s Design-to-Source Intelligence (DSI) platform and SaaS solutions including NPI, ...
Growth in 300 mm Shipments Fueled by AI to Support Advanced Logic, Cloud Computing and Memory Applications The SEMI Silicon Manufacturers Group (SMG) reported , in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 3.1% year-on-year to 3,313 million square inches (MSI) from the 3,214 MSI recorded during the same quarter of 2024. Sequent...
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced the RA8M2 and RA8D2 microcontroller (MCU) groups. Based on a 1 GHz Arm® Cortex®-M85 processor with an optional 250 MHz Arm®Cortex®-M33 processor, the new MCUs are the latest Renesas offerings to deliver an unmatched 7300 Coremarks of raw compute performance, the industry...
International Battery Metals Ltd.(“IBAT”) (TSXV: IBAT) & (OTCQB: IBATF), an advanced technology provider of modular direct lithium extraction (DLE) systems, announced a non-brokered private placement financing, marking the second follow-on investment under the Company’s previously announced binding Letter of Intent (“LOI”) with EV Metals 7 LLC (“EV M...
ShunYun Technology Ltd (SYT), a world-class manufacturer of optical transceivers, and NewPhotonics, a leading designer of highly integrated photonic integrated circuit (PIC) chips for data center optical interconnect, today announced a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line. Ethernet pluggable optics are forecasted to scale to >100 million by...
The Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, announces it has taken important steps in enabling silicon diversity for high-performance AI and HPC Clusters with the release of a new Universal D2D Transaction and Link-Layer specification that now also covers UCIe. This universal link layer will be an important part of the e...
PI (Physik Instrumente), a global leader in precision motion and positioning solutions, offers standard and custom air bearing linear slides. Based on decades of experience from PI's USA engineering and manufacturing teams, these air bearings are designed for applications requiring ultra-smooth, zero stick-slip linear motion and sub-micron straightness and flatness. Frictionless Performa...
d-Matrix® announced the expansion of its AI product portfolio with d-Matrix JetStream™, a custom I/O card designed from the ground up to deliver industry-leading, data center–scale AI inference. With millions of people now using AI services – and the rise of agentic AI, reasoning, and multi-modal interactive content – the industry's focus is quickly shifting fro...