• Sunday | 08 November 2026
Memory's Comeback Year: 8 Moves by SK hynix, Samsung and Micron That Shaped 2026

Memory entered 2026 as one of the tightest constraints on the AI hardware market. It is ending the year as one of its biggest profit pools. The third-quarter numbers make the point. SK hynix reported revenue of 104.6 trillion won and operating profit of 83.3 trillion won, a margin of roughly 80%. A day later, Samsung Electronics posted 107.4 trillion won of operating profit, the first time any te...

5 Nov 2026 | Thursday | Feature
Taiwan Chip Industry Backs Nuclear Power Restart Review Amid Rising Electricity Demand

Taiwan's semiconductor industry has renewed its support for examining the restart of nuclear power plants, as growing demand for advanced chips raises concerns about the island's long-term electricity supply. The Taiwan Semiconductor Industry Association (TSIA) confirmed its position at its annual meeting in Hsinchu on 29 October 2026, where its board agreed to back the government's review of nuc...

2 Nov 2026 | Monday | NEWS
KLC Corporation Introduces Thermal Testing Solutions for AI Chips, Advanced Packaging and Electric Vehicles

Taiwan King Lung Chin PTC Co., Ltd. (KLC Corporation), a Taiwan-based thermal management solutions manufacturer, highlighted its Thermal Test Vehicle (TTV) solutions for chip-wafer layout design, planning & verification, AI, and high-performance computing (HPC), alongside high-voltage coolant heaters for electric vehicles (EVs). As AI infrastructure and high-performance computing systems driv...

2 Nov 2026 | Monday | NEWS
Current Sensing As a Critical Safety Technology for AI Data Centers

As data center power levels scale from hundreds of kilowatts to multi-megawatt AI clusters, protecting the systems against electrical faults while maintaining uninterrupted operation has become a strategic priority for data center operators. This raises the requirements against electrical fault protection and for predictive maintenance. Against this background, current sensing is evolving from a m...

2 Nov 2026 | Monday | Feature
TSMC Reportedly Plans 10–20% CoWoS Advanced Packaging Price Increase

Taiwan Semiconductor Manufacturing Company (TSMC) is preparing to raise prices for its chip-on-wafer-on-substrate (CoWoS) advanced packaging service by 10 to 20%, according to a report published by Taiwan's Commercial Times on 27 October 2026. Third-party outsourced assembly and test (OSAT) suppliers are also said to be preparing similar price adjustments. CoWoS integrates AI processors and high-...

28 Oct 2026 | Wednesday | NEWS
How AlpSemi Is Reinventing Power Semiconductors for Solid-State Circuit Breakers

AlpSemi aims to transform this landscape by developing advanced power semiconductor devices specifically designed for solid-state circuit breakers (SSCBs). This approach addresses a key challenge: improving the efficiency, compactness and cost competitiveness of semiconductor-based protection. Founded in 2024 by Frédéric Dupont and Fabrice Letertre, both former executives at Soitec,...

26 Oct 2026 | Monday | Feature
Intelligence per Microjoule: Why the Next Era of AI Will Be Decided at the Edge

For most of the past three years, the semiconductor industry has measured AI progress in one direction. Models have grown larger, clusters have grown denser, and accelerators have been paired with more high-bandwidth memory with each generation. That build-out has been remarkable, and it will continue. As we look toward 2027, though, the constraints shaping our industry are becoming as important a...

23 Oct 2026 | Friday | Feature
The AI Chip Supply Chain in 2026: 10 Pinch Points, Ranked by How Long They Will Last

SEMICON LEADERS ASIA ANALYSIS | OCTOBER 2026 Key takeaways HBM is the most severe shortage of 2026, but not the most durable. Record memory capex should bring meaningful relief by 2028, even if supply does not fully normalise in 2027. Wafers, CoWoS-class packaging and liquid cooling are cyclical constraints. Committed capacity with visible start dates should ease them from the second half of ...

21 Oct 2026 | Wednesday | NEWS
10 Policy and Trade Moves That Redrew the Global Chip Map in 2026

KEY TAKEAWAYS Governments spent 2026 managing flows rather than stopping them: licences with conditions, tariffs with carve-outs, minerals rules backed by enforcement. Industrial policy moved beyond the fab into packaging, materials, equipment, design and talent, from New Delhi to Brussels to Seoul. For buyers, available capacity and accessible capacity are no longer the same thing. Complianc...

14 Oct 2026 | Wednesday | Analysis
AMD Plans AI Chip Capacity Up to Five Years Ahead as Lisa Su Meets TSMC

AMD Chair and CEO Dr Lisa Su has visited Taiwan to meet TSMC and other supply chain partners as the chipmaker prepares for continued growth in artificial intelligence infrastructure. During the visit, Su said AMD's previously announced plan to invest more than US$10 billion in Taiwan's industrial ecosystem remains on track, with further investment expected. The company is increasing supply during...

9 Oct 2026 | Friday | NEWS
The 10 Stories That Defined Semiconductors in 2026 So Far, and What the Market Got Wrong

Semiconductor headlines in 2026 have been unusually large. AI accelerator demand kept climbing. Memory prices surged. Washington rewrote parts of its China chip policy. Beijing's domestic AI hardware push gathered pace. India committed another ₹1,27,500 crore to semiconductors through Semicon 2.0, and Japan kept putting public and private capital behind Rapidus. The market numbers make the exci...

9 Oct 2026 | Friday | Analysis
The Package Is the New Processor: Why Chiplets Are Rewriting Semiconductor Design

For most of the industry’s history, progress meant one thing: pack more functions onto a single piece of silicon. That playbook still works for plenty of products. But at the frontier, in AI accelerators, data-centre processors and high-end networking, it is running into hard limits of physics, yield and cost. The response is a quiet but fundamental change in how chips are conceived. Instead...

2 Oct 2026 | Friday | Analysis
TAITRA Showcases 56 Taiwanese Manufacturers and Advanced Manufacturing Technologies at IMTS 2026

The Taiwan External Trade Development Council (TAITRA) is launching its premier showcase, inviting manufacturing leaders from around the world to IMTS 2026 on September 14 at McCormick Place. Beyond a week on the show floor, Taiwan is bringing 56 of its manufacturers directly through a full schedule of programming, from hands-on sessions to networking events built for real business excha...

15 Sep 2026 | Tuesday | NEWS
Hanmi Semiconductor Expands 2.5D Packaging Equipment Presence in Taiwan

South Korean semiconductor equipment maker Hanmi Semiconductor has secured an important foothold in Taiwan’s advanced packaging market after its 2.5D bonding equipment passed mass-production qualification at a Taiwanese foundry. The company has subsequently begun supplying its packaging bonders to the unnamed customer, marking a significant step in Hanmi’s efforts to expand beyond its ...

8 Sep 2026 | Tuesday | NEWS
SEMI and Silicon Catalyst Partner to Accelerate Global Semiconductor Startup Innovation

SEMI, the global industry association connecting the electronics design and manufacturing supply chain, and Silicon Catalyst, the world's only accelerator focused exclusively on semiconductor innovation, announced a global strategic partnership designed to accelerate innovation and strengthen connections between semiconductor hardware startups, investors, manufacturers, and technology leaders worl...

4 Sep 2026 | Friday | NEWS
SEEQC and Taiwan Strengthen Quantum Computing Supply Chain Collaboration

SEEQC, Inc. (“SEEQC” or the “Company”), a chip-based quantum computing company, announced the signing of a Memorandum of Understanding (“MOU”) with Taiwan’s Quantum Industry Technology Promotion Office to expand cooperation and exchange across quantum technology and the emerging global quantum supply chain. The MOU was signed by SEEQC Chief Technology Off...

4 Sep 2026 | Friday | NEWS
LG Chem Targets AI Semiconductor Growth with Advanced Packaging Materials at SEMICON Taiwan 2026

LG Chem is set to showcase a broad portfolio of advanced packaging and power semiconductor materials for AI applications at SEMICON Taiwan 2026, as the South Korean chemical company seeks to strengthen partnerships with semiconductor manufacturers, OSAT providers and substrate companies. The exhibition will take place from 2–4 September at the Taipei Nangang Exhibition Centre. At the event,...

28 Aug 2026 | Friday | NEWS
E&R Engineering Showcases Laser and Plasma Solutions for AI and Advanced Packaging at SEMICON Taiwan 2026

E&R Engineering Corp. (Taipei Exchange: 8027), a specialist in semiconductor laser and plasma processing equipment, will showcase its latest technologies at SEMICON Taiwan 2026. Highlights will include high-precision laser drilling for Fiber Array Units (FAUs), Glass Core and Through-Glass Via (TGV) processing, Glass Carrier applications, and the PHB-600A laser processing system and R-300...

27 Aug 2026 | Thursday | NEWS
GPPC and AIR WATER Invest in Taiwan Semiconductor Speciality Gas Market

Amid growing demand for advanced semiconductor materials, Grand Pacific Petrochemical Corporation (GPPC) (TWSE: 1312) announced that it has partnered with Japanese industrial gas manufacturer AIR WATER INC. (AWI) to participate in Hong-Kuang Hi-Tech Corp.’s capital increase, a manufacturer of speciality gases for the semiconductor industry. GPPC and AWI will each hold a 35% stake, making the...

26 Aug 2026 | Wednesday | NEWS
AMD Plans $10 Billion Taiwan Investment with TSMC to Expand Advanced Chip Packaging

AMD is committing more than US$10 billion to Taiwan’s semiconductor ecosystem as it prepares for sustained growth in artificial intelligence (AI) and data-centre computing. The investment, which is expected to run through 2029, is aimed at expanding advanced packaging, semiconductor substrates and manufacturing capacity rather than being directed solely towards Taiwan Semiconductor Manufactu...

25 Aug 2026 | Tuesday | NEWS

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