• Sunday | 10 May 2026
TSMC Flags Severe Capacity Gap as AI Workloads Outpace Advanced-Node Supply

Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM), the world’s leading semiconductor foundry, cautioned that its production capacity at advanced process nodes remains significantly below what is required to support the rapid acceleration of global artificial intelligence (AI) workloads. Speaking at a recent industry briefing, TSMC’s Chief Executive Officer stated th...

1 Dec 2025 | Monday | NEWS
GMI Cloud Invests $500 Million in Taiwan’s Flagship AI Data Center, Deploying 7,000 NVIDIA Blackwell GPUs

U.S.-based cloud services provider GMI Cloud revealed plans to build a $500 million AI data center in Taiwan, leveraging the latest NVIDIA Blackwell GB300 chips for unprecedented compute power. This state-of-the-art facility, expected to go live in March 2026, will house around 7,000 GPUs across 96 high-density racks and deliver nearly 2 million tokens per second, all while drawing approximately 1...

18 Nov 2025 | Tuesday | NEWS
FMC Secures €100 Million to Redefine Memory Chip Performance and Energy Efficiency

Oversubscribed financing round consisting of €77 million in Series C equity capital, led by HV Capital and DTCF, and €23 million in public funding, marking one of the largest capital rounds in the European semiconductor sector Fresh capital accelerates the commercialization of FMC DRAM+ and 3D CACHE+ memory chips to enable the global ramp-up of AI data centers and AI edge applications...

14 Nov 2025 | Friday | NEWS
Taiwan Tightens Export Rules on Chips Bound for South Africa

  Taiwan’s Ministry of Economic Affairs has announced new export pre-approval measures for semiconductor products destined for South Africa, adding another layer of scrutiny to global chip supply chains. The move underscores how geopolitical and security considerations are increasingly shaping the flow of critical technologies — even to markets not tradition...

4 Nov 2025 | Tuesday | NEWS
Taiwan’s APEC Envoy Holds Strategic Chip-Talks with US Treasury Under-Secretary Bessent

Taiwan’s representative to the Asia-Pacific Economic Cooperation (APEC) summit held a high-level meeting with US Treasury Under-Secretary for International Affairs, Jay Bessent, to discuss joint approaches to semiconductor policy, trade resilience, and innovation partnerships. The closed-door meeting, lasting approximately 40 minutes, focused on advancing cooperation across the semiconduc...

3 Nov 2025 | Monday | NEWS
ARBOR Technology, Datature, and MemryX Form Strategic Alliance to Advance No-Code Vision AI at the Edge

ARBOR Technology Corp., a global leader in industrial IoT and edge AI computing solutions, together with Datature, an innovator in no-code Vision AI platforms, and MemryX, a pioneer in AI accelerator chips, jointly announce a strategic alliance aimed at accelerating the deployment of intelligent, scalable, and integrated Vision AI solutions. This collaboration brings together complementary exper...

30 Oct 2025 | Thursday | NEWS
UMC Launches 55nm BCD Platform to Power Next-Generation Smart, Efficient Electronics

United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), a leading global semiconductor foundry,  announced the release of its 55nm Bipolar-CMOS-DMOS (BCD) platform, enabling a new level of performance and power efficiency in next-generation mobile devices, consumer electronics, automotive, and industrial applications. Designed to address the growing complexity of pow...

23 Oct 2025 | Thursday | NEWS
Tachyum Opens Taiwan Office to Strengthen Global Production and Supply Chain for Prodigy® Universal Processor

-Tachyum®  announced the opening of new offices in Taiwan, the world’s most advanced technology manufacturing and technological hub, in advance of production of the Prodigy® Universal Processor. As Tachyum continues towards tape-out for Prodigy, the company has chosen to establish manufacturing, testing, assembly, ODM, logistics and support facilities in Taiwan to ensure worl...

22 Oct 2025 | Wednesday | NEWS
Rigaku Establishes Rigaku Technology Taiwan to Strengthen Regional Innovation and Customer Support Across Semiconductors, Materials, and Life Sciences

Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) hereby announces the establishment of Rigaku Technology Taiwan Co., Ltd. (hereinafter “RTTW”), a new group company in Taiwan, in 2025. A facility within RTTW, Rigaku Technology Center Taiwan (hereinafter RTC-TW), began full-scale operation in October 2025. RTTW will assum...

22 Oct 2025 | Wednesday | NEWS
Chip Stocks Race Higher After Taiwan Semiconductor Manufacturing Company (TSMC) Signals Strong AI-Driven Demand

Asian semiconductor equities climbed sharply on Thursday following TSMC’s unexpectedly strong forecast for the year, as the company pointed to robust demand for high-performance chips used in artificial-intelligence infrastructure. TSMC reported a record quarterly profit and raised its full-year revenue outlook, citing major customers ranging from Nvidia and Apple to global d...

20 Oct 2025 | Monday | NEWS
MediaTek and NVIDIA Extend Partnership to Power a New Era of Personal AI Supercomputing

Continues MediaTek's long history of collaboration with NVIDIA to advance AI innovation from supercomputers to vehicles, IoT devices, data center solutions, and beyond  MediaTek has teamed with NVIDIA on the design of the GB10 Grace Blackwell Superchip in NVIDIA DGX Spark, a personal AI supercomputer that allows developers to prototype, fine-tune, and inference large AI models on the ...

16 Oct 2025 | Thursday | NEWS
Insyde Software Joins Arm Total Design to Accelerate AI-Ready Silicon Innovation

Insyde Software, a leading global provider of UEFI and OpenBMC-based firmware,  announced that it has joined Arm® Total Design, a collaborative ecosystem designed to simplify and accelerate custom silicon development powered by Arm Neoverse™ Compute Subsystems (CSS). In close alignment with Arm’s shift-left approach, Insyde empowers AI infrastructure providers to validate c...

15 Oct 2025 | Wednesday | NEWS
Getac Launches S510AD Rugged Copilot+ PC Powered by AMD Ryzen™ AI for Next-Generation Edge Intelligence

The new S510AD joins the B360 Plus, F120 and next generation UX10 in Getac's rapidly growing lineup of Copilot+ PCs. Powered by AMD Ryzen™ AI technology, the S510AD delivers strong on-device AI performance, supporting faster insights and reducing reliance on cloud connectivity where applications allow. The S510AD is ideally suited to professionals working in industries including a...

14 Oct 2025 | Tuesday | NEWS
InPsytech Showcases 3nm UCIe 3.0 Technology at OCP Global Summit 2025

 InPsytech, a subsidiary of Egis Technology (6462.TWO) specializing in high-speed interface intellectual property (IP) development, announced  that it will participate in the Open Compute Project (OCP) Global Summit 2025, to be held in San Jose, California, from October 13–16, 2025. At the event, InPsytech will showcase its latest 3nm UCIe high-speed interface technology dem...

14 Oct 2025 | Tuesday | NEWS
Taiwan Rejects U.S. Proposal for 50-50 Split in Global Chip Production

Taiwan has firmly rejected a proposal from the U.S. Trump administration suggesting a 50-50 split in global semiconductor production. The proposal, reportedly introduced by U.S. Commerce Secretary Howard Lutnick, aimed to balance chip manufacturing between the U.S. and Taiwan. However, Taiwan's Vice Premier Cheng Li-chiun clarified that this specific arrangement was "not discussed" during the re...

6 Oct 2025 | Monday | NEWS
FICG Accelerates AI Factory Connectivity with Advanced Optical Transceiver Packaging

As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing...

28 Sep 2025 | Sunday | NEWS
FICG Accelerates AI Factory Connectivity with Advanced Optical Transceiver Packaging

As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing...

28 Sep 2025 | Sunday | NEWS
Delta Opens Smart Manufacturing Innovation Center in Taiwan, Launches Joint Cyber-Physical Classroom with NVIDIA

Delta, a global leader in power management and smart green solutions, inaugurated in Taiwan its Smart Manufacturing Innovation Center, a strategic hub for equipment validation and talent training programs to support customers implementing geographically-distributed production and smart centralized management. At this one-stop platform site featuring hands-on training as well as production verifi...

28 Sep 2025 | Sunday | NEWS
ALi Corporation and Ceva Join Forces to Deliver AI-Enhanced Smart Edge Devices

As demand accelerates for intelligent, video-centric devices across consumer and industrial markets, ALi Corporation and Ceva, Inc. announced a strategic licensing partnership to integrate Ceva's advanced NeuPro-Nano and NeuPro-M Neural Processing Units (NPUs) into ALi's next-generation Video Display Sub-System (VDSS) platform. This collaboration combines ALi's expertise in multimedia SoCs ...

28 Sep 2025 | Sunday | NEWS
Advanced Packaging Surges Past $50B as E&R Engineering Showcases Next-Gen Solutions at SEMICON Taiwan 2025

As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed USD 50 billion by 2025, with fan-out panel-level packaging (FOPLP) growing more than 15% annually. E&R Engineering (TPE: 8027) will present its latest laser and plasma solutions at SEMICON Taiwan 2025, covering FOPLP, Through-Silicon Via (T...

28 Sep 2025 | Sunday | NEWS

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