Taiwan’s APEC Envoy Holds Strategic Chip-Talks with US Treasury Under-Secretary Bessent
A 40-minute discussion on the sidelines of the Asia-Pacific Economic Cooperation forum centred on semiconductor supply-chain cooperation, technology collaboration, and export-tariff alignment between Taiwan and the United States.
Taiwan’s representative to the Asia-Pacific Economic Cooperation (APEC) summit held a high-level meeting with US Treasury Under-Secretary for International Affairs, Jay Bessent, to discuss joint approaches to semiconductor policy, trade resilience, and innovation partnerships.
The closed-door meeting, lasting approximately 40 minutes, focused on advancing cooperation across the semiconductor value chain—including manufacturing capacity, materials sourcing, and AI-driven design integration. Both sides reaffirmed their shared interest in maintaining the stability of the global chip supply amid continuing export-control tensions and tariff realignments.
A spokesperson from Taiwan’s delegation noted that “continued engagement with the United States is vital to ensuring transparent, secure, and resilient semiconductor supply chains that support both economic growth and technological sovereignty.”
The discussions also touched upon emerging opportunities for bilateral R&D collaboration, climate-aligned chip manufacturing, and financial mechanisms to support semiconductor investments. For Washington, the meeting forms part of broader efforts to coordinate with allies under the CHIPS and Science Act framework, while for Taipei it strengthens international recognition of Taiwan’s strategic role in advanced manufacturing.
Industry Implications
The dialogue highlights the deepening interdependence between US capital policy and Taiwan’s technological leadership, potentially shaping future global trade frameworks and investment incentives. It also signals a growing policy synchronisation aimed at safeguarding chip production from geopolitical shocks and export disruptions.
