• Thursday | 22 October 2026
The AI Chip Supply Chain in 2026: 10 Pinch Points, Ranked by How Long They Will Last

SEMICON LEADERS ASIA ANALYSIS | OCTOBER 2026 Key takeaways HBM is the most severe shortage of 2026, but not the most durable. Record memory capex should bring meaningful relief by 2028, even if supply does not fully normalise in 2027. Wafers, CoWoS-class packaging and liquid cooling are cyclical constraints. Committed capacity with visible start dates should ease them from the second half of ...

21 Oct 2026 | Wednesday | NEWS
10 Policy and Trade Moves That Redrew the Global Chip Map in 2026

KEY TAKEAWAYS Governments spent 2026 managing flows rather than stopping them: licences with conditions, tariffs with carve-outs, minerals rules backed by enforcement. Industrial policy moved beyond the fab into packaging, materials, equipment, design and talent, from New Delhi to Brussels to Seoul. For buyers, available capacity and accessible capacity are no longer the same thing. Complianc...

14 Oct 2026 | Wednesday | Analysis
AMD Plans AI Chip Capacity Up to Five Years Ahead as Lisa Su Meets TSMC

AMD Chair and CEO Dr Lisa Su has visited Taiwan to meet TSMC and other supply chain partners as the chipmaker prepares for continued growth in artificial intelligence infrastructure. During the visit, Su said AMD's previously announced plan to invest more than US$10 billion in Taiwan's industrial ecosystem remains on track, with further investment expected. The company is increasing supply during...

9 Oct 2026 | Friday | NEWS
The 10 Stories That Defined Semiconductors in 2026 So Far, and What the Market Got Wrong

Semiconductor headlines in 2026 have been unusually large. AI accelerator demand kept climbing. Memory prices surged. Washington rewrote parts of its China chip policy. Beijing's domestic AI hardware push gathered pace. India committed another ₹1,27,500 crore to semiconductors through Semicon 2.0, and Japan kept putting public and private capital behind Rapidus. The market numbers make the exci...

9 Oct 2026 | Friday | Analysis
The Package Is the New Processor: Why Chiplets Are Rewriting Semiconductor Design

For most of the industry’s history, progress meant one thing: pack more functions onto a single piece of silicon. That playbook still works for plenty of products. But at the frontier, in AI accelerators, data-centre processors and high-end networking, it is running into hard limits of physics, yield and cost. The response is a quiet but fundamental change in how chips are conceived. Instead...

2 Oct 2026 | Friday | Analysis
TAITRA Showcases 56 Taiwanese Manufacturers and Advanced Manufacturing Technologies at IMTS 2026

The Taiwan External Trade Development Council (TAITRA) is launching its premier showcase, inviting manufacturing leaders from around the world to IMTS 2026 on September 14 at McCormick Place. Beyond a week on the show floor, Taiwan is bringing 56 of its manufacturers directly through a full schedule of programming, from hands-on sessions to networking events built for real business excha...

15 Sep 2026 | Tuesday | NEWS
Hanmi Semiconductor Expands 2.5D Packaging Equipment Presence in Taiwan

South Korean semiconductor equipment maker Hanmi Semiconductor has secured an important foothold in Taiwan’s advanced packaging market after its 2.5D bonding equipment passed mass-production qualification at a Taiwanese foundry. The company has subsequently begun supplying its packaging bonders to the unnamed customer, marking a significant step in Hanmi’s efforts to expand beyond its ...

8 Sep 2026 | Tuesday | NEWS
SEMI and Silicon Catalyst Partner to Accelerate Global Semiconductor Startup Innovation

SEMI, the global industry association connecting the electronics design and manufacturing supply chain, and Silicon Catalyst, the world's only accelerator focused exclusively on semiconductor innovation, announced a global strategic partnership designed to accelerate innovation and strengthen connections between semiconductor hardware startups, investors, manufacturers, and technology leaders worl...

4 Sep 2026 | Friday | NEWS
SEEQC and Taiwan Strengthen Quantum Computing Supply Chain Collaboration

SEEQC, Inc. (“SEEQC” or the “Company”), a chip-based quantum computing company, announced the signing of a Memorandum of Understanding (“MOU”) with Taiwan’s Quantum Industry Technology Promotion Office to expand cooperation and exchange across quantum technology and the emerging global quantum supply chain. The MOU was signed by SEEQC Chief Technology Off...

4 Sep 2026 | Friday | NEWS
LG Chem Targets AI Semiconductor Growth with Advanced Packaging Materials at SEMICON Taiwan 2026

LG Chem is set to showcase a broad portfolio of advanced packaging and power semiconductor materials for AI applications at SEMICON Taiwan 2026, as the South Korean chemical company seeks to strengthen partnerships with semiconductor manufacturers, OSAT providers and substrate companies. The exhibition will take place from 2–4 September at the Taipei Nangang Exhibition Centre. At the event,...

28 Aug 2026 | Friday | NEWS
E&R Engineering Showcases Laser and Plasma Solutions for AI and Advanced Packaging at SEMICON Taiwan 2026

E&R Engineering Corp. (Taipei Exchange: 8027), a specialist in semiconductor laser and plasma processing equipment, will showcase its latest technologies at SEMICON Taiwan 2026. Highlights will include high-precision laser drilling for Fiber Array Units (FAUs), Glass Core and Through-Glass Via (TGV) processing, Glass Carrier applications, and the PHB-600A laser processing system and R-300...

27 Aug 2026 | Thursday | NEWS
GPPC and AIR WATER Invest in Taiwan Semiconductor Speciality Gas Market

Amid growing demand for advanced semiconductor materials, Grand Pacific Petrochemical Corporation (GPPC) (TWSE: 1312) announced that it has partnered with Japanese industrial gas manufacturer AIR WATER INC. (AWI) to participate in Hong-Kuang Hi-Tech Corp.’s capital increase, a manufacturer of speciality gases for the semiconductor industry. GPPC and AWI will each hold a 35% stake, making the...

26 Aug 2026 | Wednesday | NEWS
AMD Plans $10 Billion Taiwan Investment with TSMC to Expand Advanced Chip Packaging

AMD is committing more than US$10 billion to Taiwan’s semiconductor ecosystem as it prepares for sustained growth in artificial intelligence (AI) and data-centre computing. The investment, which is expected to run through 2029, is aimed at expanding advanced packaging, semiconductor substrates and manufacturing capacity rather than being directed solely towards Taiwan Semiconductor Manufactu...

25 Aug 2026 | Tuesday | NEWS
Linde to Invest $1.8 Billion in US and Taiwan to Expand Semiconductor Gas Supply

Linde (Nasdaq: LIN) announced that it has been awarded a new long-term agreement to supply ultra-high-purity industrial gases to one of the world’s largest semiconductor manufacturers. The agreement will support the expansion of the customer’s semiconductor manufacturing complex in Phoenix, Arizona. Linde will invest $1 billion to expand its existing on-site industrial gases complex i...

4 Aug 2026 | Tuesday | NEWS
Air Products Wins Long-Term Taiwan Semiconductor Gas Supply Contract for New AI Chip Fabs

Air Products (NYSE: APD), a world-leading industrial gases company, announced Air Products San Fu has been awarded a long-term agreement to support a semiconductor manufacturer's expansion in Taiwan. The project will supply multiple new semiconductor fabs and back-end packaging facilities, supporting growing demand driven by artificial intelligence and high-performance computing. Air Product...

22 Jul 2026 | Wednesday | NEWS
UMC Begins Mass Production of Silicon Photonics Wafers in Singapore for AI Data Centres and Optical Networking

United Microelectronics Corporation (UMC) has started commercial production of silicon photonics wafers at its 300 mm manufacturing facility in Singapore, strengthening its capabilities in optical semiconductor technologies as demand for artificial intelligence (AI) infrastructure and high-speed data communications continues to rise. The milestone follows a joint development programme with Singap...

17 Jul 2026 | Friday | NEWS
ACCM Launches Celeritas SMC Silicon-Matched Core for AI Chiplet Packaging and Advanced IC Substrates

Advanced Chip and Circuit Materials (ACCM) introduced Celeritas SMC (Silicon-Matched Core), a production-ready core for advanced IC substrates engineered to match the in-plane coefficient of thermal expansion of silicon while running on established organic-substrate manufacturing lines. Available now from ACCM's Wisconsin facility, the material is designed for large-body chiplet packages, embedded...

8 Jul 2026 | Wednesday | NEWS
PSMC Strengthens Mature-Node Semiconductor Foundry Strategy for Automotive, Industrial and Power Management Chips

Powerchip Semiconductor Manufacturing Corp. (PSMC) is sharpening its foundry strategy to meet growing demand for mature-node semiconductor manufacturing. The Taiwanese chipmaker is concentrating on customers that require reliable and cost-effective production for applications including automotive electronics, industrial automation, power management and consumer devices. Having gradually transitio...

6 Jul 2026 | Monday | NEWS
Gujarat to Establish ₹190 Crore Semiconductor Research and Training Hub at IIT Gandhinagar

Gujarat is set to establish the Silicon and Advanced Semiconductor Manufacturing Research and Training Hub (SAMARTH) at the Indian Institute of Technology (IIT) Gandhinagar. The ₹190 crore initiative is being jointly supported by the Ministry of Electronics and Information Technology (MeitY), the Gujarat Department of Science and Technology, and IIT Gandhinagar. The centre is intended to advanc...

6 Jul 2026 | Monday | NEWS
Xinliang (XL) Wang of pSemi on Advancing RF Connectivity for Next-Generation Wireless, Satellite, and Test Systems

In this interview with Semicon Leaders Asia, Xinliang (XL) Wang, Senior Director, Product Portfolio Management at pSemi, explains how pSemi is expanding its RF technology portfolio to support increasingly complex wireless and connectivity ecosystems. Through close collaboration with OEMs, system integrators, and test equipment manufacturers, the company is leveraging its UltraCMO...

19 Jun 2026 | Friday | Interaction

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