SiTime Corporation (NASDAQ: SITM), the Precision Timing company, announced the Elite 2 Super-TCXO® to increase GPU utilisation and compute efficiency in AI data centres by delivering better time synchronisation. The product targets a $1.5 billion cumulative market by 2030. “Industry reports show GPU utilisation in AI clusters can be as low as 20 to 40 per cent—a lar...
MintNeuro, a pioneer of scalable, low-power semiconductor technology for neural implant applications, and Motif Neurotech, a therapeutic brain-computer interface (BCI) company developing miniature implants for mental health, announced a new strategic partnership that will unite MintNeuro's specialised neural interface chip technology with Motif's clinical-stage therapeutic implant platform &n...
Global technology corporation FPT and Shinhan Bank Co., Ltd. (Korea) (“Shinhan Bank”) recently signed a memorandum of understanding (MoU) to expand cooperation in digital finance, startup ecosystems, and strategic technologies, with AI as a key enabler to unlock new opportunities across innovation ecosystems in Vietnam and South Korea. The MOU exchange ceremony took place during the V...
POLYN Technology, a leader in neuromorphic technology with application-specific Neuromorphic Analog Signal Processing (NASP) products, has taped out a VibroSense™ engineering chip featuring an analog neuromorphic core for tire friction monitoring. This is POLYN’s first chip, developed in cooperation with GlobalFoundries, using more advanced nodes for this and the next generation of pr...
Expanded collaboration combines agentic AI, physics-based simulation, and digital twins to accelerate engineering and unlock new levels of productivity across semiconductors, physical AI systems and AI factories At CadenceLIVE Silicon Valley 2026, Cadence (Nasdaq: CDNS) announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based ...
Optikos® Corporation, a provider of engineering, manufacturing, and metrology expertise in optical systems, is joining forces with Artemis, a Boston-based private equity firm focused on scaling high-impact industrial tech. Through this acquisition, Artemis will provide the strategic support necessary to supercharge the engineering and manufacturing capabilities of Optikos. Through th...
FPT and Intel, a global leader in semiconductor and AI technologies, announced a strategic relationship to deliver an end-to-end AI-driven factory optimisation solution. Powered by AI, simulation, and digital manufacturing technologies, the collaboration aims to reduce bottlenecks, accelerate decision-making and improve downtime recovery, facilitating the sector’s transition towards AI-drive...
Everspin Technologies Inc., (NASDAQ: MRAM), the world’s leading developer and manufacturer of persistent Magnetoresistive Random Access Memory (MRAM) solutions, announced its strategic manufacturing agreement with Microchip Technology to expand production capacity and strengthen long-term supply. Everspin has entered into an initial 10-year agreement, that can be extended in 2-year incremen...
As the United States races to secure its semiconductor future, Last Mile Education Fund announces that the AMD Foundation has joined its Semiconductor Pathways Fund with a $500,000 philanthropic investment over the next three years. The Semiconductor Pathways Fund is a national industry coalition ensuring that the engineers and technicians already enrolled in STEM programs...
Peridio, creator of Avocado OS, announced its admission into the NXP® Semiconductors Partner Program as a Registered Partner. The partnership formalizes a deepening collaboration between both companies and underscores Peridio's growing role as critical infrastructure for teams building physical AI products on NXP's i.MX applications processors and Ara discrete neural processing units...
Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced general availability of its 7-15GHz Daybreak™ beamforming ICs for emerging 5G/6G FR3 applications as well as multi-function defence arrays. FR3 frequencies are the next frontier for 5G-Advanced and 6G network deployments, combining the benefits of superior propagation ...
GS Microelectronics U.S., Inc. (GSME) announced a strategic partnership with Tarana Wireless, Inc. to support RF transceiver products and accelerate the future roadmap of wireless technologies. The deal strengthens the long-standing partnership between GSME and Tarana, enhancing the overall market value by providing dedicated RF-Analogue engineering support for Tarana's products. The team will sup...
Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, clarifies the background to the reduction in Kairos Ventures' holdings of Sivers Semiconductors shares as disclosed through the notification to the insider register on March 25, 2026. The reduction is related to periodic fund level rebalancing and payment of fund expenses at Kairos. "Both Kairos and...
Normal Computing announced $50 million in strategic funding led by Samsung Catalyst Fund, bringing total funding to more than $85 million. New investors also include Galvanise, Brevan Howard Macro Venture Fund, and ArcTern Ventures, alongside existing investors Celesta Capital, Drive Capital, Eric Schmidt's First Spark Ventures, and Micron Ventures. Normal was founded to tackle two converging cr...
Acquisition accelerates Ecolab’s sales growth by significantly expanding its Global High-Tech growth engine, creating an end-to-end fluid management and cooling platform for AI data centers Ecolab announced today that it has entered into a definitive agreement to acquire CoolIT Systems, a high-growth, high-margin leader in liquid cooling technology for next-gen AI data cen...
Advanced Micro Devices has expanded its strategic collaboration with Samsung Electronics, reinforcing supply chain alignment for next-generation AI and data centre technologies. The agreement focuses on securing advanced memory solutions while also exploring potential manufacturing partnerships. Under the arrangement, Samsung is expected to supply its latest high-bandwidth memory (HBM4) for AMD&r...
APEC 2026 — In booth 2218, SimpleChips Technology Inc., a global provider of analogue and mixed-signal application-specific integrated circuits (ASICs) for automotive, medical, industrial and aerospace applications, announced the availability of the 18SCT005, the industry’s first 1200V high-voltage monitor IC. With a superior output accuracy of 0.7%, this monolithic IC is ide...
Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced a collaboration with NVIDIA to accelerate AI-driven innovation using open NVIDIA Nemotron 3 Nano, ALCHEMI BMD NIM, LAMMPS Kokkos, and CUDA-X accelerated Abaqus for modeling and simulation technologies. The collaboration is focused on advancing materials res...
At Embedded World 2026, branded semiconductor memory enterprise Longsys (301308.SZ) demonstrated its integrated storage innovation capabilities and dual business-model value under the theme "AI Storage for Embedded World". Automotive-grade Portfolio Powers Intelligent Vehicles With seven years of expertise in automotive-grade storage, Longsys has built comprehensive capabilities across chi...
Siemens announced the Fuse™ EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed circuit board (PCB) system workflows that span across design, verification and manufacturing sign-off. Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the Fuse...