Advanced Micro Devices has expanded its strategic collaboration with Samsung Electronics, reinforcing supply chain alignment for next-generation AI and data centre technologies. The agreement focuses on securing advanced memory solutions while also exploring potential manufacturing partnerships. Under the arrangement, Samsung is expected to supply its latest high-bandwidth memory (HBM4) for AMD&r...
Siemens announced the Fuse™ EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed circuit board (PCB) system workflows that span across design, verification and manufacturing sign-off. Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the Fuse...
Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, announced that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade. “As AI workloads continue to increase package size, power density, and integration complexity, ...
HyperLight Corporation (“HyperLight”), United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, announced a strategic manufacturing partnership for high-volume foundry production of HyperLight’s TFLN (thin-film lithium niobate) Chiplet™ Platform on both...
Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, announces it is once again a Platinum sponsor of the Create the Future Design Contest. Create the Future is a global challenge for engineers and innovators to design the next great thing, with a chance to win the grand prize. Mouser, which has sponsored the contest for over a decade, is joined ag...
Synopsys, Inc. (NASDAQ: SNPS) launched the Synopsys Electronics Digital Twin (eDT) Platform, a first-of-its-kind, open solution to accelerate the creation, management, deployment, and use of electronics digital twins (eDTs) critical for today's software-defined product development, enabling physical AI systems. Initially focused on high-value automotive use cases, the eDT Platform enables OEM...
Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, announced the UNISYST MRAM family, a new generation of unified memory designed to fundamentally change how embedded systems store and access code and data. “System designers are running into the physical and p...
GigaDevice (HKEX: 3986), a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analogue products, announced the expanded density range of its GD25UF series 1.2V ultra-low power SPI NOR Flash, now spanning from 8Mb to 256Mb. This expansion precisely addresses diverse storage needs across a wide range of applications,...
Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a partnership with Digital Barriers to deliver a fully integrated device-to-cloud cellular video solution, Semtech Video Compression, purpose-built for critical video surveillance and analytics. The turnkey solution int...
LG Uplus has entered into a partnership with AI semiconductor firm FuriosaAI to jointly develop an enterprise-focused “sovereign AI appliance” designed for secure, on-premises deployment. The companies signed a memorandum of understanding for AI infrastructure cooperation during Mobile World Congress 2026 in Barcelona. The agreement was attended by LG Uplus Chief Technology Officer Le...
Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, unveils its new entry-level, ultra-low-power Bluetooth® Low Energy (LE) Systems-on-Chip (SoCs) – the nRF54LS05A and nRF54LS05B. Both can serve as the main wireless SoC in single-chip systems, or operate as Bluetooth LE companion devices in multi-chip systems, benefiting from Nordic's market-leading B...
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, announced its participation at Embedded World 2026 (Hall 5, Booth 5-129), with the strong presence at the show demonstrating the company’s commitment to the global market and the strategic emphasis that it has placed on the EMEA region, r...
Wolfspeed, Inc., a global leader in silicon carbide (SiC) technology, announced the industry's first commercially available 10 kV SiC power MOSFET. This milestone marks a defining moment in the industry — unlocking architectural freedom, delivering unprecedented system durability, and advancing access to reliable and sustainable power for the world's most demanding applications. This groundb...
Qualinx, the European semiconductor company redefining ultra-low-power connectivity, announced plans to showcase its market-ready 1 mW QLX3Gx Series GNSS chip with its dynamic reconfigurable architecture, along with a Developer Evaluation Kit (EVK), at Embedded World 2026 from 10-12 March in Nuremberg. The QLX3Gx EVK enables OEMs to directly validate Qualinx’s power-to-performance ...
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, proudly announces that Jaime Plank, Supplier Management Director, was named 2025 Strategic Partner of the Year by ODU, a valued partner and leading manufacturer of connectivity solutions. Additionally, April Kilman, Supplier Specialist, was named ODU's Supplier Manager of the ...
BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world leader in ultra-low power, fully digital, event-based neuromorphic AI, announced that Nex Novus d.o.o., Neuromorphyx™, has selected the Akida™ AKD1500 co-processor for evaluation and integration in its Vision NeuroNode™ edge-AI device. This strategic engagement and partnership agreement expands BrainChip&rsqu...
Qnity Electronics, Inc. (“Qnity”) (NYSE: Q) announced the acquisition of a new facility in Taiwan to accelerate capacity and support continued customer demand across the global semiconductor industry. The $61.5 million advanced semiconductor research and manufacturing facility marks a significant investment in Qnity’s growth to keep pace with customer demand. The new facility wi...
Ambiq Micro, Inc. ("Ambiq®"), a leader in ultra-low-power semiconductor solutions for edge AI, revealed new technical details of its upcoming Atomiq™ SoC. Built on Ambiq's newly designed 12nm SPOT® platform using the TSMC N12e® process, Atomiq introduces a new Ultra-Low-Power (ULP) mode engineered to operate as low as 300mV— the lowest operating voltage in Ambiq's history. ...
As the global electronics manufacturing sector faces the dual challenges of capacity volatility and geoeconomic supply fragmentation, YY-IC, a leading digital ecosystem for electronic component procurement and risk management, announced the formal integration of the ISO 9001 Quality Management System into its global operations. According to YY-IC Supply Chain Intelligence Data...
Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, announces a major expansion of its ultra-low-power cellular IoT products and technologies designed to deliver secure, global connectivity as networks and satellite NTN evolve. "Nordic is building the next era of cellular IoT, and we are expanding our portfolio to ...