• Sunday | 10 May 2026
AOS Launches SmartClamp DrMOS for AI Power Demands

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, announced the launch of the SmartClamp™ family of protected DrMOS. Designed specifically for the extreme power demands of AI servers, data centers, and high-end graphics...

1 May 2026 | Friday | NEWS
Faraday Expands 28nm IP Portfolio to Accelerate Endpoint AI and AIoT SoC Development

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider,  announced its IP solutions on UMC’s 28nm platform with SST-ESF4 eNVM, designed to enable next-generation MCU and AIoT SoCs targeting endpoint AI applications. The comprehensive IP solution integrates SST eFlash controller and BIST, together with silicon-proven analogue and high-speed interface P...

15 Apr 2026 | Wednesday | NEWS
Bruker Advances NanoIR Technology to Support Next-Gen Semiconductor Research

Bruker Corporation (Nasdaq: BRKR) announced accelerated development of its photothermal AFM-IR spectroscopy capabilities to address research challenges facing the semiconductor industry as device architectures continue to shrink and systems become increasingly more complex. As the largest supplier of nanoscale infrared (nanoIR) spectroscopy technology to the semiconductor industry, Bruker is ...

8 Apr 2026 | Wednesday | NEWS
OMNIVISION and ATL Medical Partner to Advance Arthroscopy Imaging

OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analogue, and display solutions, and ATL Medical, Inc., a designer, developer and manufacturer of innovative medical devices, today announced that ATL is using the OVMed® OH0131 image signal processor (ISP) in its PREVOYANCE® Complete Imaging System with Chip-on-Tip® t...

7 Apr 2026 | Tuesday | NEWS
Parade Technologies Launches DP 2.1a MST Hub for Automotive and Display Expansion

Parade Technologies, Ltd. (Taiwan OTC: 4966.TWO), a leading high-speed interface, video display, and touch controller IC supplier, announces the availability of PS8651V DP 2.1a/HBR3 1:2 MST hub controller for automotive, accessories and video display designs that need DP/eDP port expansion. It adds to Parade’s DP MST Hub solutions, which include the PS8650 DP 2.1a/UHBR20 1:4 MST hub controll...

6 Apr 2026 | Monday | NEWS
Cognichip Secures $60m Series A to Advance AI-Driven Chip Design

Cognichip, the company pioneering ACI® – Artificial Chip Intelligence – for semiconductor design, announced an oversubscribed $60 million Series A financing led by Seligman Ventures, with participation from SBI Investment and additional semiconductor-focused investors. All seed investors, including Mayfield, Lux Capital, FPV, and Candou Ventures, participated above pro rata allocat...

6 Apr 2026 | Monday | NEWS
OMNIVISION and ATL Medical Partner to Accelerate Medical Imaging Solutions

OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analog, and display solutions, and ATL Medical, Inc., a designer, developer and manufacturer of innovative medical devices, announced that ATL is using the OVMed® OH0131 image signal processor (ISP) in its PREVOYANCE® Complete Imaging System with Chip-on-Tip® technolog...

2 Apr 2026 | Thursday | NEWS
Advanced Micro Devices Expands Strategic Collaboration with Samsung Electronics for AI Infrastructure

Advanced Micro Devices has expanded its strategic collaboration with Samsung Electronics, reinforcing supply chain alignment for next-generation AI and data centre technologies. The agreement focuses on securing advanced memory solutions while also exploring potential manufacturing partnerships. Under the arrangement, Samsung is expected to supply its latest high-bandwidth memory (HBM4) for AMD&r...

24 Mar 2026 | Tuesday | NEWS
Siemens Launches Autonomous Artificial Intelligence Agent for Semiconductor Design Automation

Siemens announced the Fuse™ EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed circuit board (PCB) system workflows that span across design, verification and manufacturing sign-off. Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the Fuse...

19 Mar 2026 | Thursday | NEWS
Wolfspeed, Inc. Positions 300 MM Silicon Carbide Platform for Artificial Intelligence and High Performance Computing

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, announced that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade. “As AI workloads continue to increase package size, power density, and integration complexity, ...

18 Mar 2026 | Wednesday | NEWS
HyperLight Corporation, United Microelectronics Corporation Partner on TFLN Photonics Foundry Production

HyperLight Corporation (“HyperLight”), United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, announced a strategic manufacturing partnership for high-volume foundry production of HyperLight’s TFLN (thin-film lithium niobate) Chiplet™ Platform on both...

16 Mar 2026 | Monday | NEWS
Mouser Electronics Returns as Platinum Sponsor of Create the Future Design Contest

Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, announces it is once again a Platinum sponsor of the Create the Future Design Contest. Create the Future is a global challenge for engineers and innovators to design the next great thing, with a chance to win the grand prize. Mouser, which has sponsored the contest for over a decade, is joined ag...

16 Mar 2026 | Monday | NEWS
Synopsys Launches Electronics Digital Twin Platform for Automotive Development

Synopsys, Inc. (NASDAQ: SNPS) launched the Synopsys Electronics Digital Twin (eDT) Platform, a first-of-its-kind, open solution to accelerate the creation, management, deployment, and use of electronics digital twins (eDTs) critical for today's software-defined product development, enabling physical AI systems. Initially focused on high-value automotive use cases, the eDT Platform enables OEM...

11 Mar 2026 | Wednesday | NEWS
Everspin Technologies Launches UNISYST MRAM Unified Memory Platform

Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, announced the UNISYST MRAM family, a new generation of unified memory designed to fundamentally change how embedded systems store and access code and data. “System designers are running into the physical and p...

11 Mar 2026 | Wednesday | NEWS
GigaDevice Expands Ultra-Low-Power SPI NOR Flash Portfolio

GigaDevice (HKEX: 3986), a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analogue products, announced the expanded density range of its GD25UF series 1.2V ultra-low power SPI NOR Flash, now spanning from 8Mb to 256Mb. This expansion precisely addresses diverse storage needs across a wide range of applications,...

11 Mar 2026 | Wednesday | NEWS
Semtech Corporation, Digital Barriers Partner on AI Video Compression for Cellular Surveillance

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a partnership with Digital Barriers to deliver a fully integrated device-to-cloud cellular video solution, Semtech Video Compression, purpose-built for critical video surveillance and analytics. The turnkey solution int...

11 Mar 2026 | Wednesday | NEWS
LG Uplus Partners with FuriosaAI to Develop Semiconductor-Powered Sovereign AI Appliance

LG Uplus has entered into a partnership with AI semiconductor firm FuriosaAI to jointly develop an enterprise-focused “sovereign AI appliance” designed for secure, on-premises deployment. The companies signed a memorandum of understanding for AI infrastructure cooperation during Mobile World Congress 2026 in Barcelona. The agreement was attended by LG Uplus Chief Technology Officer Le...

10 Mar 2026 | Tuesday | NEWS
Nordic Semiconductor Launches Entry-Level Bluetooth LE SoCs for Cost-Efficient Wireless Devices

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, unveils its new entry-level, ultra-low-power Bluetooth® Low Energy (LE) Systems-on-Chip (SoCs) – the nRF54LS05A and nRF54LS05B. Both can serve as the main wireless SoC in single-chip systems, or operate as Bluetooth LE companion devices in multi-chip systems, benefiting from Nordic's market-leading B...

10 Mar 2026 | Tuesday | NEWS
GigaDevice Showcases Advanced Embedded Solutions at Embedded World 2026

GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, announced its participation at Embedded World 2026 (Hall 5, Booth 5-129), with the strong presence at the show demonstrating the company’s commitment to the global market and the strategic emphasis that it has placed on the EMEA region, r...

10 Mar 2026 | Tuesday | NEWS
Wolfspeed Launches Industry’s First Commercial 10 kV Silicon Carbide MOSFET

Wolfspeed, Inc., a global leader in silicon carbide (SiC) technology, announced the industry's first commercially available 10 kV SiC power MOSFET. This milestone marks a defining moment in the industry — unlocking architectural freedom, delivering unprecedented system durability, and advancing access to reliable and sustainable power for the world's most demanding applications. This groundb...

9 Mar 2026 | Monday | NEWS

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