AP Memory Advances S-SiCap™ Silicon Capacitor Portfolio for AI Servers and HPC Systems

AP Memory, a leading global design company providing customized memory solutions, today announced further advancements in its S-SiCapTM (Stack Silicon Capacitor) product line to address the increasing integration demands of AI servers and high-performance computing (HPC) systems. The S-SiCapTM portfolio includes two product categories —discrete silicon capacitors and interposers with silicon...

19 Dec 2025 | Friday | NEWS
Meridian Innovation Launches Cheetah™ 50×50 LWIR Thermal Imaging Sensor for Mass-Market Adoption

Meridian Innovation, a global leader in CMOS-based thermal imaging solutions, is excited to announce the launch of Cheetah, a breakthrough 50×50 LWIR thermal imaging sensor engineered to deliver a new level of performance, compactness, and affordability for mass-market applications. Built on Meridian's proven SenXor® technology platform, Cheetah offers unrivalled price-performance, enab...

19 Dec 2025 | Friday | NEWS
SK Hynix Validates Industry-First 256GB DDR5 RDIMM with Intel Xeon 6 Platform

SK hynix 32Gb 1b die-based 256GB server DDR5 RDIMM completes compatibility validation with Intel Xeon 6 platform- Demonstrates world-leading expertise in high-capacity DDR5 module technology- SK hynix to proactively enhance customer satisfaction as a "Full-stack AI memory creator" SK hynix Inc. announced that it has become the first in the industry to complete the Intel Data Center Certified...

19 Dec 2025 | Friday | NEWS
AKM and Aizip Partner to Advance AI-Enhanced Sensing for Digital Health and Wearables

-Asahi Kasei Microdevices (AKM) and Aizip have partnered to showcase two innovations in AI-enhanced sensing: real-time swallowing detection using millimeter-wave radar and gesture recognition utilizing electromyography (EMG). This collaboration pairs AKM’s sensing hardware with Aizip’s lightweight artificial intelligence (AI) models to provide manufacturers with solutions that don&rs...

18 Dec 2025 | Thursday | NEWS
Keysight Unveils Secure AI Chat and Copilot Assistants to Transform EDA Workflows in ADS

Keysight Technologies, Inc. announced AI-powered Chat and Copilot assistants for its Advanced Design System (ADS), delivering breakthrough natural language capabilities that accelerate design workflows while maintaining enterprise-grade security. Electronic design teams face mounting challenges: complex multi-domain workflows, fragmented data management, and relentless pressure to accelera...

18 Dec 2025 | Thursday | NEWS
Xsight’s X2 Switch Selected as Networking Core for Starlink V3 Satellites

High-bandwidth, ultra-low-power chip is leveraged for Starlink V3 satellites and future next-generation communication systems. News Highlights: Xsight’s X2 switch enables Starlink V3 satellite Delivers the performance required for rapid data processing, stable telemetry, and real-time operational responsiveness for Starlink X2’s flexible, programmable architecture adapts seam...

15 Dec 2025 | Monday | NEWS
Kioxia Unveils Highly Stackable Oxide-Semiconductor Transistors to Advance 3D DRAM

-Kioxia Corporation, a world leader in memory solutions,  announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of high-density, low-power 3D DRAM. This technology was presented at the IEEE International Electron Devices Meeting (IEDM) held in San Francisco, USA, on December 10, and has the potential to reduce pow...

15 Dec 2025 | Monday | NEWS
SEMIFIVE Secures Multiple AI Chip Design Wins in Japan, Establishes Tokyo Subsidiary

  - Demonstrates end-to-end expertise in high-performance custom chip design for AI and HPC- Establishes a subsidiary in Japan to strengthen global reach SEMIFIVE, a global leader in custom AI semiconductor (ASIC) design preparing for its KOSDAQ listing, announced that it has secured multiple AI semiconductor design projects in Japan and recently established its subsidiary in Tokyo, Japan. ...

15 Dec 2025 | Monday | NEWS
BrainChip Secures $25M to Advance Akida Neuromorphic AI Platform and Scale Product Portfolio

-BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low-power, fully digital, event-based neuromorphic AI, secured a capital raise of $25 million to fuel the development and commercialization of its neuromorphic AI technology and expansion of its product offerings in chips and modules. BrainChip is expanding its product portfolio t...

12 Dec 2025 | Friday | NEWS
Quilter Breaks Hardware Barriers With World’s First AI-Designed Computer

Quilter, the physics-driven AI for electronics design,  announced the world’s first computer designed by artificial intelligence. A single engineer completed the layout taking a schematic to manufacturing-ready files in less than a week, a process that traditionally takes an entire engineering team months and requires multiple rounds of redesign. This initiative, called Project Speedr...

12 Dec 2025 | Friday | NEWS
Virtusa Acquires SmartSoC to Accelerate AI-Driven Chip Design Innovation

Strategic acquisition positions Virtusa at the forefront of AI and chip design innovation to meet surging demand for advanced silicon Virtusa Corporation, a global product and platform engineering services company, announced the strategic acquisition of SmartSoC Solutions (SmartSoC), a leader in semiconductor engineering and integrated circuit (IC) design services. This acquisition marks a pivo...

11 Dec 2025 | Thursday | NEWS
VisIC Technologies Raises $26M to Accelerate GaN Power Innovations for Next-Generation EV Platforms

VisIC Technologies Ltd., a pioneer in Gallium Nitride (GaN) power semiconductors for electric mobility,  announced the successful second closing of its Round B funding, securing $26 million. The round was led by a global semiconductor leader, with HKMC joining as a strategic investor. This milestone reinforces VisIC's position at the forefront of GaN innovation for EV traction inverters and...

11 Dec 2025 | Thursday | NEWS
Dai Nippon Printing unveils 10nm NIL template for 1.4nm generation logic semiconductors

-Dai Nippon Printing Co., Ltd. announced the development of a nanoimprint lithography (NIL) template featuring a circuit line width of 10 nanometers (nm: 10-9 meter). The new template enables patterning for logic semiconductors equivalent to the 1.4nm generation and meets the miniaturization needs of cutting-edge logic semiconductors. Background and Aims In line with the shift to more sophisti...

10 Dec 2025 | Wednesday | NEWS
SoftBank Arm To Establish Chip Design Training Centre In South Korea

Arm Holdings, the global chip design powerhouse owned by SoftBank Group, has announced plans to establish a dedicated chip design training facility in South Korea under an agreement with the country national industry ministry. The new centre will focus on developing advanced semiconductor design capabilities by training around 1400 specialist engineers. The initiative is aligned wit...

9 Dec 2025 | Tuesday | NEWS
Linear Integrated Systems Launches LSBF862 to Replace and Outperform Discontinued NXP BF862

Linear Integrated Systems, Inc., a designer and manufacturer of precision discrete semiconductors, announces the release of the LSBF862, a low noise N-channel JFET engineered to replace and outperform the discontinued NXP BF862. When NXP discontinued the BF862, a popular low-noise N-channel JFET, customers faced lost support for legacy systems, the need to requalify new components, and unplan...

8 Dec 2025 | Monday | NEWS
Wizerr AI Launches Agentic BOM Engine Powered by Its Patent-Pending Component Intelligence Engine ELX

Wizerr AI today introduced the Agentic BOM Engine, powered by Wizerr’s patent-pending component intelligence engine (ELX). ELX reads and interprets complex component datasheets with engineer-level precision and scales that capability to millions of components, turning unstructured documents into AI-transformed, reasoning-ready data for multi-agent workflows across the electronics manufactu...

5 Dec 2025 | Friday | NEWS
Vinci Emerges From Stealth With $46M Funding to Launch Physics-Driven AI Platform Delivering 1,000× Faster Hardware Simulations

-Vinci, the pioneer of Physics-Driven AI for hardware design and simulation, emerged from stealth today and announced $46M in total funding, with its Series A led by Xora Innovation and its Seed round led by Eclipse. The company has unveiled a physics-driven AI system that operates like a team of hardware engineers, running thousands of verified simulations in hours, not weeks. Vinci was founde...

4 Dec 2025 | Thursday | NEWS
Mitsubishi Electric Launches New 4.5kV/1,200A HVIGBT Modules With Enhanced Isolation and Moisture Resistance

For highly efficient, reliable inverter systems in railcars and large industrial equipment Mitsubishi Electric Corporation (TOKYO: 6503) announced that it will launch new standard-isolation (6.0kVrms) and high-isolation (10.2kVrms) modules in its 4.5kV/1,200A XB Series of high-voltage insulated-gate bipolar transistors (HVIGBTs) on December 9. These new high-capacity power semiconduct...

3 Dec 2025 | Wednesday | NEWS
STRATIO Launches LS SWIR SDK with World’s First Ge-Based SWIR Sensor

STRATIO, a deep-tech company operating between Silicon Valley and Seoul, officially launched its LS SWIR SDK with the world’s first Germanium (Ge)-based short-wave infrared (SWIR) sensor. This milestone furthers the company’s vision “Advance Vision with Infrared-AI™” — a new way of seeing beyond human and conventional visible sensor limits. Unlike traditiona...

1 Dec 2025 | Monday | NEWS
Soitec Announces Validation of Its SmartSiC Substrates for SiC Power Devices

Soitec has announced that its SmartSiC technology has successfully completed formal validation for use in next generation silicon carbide power devices, marking a major milestone for the company’s rapidly expanding power electronics business. The validation confirms that SmartSiC substrates meet strict performance, reliability and manufacturability requirements demanded by leading device m...

28 Nov 2025 | Friday | NEWS