• Sunday | 08 February 2026
New Photonics Introduces Industry’s First 1.6T Laser-Integrated NPO Transmitter

New Photonics® Ltd., the award-winning fabless semiconductor designer delivering innovative all-optical domain connectivity solutions for data center interconnect, introduced NPC50503 1.6T NPO laser integrated transmitter with integrated OSPic™ all-optical signal processor. The NPC50503 NPO chiplet is the industry's first laser-integrated 1.6T solution for a serviceable NPO environment a...

14 Jan 2026 | Wednesday | NEWS
PlayNitride and Brillink Partner on Energy-Efficient Photonic Interconnects for AI and HPC

PlayNitride, a global leader in MicroLED technologies, announced a strategic collaboration with Brillink to develop a next-generation array-based photonic interconnect solution designed to deliver longer reach, lower power consumption, and superior bandwidth density for high-performance computing (HPC)and AI systems. As one of the industry's foremost MicroLED innovators, PlayNitride will contribu...

14 Jan 2026 | Wednesday | NEWS
Quantum Computing Inc. Named Stalking Horse Bidder for Luminar Assets

Quantum Computing Inc. an innovative quantum optics and integrated photonics technology company, announced that, following its previously announced agreement to acquire Luminar Semiconductor, Inc. ("LSI"), it has submitted a bid and has been selected as the stalking horse bidder for selected remaining assets of Luminar Technologies, Inc. ("Luminar"). This proposed transaction will be completed in ...

14 Jan 2026 | Wednesday | NEWS
Impinj and EM Microelectronic Sign Licensing Agreement for Gen2X Technology

Impinj, Inc. a leading RAIN RFID provider and Internet of Things pioneer, announced a licensing agreement with EM Microelectronic, a semiconductor manufacturer specialized in the design and production of ultra-low power, low voltage integrated circuits (IC), to integrate Impinj Gen2X into future EM endpoint ICs. “We are committed to enabling a broader ecosystem of product and technology pro...

13 Jan 2026 | Tuesday | NEWS
RiseLink CEO Outlines Next Phase of Smart Home Evolution at CES 2026

At CES 2026, Dr. Pengfei Zhang, Founder and CEO of RiseLink Technologies Inc., joined senior leaders from Bosch, ecobee, Amazon Devices, and EY on the featured panel, "The Latest in Smart Devices and Smart Home Integration," where he outlined a clear vision for the next phase of smart-home evolution—one defined by the convergence of robust connectivity, ultra-low-power design, and on-de...

12 Jan 2026 | Monday | NEWS
BLUETTI Brings Industry Leaders Together to Advance Clean Energy at CES 2026

At CES 2026, global energy pioneer BLUETTI convened a landmark industry panel titled "Clean Energy for All," examining the intersection of semiconductor engineering, material science, and environmental advocacy. The discussion brought together voices from Texas Instruments, Covestro, Leave No Trace, alongside veteran energy journalists to examine how clean energy can become more sustainable and ac...

12 Jan 2026 | Monday | NEWS
United Semiconductors Partners with Aegis Aerospace to Advance Semiconductor Manufacturing in Space

Aegis Aerospace Inc., a leader in space and defence technology, has announced a groundbreaking partnership with United Semiconductors LLC to pioneer semiconductor manufacturing in space. This collaboration follows Aegis Aerospace's recent grant agreement with the Texas Space Commission to develop an in-space manufacturing platform for advanced materials in low Earth orbit (LEO). "We are thrilled ...

9 Jan 2026 | Friday | NEWS
Marvell Technology to Acquire XConn Technologies, Expanding PCIe and CXL Switching Portfolio

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced it has entered into a definitive agreement to acquire XConn Technologies (“XConn”), a provider of advanced PCIe and CXL switching silicon. The acquisition expands Marvell’s switching portfolio by adding XConn’s PCIe and CXL products and augments Marvell’s Ultra Accelerato...

9 Jan 2026 | Friday | NEWS
SonicEdge Partners with Global Semiconductor Manufacturer to Integrate Modulated Ultrasound into Audio Chipsets

SonicEdge, a pioneer in micro-acoustic innovation, announced at CES 2026 a new strategic partnership with a leading global semiconductor manufacturer to integrate its modulated ultrasound IP directly into next-generation audio chipsets. The audio chipset will natively drive SonicEdge’s modulated ultrasound speakers. Additional major chip companies are expected to follow as the industry recog...

9 Jan 2026 | Friday | NEWS
Ventiva Unveils Zoned Cooling™ Architecture at CES 2026

Ventiva®, a leader in thermal solutions, at CES 2026 unveiled its Zoned Cooling™ reference design, a new architectural approach to thermal management that transforms how heat is managed in electronic devices, from laptops to client-edge devices to data center infrastructure. As AI workloads grow, requiring more compute power, memory, storage, and 24/7 responsiveness, traditional fan...

9 Jan 2026 | Friday | NEWS
GCT Semiconductor Begins Commercial Shipments of 5G Chipset

GCT Semiconductor Holding Inc. (“GCT” or the "Company") (NYSE: GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, announced the first commercial shipments of its 5G chipset to GCT’s lead customers. The shipments follow successful qualification and adoption, as highlighted in GoGo’s recent announcement, marking a key mileston...

8 Jan 2026 | Thursday | NEWS
Durin Builds MagicKey Smart Home Access on UWB and IoT Semiconductors from MKSemi, Silicon Labs, and Infineon

Durin, Inc., a leader in identity verification for smart home access, revealed the five technology partners powering MagicKey(™), Door Manager's multi-factor authentication feature—the only solution that combines UWB proximity, facial recognition, and voice biometrics for home entry. Following the announcement of Door Manager's compatibility with the Philips 3000 Series Wi-Fi Retrofit ...

8 Jan 2026 | Thursday | NEWS
NXP Integrates Ceva AI DSP Into S32Z2 and S32E2 Processors for Software-Defined Vehicles

As vehicles evolve into software-defined platforms, the demand for real-time processing, safety, and intelligence is accelerating. Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced that NXP® Semiconductors has integrated Ceva's AI DSP into its S32Z2 and S32E2 processors, designed to power the next generation of rea...

7 Jan 2026 | Wednesday | NEWS
Chips & Media and Visionary.ai Launch World’s First AI-Based Full Image Signal Processor

Chips & Media, Inc. a leading hardware IP provider with more than 20 years of leadership in the multimedia industry, and Visionary.ai, the Israeli startup pioneering AI software for image processing, announced the launch of the world's first AI-based full Image Signal Processor (ISP). The new ISP offers a software-defined imaging pipeline that supercharges video quality in real time. The new ...

6 Jan 2026 | Tuesday | NEWS
Valens Semiconductor and Sakae Riken Launch First Production-Ready MIPI A-PHY E-Mirror

Valens Semiconductor (NYSE: VLN) and Sakae Riken Kogyo Co., Ltd announced the automotive market's first production-ready MIPI A-PHY-enabled e-mirror. The product, which integrates the Valens VA7000 chipset, delivers an order of magnitude more imaging data than other camera monitoring system solutions on the market, enabling more accurate ADAS and autonomous driving decisions. MIPI A-PHY ...

6 Jan 2026 | Tuesday | NEWS
LG Display to Showcase Next-Generation OLED Lineup at CES 2026

LG Display, the world's leading innovator of display technologies, will showcase a full lineup of strategic OLED products built on its world-leading technology at CES 2026. During the show, the company will operate two separate exhibition booths — a large-sized OLED booth at the Conrad Hotel and an automotive display booth in the West Hall of Las Vegas Convention Center (LVCC). This year's...

6 Jan 2026 | Tuesday | NEWS
Edgewater Wireless to Showcase PrismIQ Wi-Fi Platform at CES

Edgewater Wireless Systems Inc. (TSXV: YFI) (OTC: KPIFF), the industry pioneer of AI-powered Wi-Fi Spectrum Slicing™ silicon solutions and IP for residential, enterprise and Industrial IoT markets, announced it will be attending CES, in Las Vegas, Nevada. Throughout CES, Edgewater will host private, by-appointment meetings with broadband operators, OEMs, silicon ecosystem partners, and inve...

1 Jan 2026 | Thursday | NEWS
MemryX Introduces MX4 Accelerator Roadmap Targeting Data Center AI Inference

MemryX Inc., a company delivering production AI inference acceleration, announced its strategic roadmap for the MX4. The next-generation accelerator is engineered to scale the company's "at-memory" dataflow architecture from edge deployments into the data center, leveraging 3D hybrid-bonded memory to eliminate the industry's most pressing bottleneck: the "memory wall." MemryX is cu...

29 Dec 2025 | Monday | NEWS
MediaTek and DENSO Join Forces to Develop Advanced Automotive SoC Platform

MediaTek, a global leader in innovative semiconductor solutions, announced that it is working closely with DENSO, one of the world's leading automotive technology providers, to develop a custom automotive System-on-Chip (SoC) solution tailored for Advanced Driver-Assistance Systems (ADAS) and cockpit systems. This joint effort merges DENSO's automotive-grade safety expertise and deep vehicle integ...

29 Dec 2025 | Monday | NEWS
Taiwan Considers Tighter Export Rules for Advanced Chip Manufacturing

Taiwan Weighs Export Controls That Could Limit Advanced Chip Production Overseas Taiwan is evaluating tighter export control measures that could restrict the manufacture of its most advanced semiconductors outside the island, a move that may reshape global chip supply strategies and slow the rollout of cutting edge production at overseas facilities. At the centre of the discussion is a proposed ...

29 Dec 2025 | Monday | NEWS

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