SPARK Microsystems Launches Ultra-Low-Power Presence Detection Kit Based on LE-UWB™ Technology

SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, announced a new presence detection kit (PDK) that enables designers to break the barriers of legacy wireless connectivity for next-generation smart devices with advanced presence detection capabilities. Presence-aware IoT devices for applications spanning healthcare,...

13 Nov 2025 | Thursday | NEWS
Renesas Sets New Standard for DDR5 Memory Interfaces with 9600 MT/s RCD Optimized for AI and HPC Workloads

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, announced that it has delivered the industry’s first sixth-generation Registered Clock Driver (RCD) for DDR5 Registered Dual In-line Memory Modules (RDIMMs). The new RCD is the first to achieve a data rate of 9600 Mega Transfers Per Second (MT/s), surpassing the industry standard. This brea...

13 Nov 2025 | Thursday | NEWS
Global Experts Convene in Busan as OIF Charts Path to 448G Interoperability

New Framework outlines OIF’s vision for 448 Gbps interconnects, setting the stage for future Implementation Agreements that will power AI, HPC and communications systems OIF convened its Q4 2025 Technical and MA&E Committees Meeting in Busan, South Korea, Nov. 3–7, where global members gathered to advance the organization’s work across optical, electrical, manage...

13 Nov 2025 | Thursday | NEWS
Supplyframe and Orbweaver to Deliver Connected Data Workflows for Electronics Manufacturers

Supplyframe and Orbweaver announced a new strategic collaboration that addresses one of the most pressing challenges facing electronics manufacturers and distributors: the need to harmonize and connect critical data across design, sourcing, and commercial systems. Through this partnership, Supplyframe’s Design-to-Source Intelligence (DSI) platform and SaaS solutions including NPI, Di...

12 Nov 2025 | Wednesday | NEWS
Wolfspeed and Hopewind Collaborate to Bring Silicon Carbide Innovation to Global Wind Energy Systems

Wolfspeed, Inc. (NYSE: WOLF), a global leader in innovative silicon carbide power solutions, announced a collaboration with Hopewind, a global innovator in renewable energy solutions. Together, the two companies will advance the development of the next generation of wind power solutions by integrating Wolfspeed’s cutting-edge 2.3kV LM Pack Module into Hopewind’s advanced highly modul...

11 Nov 2025 | Tuesday | NEWS
HPE and Partners Establish Quantum Scaling Alliance to Drive Quantum Computing Into Mainstream Adoption

Team combines deep expertise in quantum with leadership in supercomputing and semiconductor design and manufacturing to drive quantum technology into mainstream adoption HPE  and a consortium of seven other leading technology organizations  announced the formation of the Quantum Scaling Alliance, a global initiative dedicated to making quantum computing scalable, practical, ...

11 Nov 2025 | Tuesday | NEWS
Canaan Inc. Closes $72 Million Registered Direct Offering to Accelerate Innovation in Crypto Mining

Canaan Inc. (NASDAQ: CAN) ("Canaan" or the "Company"), an innovator in crypto mining, announced the closing of the registered direct offering with institutional investors that the Company announced on November 4, 2025. The offering totaled US$72 million of the Company's American depositary shares ("ADSs"), each representing 15 Class A ordinary shares, at a price of US$1.131 per ADS....

10 Nov 2025 | Monday | NEWS
CELUS and NextPCB Partner to Streamline Electronics Design-to-Production Workflow

CELUS, the developer of a leading AI-assisted electronics design platform, and NextPCB, a globally recognized PCB manufacturing and assembly service provider, announced a strategic partnership aimed at streamlining the electronics development lifecycle from concept to mass production. Through this partnership, NextPCB users will gain access to the CELUS Design Platform for seamless idea creatio...

7 Nov 2025 | Friday | NEWS
Ceva and Microchip Announce Long-Term Partnership to Bring Scalable AI Processing Across Microchip's Product Portfolio

Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced a long-term partnership with Microchip Technology Inc. (NASDAQ: MCHP), a broadline supplier of semiconductors committed to making innovative design easier through total system solutions. This collaboration will embed Ceva's NeuPro™ family of Neural Processing Units (NPUs) in Microchip's...

6 Nov 2025 | Thursday | NEWS
Jabil to Acquire Hanley Energy Group for $725 Million to Expand Critical Power Capabilities for Data Centers

Jabil Inc. (NYSE: JBL) announced that it has signed a definitive agreement to acquire Hanley Energy Group, a provider of energy management and critical power solutions serving the data center infrastructure market, for approximately $725 million plus contingent consideration up to $58 million, subject to achieving future revenue thresholds, in an all-cash transaction. The transaction is expected...

6 Nov 2025 | Thursday | NEWS
Alif Semiconductor and Arm Bring Generative AI to the Edge with Industry’s First MCUs Featuring Hardware Acceleration for Transformer Networks

The Ensemble E4/E6/E8 are the industry's first MCUs to provide hardware acceleration for transformer networks, enabling local generative AI inference on edge and endpoint devices Together with Arm, Alif demonstrated at the PyTorch Conference generative AI models compiled with the ExecuTorch Runtime running on the Ensemble E8 Alif Semiconductor®, the leading global supplier of sec...

31 Oct 2025 | Friday | NEWS
Synopsys and NVIDIA Unveil AI-Accelerated Engineering Breakthroughs at GTC Washington 2025

Synopsys, Inc. (NASDAQ: SNPS) is attending NVIDIA GTC Washington, D.C.October 27-29 to showcase advancements in engineering solutions from silicon to systems that will underpin the next era of industrial innovation. Now united with Ansys, Synopsys' expanded portfolio accelerates engineering productivity, improves product performance, and unlocks development insights, from semiconductor desig...

30 Oct 2025 | Thursday | NEWS
Toshiba Expands High-Speed Digital Isolator Lineup with New Dual-Channel DCL52xx00 Series for Industrial Equipment

-Toshiba Electronic Devices & Storage Corporation("Toshiba") has launched four dual-channel, high-speed standard digital isolators for industrial equipment. The new “DCL52xx00 Series” products support stable operation with high common mode transient immunity (CMTI) of 100kV/μs (typ.)[1] and high-speed data rate of 150Mbps (max). Shipments start today. The channel configuratio...

29 Oct 2025 | Wednesday | NEWS
Universal Vapor Jet Corporation Launches Global Headquarters and R&D Center in Singapore to Advance Solvent-Free Manufacturing

-Universal Vapor Jet Corporation (UVJC), a wholly-owned subsidiary of Universal Display Corporation (UDC) (Nasdaq: OLED),  announced the launch of its global headquarters and R&D center in Mapletree Hi-Tech Park @ Kallang Way, Singapore. The 8,000-square-foot facility includes the company’s global headquarters, its state-of-the-art research and development (R&D) center, labor...

29 Oct 2025 | Wednesday | NEWS
Infleqtion Achieves World’s First Deployment of Quantum Optical Atomic Clock on Autonomous Submarine

Infleqtion, a global leader in neutral atom–based quantum technology,  announced a successful trial with the Royal Navy and MSubs, marking the first-ever deployment of a quantum optical atomic clock on an underwater autonomous vehicle. The trial integrated Infleqtion’s Tiqker optical atomic clock into the Royal Navy’s Excalibur (XCal) testbed submarine, demonstrating preci...

29 Oct 2025 | Wednesday | NEWS
Socionext Introduces “Flexlets,” a New Class of Configurable Chiplets to Advance Heterogeneous Integration

Socionext Inc., a global leader in System-on-Chip (SoC) design and advanced semiconductor solutions, introduces "Flexlets", a new class of configurable chiplets designed to advance heterogenous integration.  As traditional monolithic SoC designs face physical and economic limits—reticle size constraints, yield challenges, and thermal bottlenecks- the industry is turning toward c...

29 Oct 2025 | Wednesday | NEWS
eInfochips and NXP Semiconductors Forge Multi-Year Collaboration to Accelerate Software-Defined Vehicle Development

eInfochips, an Arrow Electronics company, and a leading provider of product engineering services, and NXP® Semiconductors, the trusted partner for innovative solutions in the automotive market, today announced a multi-year collaboration focused on software distribution and customer services. eInfochips will supply standard and premium software packages and tools for NXP's S32 family of micr...

27 Oct 2025 | Monday | NEWS
ChipAgents Raises $21 Million Series A to Redefine Chip Design with Agentic AI Platform

Sales 50x YoY, Deployments at 50 leading semiconductor companies. Former CEOs of Cadence and Mentor Graphics, Plus Former Synopsys CTO, Join Advisory Board. ChipAgents, the agentic AI platform transforming chip design and verification, announced the close of a $21 million Series A funding round, bringing the total fundraise to $24 million to date. This latest round closed with Besseme...

24 Oct 2025 | Friday | NEWS
Diodes Incorporated Launches Automotive-Grade PI2DPT1021Q Retimer for High-Speed USB and DisplayPort Applications

Diodes Incorporated announces the automotive-compliant* PI2DPT1021Q, a new bit-level retimer designed to meet the rigorous demands of the automotive market. This device supports both DisplayPort™ (DP) 1.4 and USB 3.2 standards for USB Type-C® applications, such as infotainment and clusters, rear seat entertainment, smart cockpits, and active cables. The PI2DPT1021Q is a 10Gbps retimer...

24 Oct 2025 | Friday | NEWS
UMC Launches 55nm BCD Platform to Power Next-Generation Smart, Efficient Electronics

United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), a leading global semiconductor foundry,  announced the release of its 55nm Bipolar-CMOS-DMOS (BCD) platform, enabling a new level of performance and power efficiency in next-generation mobile devices, consumer electronics, automotive, and industrial applications. Designed to address the growing complexity of pow...

23 Oct 2025 | Thursday | NEWS