LG Innotek recently held an event to unveil its newly developed 'Next-generation Digital Key Solution' for the first time to the media. The 'Next-generation Digital Key Solution' is a flagship product of LG Innotek's automotive connectivity business, a key pillar of its automotive components business, along with 5G communication modules and automotive AP modules. The digital key is touted as a...
Lam Research Corp. unveiled VECTOR® TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence (AI) and high-performance computing (HPC) applications. TEOS 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. It provides ultra-thick, ...
As artificial intelligence continues to reshape the global economy, the underlying infrastructure enabling its growth is drawing increasing attention. At the heart of this transformation is a little-known but critical component — optical transceivers — and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawi...
DB HiTek, a leading 8-inch specialty foundry, announced it is in the final stages of development of its 650V E-Mode GaN HEMT (Gallium Nitride High-Electron Mobility Transistor) process, a next-generation power semiconductor platform. The company is also to offer a dedicated GaN MPW (multi-project wafer) program at the end of October. Compared with traditional silicon-ba...
According to a recently published report by Dell'Oro Group, the trusted source for market information about the telecommunications, security, networks, and data center industries, the on-going AI expansion cycle drove the server and storage component market to 44 percent year-over-year growth in 2Q 2025. The surging demand for accelerators, HBM, and NICs underpins record expansion across the AI ...
SK hynix Inc. (or "the company", www.skhynix.com) announced that it has completed development and finished preparation of HBM4*, a next generation memory product for ultra-high performance AI, mass production for the world's first time. SK hynix said that the company has successfully completed development and based on this technological achievement, the company has prepared HBM4 mass production t...
OPROCESSOR INC, incorporated in Boston, Massachusetts in 2018 with research operations in Daejeon, South Korea, announced a breakthrough in VCSEL-based Photonic Interposer technology that overcomes the GPU–HBM interconnect bottleneck for next-generation AI and high-performance computing systems. The pioneering work was published in Photonics (MDPI, August 29, 2025) and will be presented a...
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced it will showcase its extensive, industry-leading interconnect portfolio for scale-up and scale-out data center AI deployments at the European Conference on Optical Communication (ECOC), September 28 to October 2 in Copenhagen, Denmark. The rapid evolution of generative AI technologies and larg...