Corning Incorporated announced its third-quarter 2025 results and provided its outlook for fourth-quarter 2025. Wendell P. Weeks, chairman and chief executive officer, said, “We delivered another excellent quarter. Year over year, core sales grew 14% to $4.27 billion, and core EPS grew 24% to $0.67. Overall, as we approach the second anniversary of Springboard, the plan has been a t...
indie (Nasdaq: INDI), an automotive solutions innovator, announced it has entered into an Asset Purchase Agreement with United Faith Auto-Engineering Co., Ltd., a publicly-listed company in the People’s Republic of China (“United Faith”) on October 27, 2025, to sell its entire 34.38% outstanding equity interest in Wuxi indie Microelectronics Technology Co., Ltd., a Chinese enti...
-SiLC Technologies, Inc. (SiLC) announced an approximately 30% expansion of its Monrovia headquarters, increasing its total facility size to more than 30,000 square feet and securing the option for further expansion. The added space will support advanced manufacturing operations, allowing SiLC to scale production, accelerate innovation, and reinforce its position as a trusted U.S.-based su...
New ModelNova platform delivers developer-ready AI models for Ceva's ultra-low power NeuPro-Nano NPU,and will extend to high-performance NeuPro-M NPUs, accelerating smart edge innovation As the industry accelerates toward "physical AI" - bringing artificial intelligence out of the cloud and into the real world to enable machines to autonomously perceive and understand their environme...
New solution uses automated 3D metrology to increase productivity in fabrication environments From smartphones to autonomous cars to AI supercomputers, nearly every electronic innovation we use today depends on complicated structures at the atomic scale within silicon chips. As these chips increase in processing power and decrease in size, even the smallest fault can cause massive delays....
Diodes Incorporated announces the automotive-compliant* PI2DPT1021Q, a new bit-level retimer designed to meet the rigorous demands of the automotive market. This device supports both DisplayPort™ (DP) 1.4 and USB 3.2 standards for USB Type-C® applications, such as infotainment and clusters, rear seat entertainment, smart cockpits, and active cables. The PI2DPT1021Q is a 10Gbps retimer...
-Parris Javaid, Inc., parent company of Parraid, LLC, is proud to announce the acquisition of DesignLinx Hardware Solutions, Inc., a premier engineering firm known for its advanced expertise in high-performance FPGA, SoC, and embedded software design and development. This acquisition marks a strategic expansion of Parris Javaid’s collective capabilities and sets the stage for the continued...
-Tachyum® announced the opening of new offices in Taiwan, the world’s most advanced technology manufacturing and technological hub, in advance of production of the Prodigy® Universal Processor. As Tachyum continues towards tape-out for Prodigy, the company has chosen to establish manufacturing, testing, assembly, ODM, logistics and support facilities in Taiwan to ensure worl...
Frore Systems announced the launch of LiquidJet™, a revolutionary direct-to-chip liquid cooling 3D coldplate solution designed to meet the escalating demands of AI Data Centers. Built with Frore's unique semiconductor manufacturing process adapted to metal wafers, LiquidJet unlocks higher performance from the world's most powerful GPUs—starting with NVIDIA Blackwell Ultra—...
Micron Technology is preparing to exit China’s server chip market after a prolonged impact from the 2023 ban that barred its products from use in critical infrastructure. The decision marks a significant retreat from a key global market and underscores the deepening technological rift between Washington and Beijing. While sales to Chinese data-centre operators will cease, Mi...
Initial facility supports 6 operating projects and 10 projects entering construction, including Lightshift’s project with GlobalFoundries to power semiconductor manufacturing Lightshift Energy (Lightshift), a developer, owner and operator of battery energy storage projects across the U.S., and KeyBanc Capital Markets (KBCM), the corporate and investment banking arm of Cleveland ...
Global technology giant Samsung has been found to owe a combined $524 million in damages following two separate patent infringement verdicts handed down by federal court juries in the Eastern District of Texas. The landmark verdicts were secured for the plaintiffs with the support of attorneys from Longview-based law firm Miller Fair Henry, who collaborated with lead trial counsel in local tria...
Strategic Collaboration to Support Advanced Semiconductor Manufacturing with High-Performance Materials Qnity, DuPont's Electronics business, a premier technology solutions leader across the semiconductor value chain, announced the signing of a Memorandum of Understanding (MOU) with SK hynix, establishing a strategic long-term agreement for the supply of polishing pads for chemical mechan...
Smiths Interconnect provides mission-critical components to the $5B aerospace and defense sector, as well as semiconductor test, industrial and medical markets Smiths Interconnect's leadership in providing innovative medical interconnect solutions complements Molex's position in the rapidly expanding medtech segment Customers and partners to benefit from combined engineering expertise,...
EARTO, the organisation of the European Research and Technology Organisations, awarded SemiQon and VTT first prize in the "Impact Expected" category on 14 October 2025 in Brussels for a pioneering cryogenic CMOS (complementary metal-oxide semiconductor) chip innovation. The solution enables the full capacity of advanced CMOS functionalities at cryogenic temperatures, thereby unlocking new possib...
Ceva strengthens its leadership as a trusted single source for advancing the smart edge, with Bluetooth® 6.0 Channel Sounding for secure spatial awareness enabling on-device intelligence and Physical AI As industries demand greater positioning accuracy, security, and reliability for wireless connectivity, Bluetooth® 6.0 emerges as a critical enabler for next-generation high perfor...
Semiconductor Research Corporation (SRC) is proud to announce the release of the Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap 2.0, a comprehensive update to the industry’s first 3D semiconductor roadmap. This second edition reflects the contributions of over 370 experts from 132 organizations across industry, academia, and government, and builds upon the momentum of ...
indie (Nasdaq: INDI), an automotive solutions innovator, has released a new Visible Distributed Feedback (DFB) gallium nitride-based (GaN) laser diode from its Photonics BU product line, enabling next-generation quantum, a wide range of automotive applications, including LiDAR and sensing, and Industrial Raman applications with ultra-stable, sub-MHz linewidths at wavelengths from the near-UV (37...
Metallium Ltd. (ASX: MTM; OTCQX: MTMCF) announced the company will add a second demonstration line at its first commercial facility, scheduled for commissioning in December. The line will be specifically for rare earths elements (REE) and semiconductor feedstocks. The announcement was made by the company as they updated investors on the advancement of the company's commercial facility in th...
Momentus Inc. (NASDAQ: MNTS), a U.S. commercial space company offering satellites, satellite components, and in-space transportation and services, announced that it was awarded a $5.1 million contract on September 26 by NASA’s Flight Opportunities program to support the Commercial Orbital System for Microgravity In-Space Crystallization (COSMIC) demonstration, a pioneering technology desig...