KoMiCo Invests CZK 914 Million in Czech Semiconductor Facility to Support TSMC's ESMC and Europe's Chip Expansion

South Korean semiconductor services company KoMiCo Co., Ltd. is strengthening its presence in Europe with the construction of a new semiconductor parts cleaning and coating facility in the Czech Republic, a move aimed at supporting the region's expanding semiconductor manufacturing sector.

The company is investing approximately CZK 914.3 million (around KRW 65 billion) in the project, which will serve customers within the Silicon Saxony semiconductor cluster centred on Dresden, Germany. The expansion is expected to support the operations of European Semiconductor Manufacturing Company (ESMC), TSMC's joint venture currently under development in Dresden.

Industry sources said KoMiCo signed a land lease agreement with the Ústí Region on 24 June for a site in the Triangle Strategic Industrial Zone. Construction is scheduled to begin this month, with trial production expected in August 2027 before commercial operations commence in September 2027.

Of the total investment, more than KRW 40 billion will be directed towards construction of the facility, while over KRW 10 billion will be allocated to manufacturing equipment.

Located roughly 80 kilometres from Dresden, the site has been selected to provide efficient support to semiconductor manufacturers operating across the region. In addition to ESMC, the facility is expected to serve customers including GlobalFoundries, Infineon Technologies and Bosch.

ESMC marks TSMC's first semiconductor manufacturing investment in Europe and has been established in partnership with Bosch, Infineon Technologies and NXP Semiconductors. The €10 billion project is designed to produce up to 40,000 300mm wafers per month, manufacturing both FinFET and planar CMOS technologies for automotive, industrial and other applications. Volume production is targeted before the end of 2027.

KoMiCo's Czech plant will cover 26,810 square metres and house eight production lines alongside seven cleanrooms. Once fully operational, the site will be capable of processing between 20,000 and 25,000 semiconductor process components each month, providing cleaning and coating services for equipment used in fabrication plants with a combined capacity of up to 100,000 wafers per month.

The investment is expected to increase KoMiCo's worldwide cleaning and coating capacity by around 5%, adding to its existing annual processing capability of more than five million semiconductor components.

To support the project, KoMiCo established its Czech subsidiary, TaMiCo Zatec s.r.o., in February. The subsidiary is wholly owned through KoMiCo Technology Taiwan and has been created to strengthen the company's ability to support Taiwanese semiconductor customers expanding into Europe.

KoMiCo has historically located its manufacturing operations close to key customer facilities. Its South Korean sites serve companies including Samsung Electronics, SK hynix, DB HiTek and SEMES, while its Taiwanese operations support TSMC, UMC, Micron Technology and Powerchip Semiconductor Manufacturing Corporation. The company also operates facilities in China, Singapore and the United States, providing services to customers such as Intel, GlobalFoundries, Micron, NXP and Samsung Electronics.

A company spokesperson said KoMiCo has completed the establishment of its Czech subsidiary and will move forward with construction as planned. The spokesperson added that the company intends to build on its long-standing relationships with Taiwanese semiconductor manufacturers, including TSMC, to expand its business across the European market.