• Sunday | 10 May 2026
Strategic Push into Agentic AI: SambaNova Systems and Intel Corporation Unveil Heterogeneous Inference Architecture

SambaNova announced the next phase of its collaboration with Intel: a heterogeneous hardware solution that combines GPUs for prefill, Intel Xeon® 6 processors as both host and “action” CPUs, and SambaNova RDUs for decode to deliver premium inference for the most demanding Agentic AI applications. The design will be made available in H2 2026 to enterprises, cloud providers, and...

9 Apr 2026 | Thursday | NEWS
Mouser Launches 2026 EIT Series on Engineering AI for Everyday Applications

Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, announced the first 2026 instalment of its Empowering Innovation Together (EIT) technology series, Engineering AI for Daily Life. This installment explores how artificial intelligence is increasingly embedded in everyday products and services, from as...

9 Apr 2026 | Thursday | NEWS
Bureau Veritas to Acquire Lotusworks to Strengthen AI Infrastructure Capabilities

Bureau Veritas, a global leader in Testing, Inspection, and Certification services (TIC), announces that it has signed an agreement to acquire Lotusworks, a global leader in mission‑critical assets commissioning and quality assurance and control. This strategic move will uniquely position the Buildings & Infrastructure Product Line to benefit from AI-driven construction investments. Headqua...

8 Apr 2026 | Wednesday | NEWS
Roundhill Launches DRAM ETF to Capitalise on AI Memory Demand

Roundhill Investments, an ETF sponsor focused on innovative financial products, announced the launch of the Roundhill Memory ETF (Ticker: DRAM). DRAM seeks to provide investors with targeted exposure to global companies operating within the memory segment of the semiconductor industry, including manufacturers of DRAM, High-Bandwidth Memory (HBM), NAND flash, and solid-state storage devices (SSD)....

7 Apr 2026 | Tuesday | NEWS
L Squared Launches Continuation Fund to Accelerate BTX Precision Growth

L Squared Capital Partners (“L Squared”) is pleased to announce the successful closing of a single-asset continuation fund for BTX Precision (“BTX” or the “Company”), a leading high-precision manufacturer of mission-critical components and assemblies. The platform’s unmatched breadth of additive and subtractive manufacturing capabilities – including ...

3 Apr 2026 | Friday | NEWS
Corning and Meta Expand Manufacturing to Support AI Infrastructure Growth

Corning and Meta have commenced construction on an expanded cable manufacturing facility in North Carolina to support the growing demand for artificial intelligence (AI) infrastructure. The project is part of a broader multi-year partnership between the two companies, under which Corning will provide advanced optical fibre, cable and connectivity solutions for Meta’s data centres. The agree...

3 Apr 2026 | Friday | NEWS
AMD Foundation Backs Semiconductor Talent Pipeline with New Investment

As the United States races to secure its semiconductor future, Last Mile Education Fund announces that the AMD Foundation has joined its Semiconductor Pathways Fund with a $500,000 philanthropic investment over the next three years. The Semiconductor Pathways Fund is a national industry coalition ensuring that the engineers and technicians already enrolled in STEM programs...

2 Apr 2026 | Thursday | NEWS
Molex Completes Landmark Acquisition of Smiths Interconnect

Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc, marking a major milestone in Molex's vision to enable technology that is transforming the future and improving people's lives. Smiths Interconnect brings a diverse portfolio of complementary products and advantaged capabilities ...

2 Apr 2026 | Thursday | NEWS
IOWN Global Forum Showcases Open AI Networking Vision at OFC 2026

At OFC 2026, the Innovative Optical and Wireless Network Global Forum (IOWN Global Forum), comprised of over 180 member organisations, highlighted its vision for the future of open AI networking through an interactive booth and dedicated panel session. These platforms enabled the Forum to demonstrate the power of interoperable technologies and engage industry leaders on how collabor...

2 Apr 2026 | Thursday | NEWS
OMNIVISION and ATL Medical Partner to Accelerate Medical Imaging Solutions

OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analog, and display solutions, and ATL Medical, Inc., a designer, developer and manufacturer of innovative medical devices, announced that ATL is using the OVMed® OH0131 image signal processor (ISP) in its PREVOYANCE® Complete Imaging System with Chip-on-Tip® technolog...

2 Apr 2026 | Thursday | NEWS
Mount Hydrogen: A 3GW AI, Robotics and Semiconductor Campus Redefining US Tech Infrastructure

MacroValor Corporation and Favis Advanced Robotics announced plans for Mount Hydrogen, a 3,000-megawatt AI, robotics, and semiconductor mega campus to be developed in Austin, Texas. The facility will draw exclusively on MacroValor's natural hydrogen energy network to power continuous, zero-emission operations at a scale no The announcement comes as American technology companies face a conver...

1 May 2026 | Friday | NEWS
Pacific Defence Launches AI-Enabled DSP3100VP for Edge Intelligence Applications

Pacific Defence announced the launch of the DSP3100VP, a next-generation digital signal processing module engineered to bring advanced artificial intelligence and machine learning (AI/ML) capabilities to the edge. Built on the AMD Versal™ AI Edge Series Gen 2 adaptive SoC, the DSP3100VP combines heterogeneous compute, adaptive acceleration, and deterministic real-time control to meet th...

26 Mar 2026 | Thursday | NEWS
OKI Launches Comprehensive EMS for AI Server Manufacturing

OKI (TOKYO: 6703) will launch Comprehensive Electronics Manufacturing Services (EMS) for AI server equipment on March 25, 2026. These comprehensive services will cover all processes, from the design and production of large-size multi-layer printed circuit boards (PCBs) incorporating OKI’s proprietary high heat dissipation technology supporting high-speed high-capacity data transmission, to c...

26 Mar 2026 | Thursday | NEWS
HyperLight Corporation Launches 400G-per-Lane Photonic Integrated Circuits for Artificial Intelligence Networking

HyperLight Corporation (“HyperLight”), creator of the TFLN Chiplet™ Platform, announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure. The new PIC family delivers low insertion loss, low drive voltage operation, and exceptional electro-optic bandwidth, enabling energ...

20 Mar 2026 | Friday | NEWS
Siemens Launches Autonomous Artificial Intelligence Agent for Semiconductor Design Automation

Siemens announced the Fuse™ EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed circuit board (PCB) system workflows that span across design, verification and manufacturing sign-off. Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the Fuse...

19 Mar 2026 | Thursday | NEWS
Sivers Semiconductors AB Partners with O-Net Technologies and Enablence Technologies Inc. on Optical Interconnect Solution for Artificial Intelligence Data Centres

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a strategic partnership with O-Net Technologies and Enablence Technologies Inc. (TSXV: ENA) to develop an advanced external light source (ELS) module with Sivers laser arrays to support Co-Packaged Optics (CPO) roll-out in AI datacenters and HPC systems. O-Net ...

19 Mar 2026 | Thursday | NEWS
Halo Industries Selects Eyelit Technologies MES Platform for SiC Wafer Production

Eyelit Technologies (Eyelit), a leader in optimised planning, scheduling, and execution systems for manufacturers, announced that Halo Industries, an innovator in laser-based silicon carbide (SiC) wafering, has selected Eyelit’s solution suite to support its rapidly scaling production needs. Eyelit was chosen following a competitive evaluation, with Halo Industries selecting the platfo...

17 Mar 2026 | Tuesday | NEWS
Marvell Technology and Mojo Vision Partner on Micro-LED Optical Interconnects for AI Data Centres

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, and Mojo Vision, the high-performance micro-LED platform company, announced a long-term collaboration to develop a new class of optical interconnect solutions to power the next wave of high-performance AI data center infrastructure. Today’s rapidly growing AI workloads are beginning to str...

17 Mar 2026 | Tuesday | NEWS
KIOXIA America, Inc. Showcases AI-Optimised Flash and SSD Solutions at NVIDIA GTC 2026

Next week at NVIDIA GTC 2026, KIOXIA America, Inc. will showcase its latest high-performance memory and solid-state drive (SSD) solutions designed to meet the growing demands of artificial intelligence (AI) workloads. As the premier global AI conference, GTC brings together developers, researchers, and business leaders to explore advances in accelerated computing and AI. At this ye...

17 Mar 2026 | Tuesday | NEWS
New Phosphorus-Doped Diamond Semiconductor Targets High-Power Applications

"We thought there should be a way to fabricate N-type phosphorus-doped diamond semiconductors for high temperature and high power applications," said one of two inventors, from Cowan Heights, Calif., "so we invented the N-TYPE P D D SEMI CONDUCTOR. Our design would not have the same thermal and power handling limitations as existing silicon, gallium nitride and other N-type semiconductor subs...

13 Mar 2026 | Friday | NEWS

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