• Sunday | 08 February 2026
U.S. and Taiwan Announce $250 Billion Investment Agreement

The United States and Taiwan have entered into a landmark bilateral investment agreement that will see Taiwanese companies commit at least $250 billion towards expanding semiconductor, artificial intelligence, and advanced energy manufacturing capacity in the United States over the coming years. The agreement marks one of the largest cross border industrial investment commitments to date and sign...

19 Jan 2026 | Monday | NEWS
GIBO Expands AI Aviation Strategy with Aerial Intelligence Services

GIBO Holdings Ltd. (NASDAQ: GIBO), Asia's leading innovation-driven AI ecosystem, announced the next phase of its AI aviation roadmap, extending the GIBO.ai Calculation Engine beyond flight operations to deliver AI-powered aerial intelligence and data analytics services for commercial, industrial, and sustainability-focused markets. Building on its expansion into scalable AI-powered eVTOL platfor...

19 Jan 2026 | Monday | NEWS
Global Semiconductor Revenues to Pass $1 Trillion in 2026

Global semiconductor revenues will exceed $1tn in 2026, marking a historic milestone for the industry, according to Omdia’s latest market analysis. This growth is being driven by the rapid surge in memory and logic IC revenues, generated by massive demand from AI market. The semiconductor revenue forecast for 2025 increased significantly to 20.3% year-over-year (YoY), reflecting stronger-tha...

16 Jan 2026 | Friday | NEWS
Infinium Launches Immersion Cooling Platform for AI Data Centers

Infinium announced the launch of Infinium Edge™, an advanced data center infrastructure platform designed to enable high-density artificial intelligence (AI) and high-performance computing (HPC) workloads through immersion cooling. As power densities of GPUs, CPUs and supporting components continue to rise, cooling has emerged as one of the primary constraints to data center performance, eff...

16 Jan 2026 | Friday | NEWS
Startup Island TAIWAN Silicon Valley Hub Marks One Year of Cross-Border Innovation

Startup Island TAIWAN Silicon Valley Hub celebrated its first anniversary in Palo Alto, bringing together startup founders, technology leaders, accelerators, and community representatives from Taiwan and the United States to reflect on a year of advancing cross-border innovation. Established by Taiwan's National Development Council (NDC) in 2025, the Silicon Valley Hub serves as a two-way bridge ...

15 Jan 2026 | Thursday | NEWS
New Photonics Introduces Industry’s First 1.6T Laser-Integrated NPO Transmitter

New Photonics® Ltd., the award-winning fabless semiconductor designer delivering innovative all-optical domain connectivity solutions for data center interconnect, introduced NPC50503 1.6T NPO laser integrated transmitter with integrated OSPic™ all-optical signal processor. The NPC50503 NPO chiplet is the industry's first laser-integrated 1.6T solution for a serviceable NPO environment a...

14 Jan 2026 | Wednesday | NEWS
Synopsys Joins Ignite Next to Support Europe’s Deep Tech Scale-Ups

Ignite Next, the independent scale-up program for deep tech innovation, announced that Synopsys, the leader in engineering solutions from silicon to systems, has joined the program as a focus technology collaborator. This addition significantly strengthens the multi-partner setup launched earlier this month, which is designed to help European deep tech founders move faster from "Pre to B". Synops...

14 Jan 2026 | Wednesday | NEWS
PlayNitride and Brillink Partner on Energy-Efficient Photonic Interconnects for AI and HPC

PlayNitride, a global leader in MicroLED technologies, announced a strategic collaboration with Brillink to develop a next-generation array-based photonic interconnect solution designed to deliver longer reach, lower power consumption, and superior bandwidth density for high-performance computing (HPC)and AI systems. As one of the industry's foremost MicroLED innovators, PlayNitride will contribu...

14 Jan 2026 | Wednesday | NEWS
Applied Brain Research Closes Oversubscribed Seed Funding Round

Applied Brain Research (ABR), the leader in low latency real-time on-device voice AI solutions, announced the successful closure of its oversubscribed seed funding round. The investment round was led by Two Small Fish Ventures (TSF), with Eva Lau joining the ABR board. The investment will fuel continued development and commercialization of ABR's breakthrough TSP1 state space accelerator chip and s...

14 Jan 2026 | Wednesday | NEWS
DEEPX Named to CTA’s “What Not To Miss” Guide at CES 2026 for Second Consecutive Year

DEEPX, a global leader in ultra-low-power AI semiconductors, has once again been featured in the Consumer Technology Association's (CTA) "What Not To Miss" guide for CES 2026, marking the company's second consecutive year on this prestigious list. In the official CES 2026 guide, DEEPX is highlighted alongside industry titans such as AMD, NVIDIA, Qualcomm, and Samsung Electronics as being recognize...

12 Jan 2026 | Monday | NEWS
SonicEdge Partners with Global Semiconductor Manufacturer to Integrate Modulated Ultrasound into Audio Chipsets

SonicEdge, a pioneer in micro-acoustic innovation, announced at CES 2026 a new strategic partnership with a leading global semiconductor manufacturer to integrate its modulated ultrasound IP directly into next-generation audio chipsets. The audio chipset will natively drive SonicEdge’s modulated ultrasound speakers. Additional major chip companies are expected to follow as the industry recog...

9 Jan 2026 | Friday | NEWS
QuantalRF Expands RF Semiconductor and Antenna Ecosystem with DockOn® Models in Ansys HFSS

QuantalRF, the pioneering developer of RF semiconductor and antenna solutions, announced that its DockOn® antennas are now available in Ansys HFSS™ high-frequency electromagnetic software component libraries — now part of the Synopsys line of simulation and analysis solutions. This inclusion in HFSS gives RF engineers access to QuantalRF's antenna models, enabling faster and more p...

8 Jan 2026 | Thursday | NEWS
Canaan Launches 3.0 MW Heat-Reuse Pilot With Bitforest in Canada

Canaan Inc. an innovator in crypto mining, announced a 3.0 MW proof-of-concept (PoC) with Bitforest Investment Ltd. ("Bitforest" or the "Host") in Manitoba, Canada, to recover heat from an Avalon computing system and use the heat as a supplemental source for greenhouse operations. The pilot is part of Canaan's broader initiatives to make high-density computing operations more efficient t...

8 Jan 2026 | Thursday | NEWS
Synopsys Showcases AI-Driven Automotive Engineering Solutions at CES

Synopsys, Inc. is showcasing AI-driven and software-defined engineering solutions this week at CES that tackle one of the industry's biggest challenges: accelerating automotive engineering innovation in the age of AI while reducing cost and complexity. From intelligent system-level simulation to semiconductor design at the atomic scale, Synopsys enables automakers and suppliers to virtualize ...

8 Jan 2026 | Thursday | NEWS
ModelCat AI and Alif Semiconductor Partner to Simplify Edge AI Deployment

ModelCat AI, the creator of the world's first fully autonomous AI model builder, announced a strategic partnership with Alif Semiconductor, a global leader in power-efficient, AI-enabled embedded controllers. This collaboration introduces a turnkey solution that allows developers to build, optimise, and deploy AI models onto Alif's Ensemble™ family of microcontrollers (MCUs) in rec...

7 Jan 2026 | Wednesday | NEWS
Valens Semiconductor Wins New MIPI A-PHY ADAS Design With Global Automotive OEM

Valens Semiconductor (NYSE: VLN), the high-performance connectivity company, announced a new design win for its VA7000 MIPI A-PHY-compliant chipsets, which will be integrated into the ADAS systems of a premium global automotive OEM serving the Chinese market. The announcement brings Valens to four A-PHY design wins globally and reinforces the connectivity standard as a frontrunner for next-ge...

7 Jan 2026 | Wednesday | NEWS
NXP Integrates Ceva AI DSP Into S32Z2 and S32E2 Processors for Software-Defined Vehicles

As vehicles evolve into software-defined platforms, the demand for real-time processing, safety, and intelligence is accelerating. Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced that NXP® Semiconductors has integrated Ceva's AI DSP into its S32Z2 and S32E2 processors, designed to power the next generation of rea...

7 Jan 2026 | Wednesday | NEWS
Ceva Licenses SensPro™ AI DSP to BOS Semiconductors for ADAS SoC

As vehicles evolve toward software-defined architectures and complex ADAS, the industry is turning to real-time sensor processing, safety-critical intelligence, and physical AI to bridge perception and actuation. In line with this trend, Ceva, Inc. (NASDAQ: CEVA) announced that BOS Semiconductors has licensed its SensPro™ AI DSP architecture for the Eagle-A standalone ADAS Sys...

7 Jan 2026 | Wednesday | NEWS
Azimuth AI Secures New Funding to Scale Edge-AI Semiconductor Platform

Azimuth AI, a fast-growing semiconductor company with offices in Sacramento, California, and Hyderabad, India, is building custom edge-AI System-on-Chips (SoCs) for smart utilities, energy, and industrial infrastructure. The company announced the successful close of a new funding round led by Jetha Global, with participation from existing venture capital partners Moneta Ventures, AU...

7 Jan 2026 | Wednesday | NEWS
Chips & Media and Visionary.ai Launch World’s First AI-Based Full Image Signal Processor

Chips & Media, Inc. a leading hardware IP provider with more than 20 years of leadership in the multimedia industry, and Visionary.ai, the Israeli startup pioneering AI software for image processing, announced the launch of the world's first AI-based full Image Signal Processor (ISP). The new ISP offers a software-defined imaging pipeline that supercharges video quality in real time. The new ...

6 Jan 2026 | Tuesday | NEWS

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