• Thursday | 26 March 2026
Panmnesia and Openchip Sign AI Infrastructure Collaboration MOU at Mobile World Congress 2026

Panmnesia, a provider of advanced link solutions, announced that it has signed a Memorandum of Understanding (MOU) with Openchip, a European AI accelerator design company, at MWC26 in Barcelona. The agreement focuses on technical collaboration related to AI/HPC infrastructure. The agreement marks a step toward technical collaboration aimed at enhancing performance, scalability, and resource effic...

6 Mar 2026 | Friday | NEWS
Noble Machines Inc. Emerges from Stealth with First Industrial Robot Deployment to Fortune Global 500 Customer

Noble Machines Inc., formerly Under Control Robotics, announced its emergence from stealth with its first deployment of industrial general-purpose robots shipped to a Fortune Global 500 customer within 18 months of the company's launch. Founded in 2024 by a team of engineers from Apple, SpaceX, NASA, and Caltech, Noble Machines operates on the belief that AI must prove itself in real industrial op...

5 Mar 2026 | Thursday | NEWS
Semtech Corporation Acquires HieFo Corporation to Strengthen AI Optical Connectivity Portfolio

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) ...

5 Mar 2026 | Thursday | NEWS
MetaOptics Develops Compact Tunable Metalens Module for 3D Fingerprint Biometrics

MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group") has announced plans to develop a compact optical module for 3D non-contact fingerprint biometrics, designed to support future smartphone integration possibilities. The project enhances the Company's existing 3D sensing technology by reducing optical stack size and incorporating elec...

3 Mar 2026 | Tuesday | NEWS
SambaNova Survey Highlights Rising Public Concern Over AI Energy Demand

SambaNova, builders of the fastest chip for agentic AI, released research highlighting the mounting concerns over the energy demands of AI data centres and the impact on households and national power grids. As AI deployment accelerates, business leaders and consumers are aware that legacy, GPU-based infrastructure is not built for the efficiency and scale required in a power‑constrained wor...

3 Mar 2026 | Tuesday | NEWS
MaxLinear Showcases Sierra SoC for Next-Generation Open RAN Radios at MWC 2026

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of wireless infrastructure solutions, announced that it will demonstrate its newest advancements in RAN radio technologies at MWC Barcelona 2026. Attendees visiting meeting room 2L8MR in Hall 2 will see demonstrations of how MaxLinear’s Sierra single-chip radio SoC helps OEMs develop new innovative Open RAN Radio Units (O-RUs) addressing...

2 Mar 2026 | Monday | NEWS
Semtech Corporation Expands Smart Home Chip Strategy with Trident IoT Deal

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a definitive agreement with Trident IoT that positions Semtech’s LoRa Plus™ platform as the connectivity foundation for next-generation multi-protocol smart home and security solutions. With this agreeme...

27 Feb 2026 | Friday | NEWS
Toshiba Electronic Devices & Storage Corporation Launches 135°C Photorelays for Automotive Chip Testing

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched four voltage-driven photorelays, “TLP3407SRB,” “TLP3412SRB,“ ”TLP3412SRHB,“ and “TLP3412SRLB” housed in the small S-VSON4T package. The new photorelays deliver a maximum operating temperature rating of 135°C for equipment that operates at high temperatures. Volume ...

27 Feb 2026 | Friday | NEWS
First Solar, Inc. Secures Perovskite Patent License from Oxford Photovoltaics Limited

First Solar, Inc. (Nasdaq: FSLR) (“First Solar” or “the Company”) announced a patent licensing agreement that gives it access to existing issued patents and currently pending patent applications of Oxford Photovoltaics Limited (“Oxford PV”) The non-exclusive license paves the way for First Solar, the largest solar manufacturer in the Western Hemisphere and the ...

27 Feb 2026 | Friday | NEWS
MIPI Alliance Upgrades UniPro and M-PHY to Power Next-Gen UFS 5.0 Chips

The MIPI Alliance, an international organization that develops specifications that standardize wired interfaces for mobile and other connected ecosystems, announced major updates to two of its foundational specifications. MIPI UniPro v3.0 and MIPI M-PHY v6.0 offer significant performance, latency and power-efficiency improvements for next-generation JEDEC Universal Flash S...

27 Feb 2026 | Friday | NEWS
Marvell Technology, Inc. Showcases AI Data Center Connectivity Innovations at DesignCon 2026

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, announced it will showcase its latest data center connectivity products and technologies driving the next wave of AI innovation at DesignCon 2026 The primary bottleneck in AI data center infrastructure has shifted from compute to connectivity. Data center operators require scalable, ultra-high perfor...

27 Feb 2026 | Friday | NEWS
U.S. Court Rules Laser Components Infringed Patents Held by Sensor Electronic Technology, Inc.

In February 2026, a U.S. federal court ruled that Laser Components, a century-old global optics company, had infringed patents held by Sensor Electronic Technology, Inc. (SETi), a U.S.-based company that has focused on opto-semiconductor R&D and manufacturing for the past 25 years. The court ordered a permanent injunction banning the sale of the infringing products. The ruling applies not only...

26 Feb 2026 | Thursday | NEWS
Airspan Networks Holdings LLC Launches AirUnity Small Cells Powered by EdgeQ Chip

Airspan Networks Holdings LLC (“Airspan”), a leading global provider of wireless network solutions, announced the launch of AirUnity Small Cells, a next-generation small cell portfolio designed to help mobile network operators (MNOs) and enterprises expand 4G and 5G coverage and capacity through targeted deployments that support scalable network densification across diverse indoor and ...

26 Feb 2026 | Thursday | NEWS
Renesas Electronics Corporation ADAS SoC Selected for Toyota Motor Corporation RAV4

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced that its ADAS automotive system-on-chip (SoC), R-Car V4H, has been selected for the TSS(LSS) control unit used in Toyota Motor Corporation’s new RAV4 model, which debuted in December 2025. The control unit is supplied by Denso Corporation. Engineered for advanced ADAS (Advanced Drive...

26 Feb 2026 | Thursday | NEWS
Vinci Launches Thermo-Mechanical Simulation for Semiconductor Warpage Analysis

Vinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under real-world thermal conditions. This capability is built on the world’s first foundation model for physics, developed by Vinci to transform hardware design—mirroring how generative A...

26 Feb 2026 | Thursday | NEWS
Guerrilla RF, Inc. Expands Semiconductor Push into UAS and Counter-Drone Markets

Guerrilla RF, Inc. (OTCQX: GUER), a leading provider of state-of-the-art radio frequency (RF) and microwave semiconductors, announced its expanded focus and readiness to support the rapidly evolving Unmanned Aerial Systems (UAS) and Counter-UAS (C-UAS) markets. With a deep portfolio spanning low-noise small-signal devices through high-power RF power amplifiers, Guerrilla RF offers over 90 componen...

26 Feb 2026 | Thursday | NEWS
SambaNova Systems Unveils SN50 AI Chip, Plans Strategic Collaboration with Intel

SambaNova introduced their SN50 AI chip, which boasts a max speed that’s 5X faster than competitive chips. The company also announced a planned collaboration with Intel to deliver high‑performance, cost‑efficient AI inference solutions, and more than $350M in investment from new and existing investors. Positioned as the most efficient chip for agentic AI, the SN50 chip offers ...

25 Feb 2026 | Wednesday | NEWS
proteanTecs and Gubo Technologies Partner to Enhance AI Chip Visibility

proteanTecs®, a leading provider of deep data health and performance monitoring solutions for advanced electronics, and Gubo Technologies Co., Ltd., China’s first post silicon workflow automation solution provider, today announced a collaboration to deliver combined semiconductor analytics solutions. The collaboration is intended to provide broad, actionable insights into yield, quality,...

25 Feb 2026 | Wednesday | NEWS
Powerchip Semiconductor Manufacturing Company Partners with Intel and SoftBank to Develop AI Memory Alternative

Powerchip Semiconductor Manufacturing Company (PSMC) has joined forces with major technology players, including Intel and SoftBank, in a collaborative effort to develop an alternative memory solution to high-bandwidth memory (HBM) for artificial intelligence applications. The initiative aims to reduce reliance on existing memory technologies and strengthen supply chain resilience for next-generati...

24 Feb 2026 | Tuesday | NEWS
Meta Expands AI Data Center Infrastructure with NVIDIA Technology

Meta is significantly increasing its investment in artificial intelligence infrastructure by deploying a new generation of data centre systems powered by NVIDIA technologies. The expanded collaboration aims to support Meta’s advanced AI workloads and to enhance the performance and efficiency of its underlying compute platforms. The social media and technology company has continued to adopt ...

24 Feb 2026 | Tuesday | NEWS

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