• Sunday | 10 May 2026
Kyocera Corporation Launches Ceramic Core Substrate for Next-Generation AI Semiconductor Packaging

Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) announced that it is commercialising a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs(1) and switch ASICs, which are rapidly scaling in complexity as AI data centre architectures evolve. The new product will be unveiled at ECTC 2026, an international conference ...

29 Apr 2026 | Wednesday | NEWS
OKI Circuit Technology Develops 180-Layer PCB Technology for Next-Generation AI and HBM Testing

OKI Circuit Technology (OTC; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) (Note 1) mounted on AI semiconductors. This represents an approximat...

29 Apr 2026 | Wednesday | NEWS
NEO Semiconductor Validates 3D X-DRAM as Scalable Path for AI Memory

NEO Semiconductor, a leading innovator in advanced AI and memory technologies, announced successful proof-of-concept (POC) results for its 3D X-DRAM™ technology, marking a major milestone toward next-generation, high-density memory solutions for AI and data-centric systems. The company also announced a new strategic investment led by Stan Shih, Founder and former Chairman and CEO of Ac...

24 Apr 2026 | Friday | NEWS
Synopsys Expands Collaboration with TSMC to Advance AI Chip Design

Synopsys, Inc. (Nasdaq: SNPS) announced major advances in silicon-proven IP, AI-powered EDA flows, and system-level enablement across TSMC's most advanced processes and packaging technology nodes, including the TSMC 3nm and 2nm families, as well as A16™ with Super Power Rail and A14. By unifying intelligent digital, analogue, and verification flows, advanced 3D multi-die design, a...

24 Apr 2026 | Friday | NEWS
RoboSense Unveils SPAD-SoC Breakthrough to Lead Next Phase of LiDAR Commercialisation

RoboSense (HKEX: 2498), an AI-driven robotics technology company, hosted its 2026 Tech Day in Shenzhen, marking a landmark moment with the global debut of its pioneering self-developed SPAD-SoC architecture, EOCENE, and two flagship image-grade chipsets, Phoenix and Peacock. Alongside these core launches, RoboSense offered a strategic preview of its revolutionary...

22 Apr 2026 | Wednesday | NEWS
DEEPX and Hyundai Motor Group Forge Strategic Partnership to Commercialise Next-Gen Robotics AI

DEEPX (CEO Lokwon Kim), a pioneer in ultra-low-power AI semiconductor technology, and Hyundai Motor Group's Robotics LAB have announced a strategic collaboration to jointly develop a next-generation Physical AI computing platform for advanced robotics. The partnership aims to co-develop an AI computing architecture capable of running large-scale generative AI models in real time within robotic sy...

22 Apr 2026 | Wednesday | NEWS
InPHRED Expands into Data Centre Optical Interconnect Market

InPHRED, a developer of next-generation photonics solutions for consumer sensing and digital health, announced its formal expansion into the data centre optical interconnect market, extending its nanoporous platform into high-speed connectivity solutions for next-generation AI infrastructure. As demand for AI infrastructure surges and hyperscalers push for higher bandwidth density, lower power co...

21 Apr 2026 | Tuesday | NEWS
Mitate Zepto Technica, Inc. Partners in National AI Semiconductor Initiative to Advance Genome Analysis

Mitate Zepto Technica, Inc. (hereinafter "MZT"), based in Tokyo's Shibuya district, announced that it has joined the national research initiative "Next-Generation Edge AI Semiconductor Research and Development Program" promoted by the Japan Science and Technology Agency (JST). MZT participates as a designated social implementation and commercialisation partner for the research theme "Accelerating ...

21 Apr 2026 | Tuesday | NEWS
SK hynix Inc. Begins Mass Production of 192GB SOCAMM2 for AI Servers

SK hynix Inc. (or "the company", www.skhynix.com) announced that it has begun mass production of the 192GB SOCAMM2, a next-generation memory module standard based on the 1cnm process (sixth-generation of the 10-nanometer technology) LPDDR5X low-power DRAM. SOCAMM2[1] is a module that adapts low-power memory – previously used mainly in mobile products like smartphones - for server ...

21 Apr 2026 | Tuesday | NEWS
Artilux Unveils Hybrid Optoelectronic AI Architecture to Redefine Compute Efficiency

Artilux announced Inception™, an AI computing paradigm shift from conventional digital electronics to novel hybrid optoelectronics, delivering orders-of-magnitude improvements in both power and area efficiencies without relying on advanced CMOS process nodes and active cooling. As AI workloads continue to scale rapidly across cloud, edge, and on-device computing, traditional digital process...

17 Apr 2026 | Friday | NEWS
Camtek Expands AI Capabilities with Acquisition of Visual Layer

Camtek Ltd. (Nasdaq: CAMT) (TASE: CAMT), a leading developer and manufacturer of inspection and metrology equipment for the semiconductor industry, announced that it has signed a definitive agreement to acquire Visual Layer, a Tel Aviv-based AI company specialising in visual analytics. Visual Layer was founded by Danny Bickson, PhD and Amir Alush, PhD and is backed by leading Silicon Valley ...

15 Apr 2026 | Wednesday | NEWS
VLSI TSA 2026 Highlights Next Wave of AI, Quantum, and Semiconductor Innovation

The 2026 International Symposium on VLSI Technology, Systems and Applications (VLSI TSA), hosted by the Industrial Technology Research Institute (ITRI), is taking place in Hsinchu, Taiwan. Now in its 43rd year, the symposium remains a leading global forum for semiconductor innovation, bringing together over 800 experts from around the world. Discussions this year focus on generative AI infere...

15 Apr 2026 | Wednesday | NEWS
Supermicro Expands Edge AI Portfolio with AMD EPYC 4005-Powered Platforms

Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, announced a family of compact, high-efficiency platforms powered by AMD EPYC™ 4005 series processors. The edge-optimised systems are designed to accelerate AI inferencing and general-purpose workloads in space and power-constrained environments, including retail, manufacturing...

14 Apr 2026 | Tuesday | NEWS
VFabTech Targets Semiconductor Capacity Expansion with End-to-End Fab Engineering Expertise

As artificial intelligence, robotics, automation, and advanced computing continue to push demand for semiconductors to new heights, the pressure to expand manufacturing capacity has become one of the most urgent challenges facing the global chip industry. The bottleneck is not simply building new fabs. It requires getting the facility, tools, infrastructure, and processes right from the start...

14 Apr 2026 | Tuesday | NEWS
VITAL MedTech Showcases Semiconductor-Driven Medical Imaging Innovations at CMEF 2026

At CMEF 2026, VITAL MedTech, the healthcare unit of VITAL MATERIALS, unveiled a full range of innovations based on its semiconductor core technologies. It demonstrated its full vertical integration across core materials, chips, and medical systems. Technology Breakthrough: Mastering Core Components Development Technology Global medical imaging technology is transitioning from digitalisation...

14 Apr 2026 | Tuesday | NEWS
Snap Inc. and Qualcomm Technologies Partner to Power Next-Gen AR Eyewear

Specs Inc., a Snap subsidiary, and Qualcomm Technologies, Inc. announced a multi-year strategic agreement to power future generations of Specs with Qualcomm Technologies’ industry-leading Snapdragon system-on-a-chip (SoC). This is the first flagship engagement for Specs Inc., which is launching Specs, advanced eyewear that seamlessly integrates digital experiences into the physical wor...

13 Apr 2026 | Monday | NEWS
BrainChip Holdings Ltd Unveils Edge AI Radar Platform for Defence and Autonomous Systems

BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, BCHPY), the world’s first commercial producer of ultra-low-power, neuromorphic AI technology, announced the launch of its Radar Reference Platform. This fully validated hardware and AI stack is designed to provide real-time object classification at the edge, solving the critical "identification gap" that limits traditional radar ...

10 Apr 2026 | Friday | NEWS
Intel and Google Deepen Strategic Alliance to Power Next-Gen AI Infrastructure

Intel Corporation (NASDAQ: INTC) and Google announced a multiyear collaboration to advance the next generation of AI and cloud infrastructure, reinforcing the critical role of CPUs and custom infrastructure processing units (IPUs) in scaling modern, heterogeneous AI systems. As AI adoption accelerates, infrastructure is becoming more complex and heterogeneous, driving increased reliance on CPUs f...

10 Apr 2026 | Friday | NEWS
SK hynix Backs Semidynamics to Advance Memory-Centric AI Infrastructure

Semidynamics, an advanced computing company developing memory-centric AI infrastructure for large-scale inference, announced a strategic investment from SK hynix, one of the world's leading memory manufacturers. The investment reflects a shared conviction that memory architecture, not compute alone, will define the economics of next-generation AI inference, where cost per token is the me...

9 Apr 2026 | Thursday | NEWS
Cyient Semiconductors Acquires Majority Stake in Kinetic Technologies for $85 Million

Kinetic Technologies (Kinetic) announced that it has completed the necessary steps to enter into an agreement under which Cyient Semiconductors has secured a majority stake in Kinetic for a total consideration of $85 million USD. The strategic investment marks a significant step in accelerating research and product development, while strengthening Kinetic's ability to serve global c...

9 Apr 2026 | Thursday | NEWS

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