• Thursday | 22 October 2026
World Manufacturing Convention 2026 Secures $54.2 Billion in Project Agreements

The 2026 World Manufacturing Convention concluded with 790 project agreements representing RMB 363.4 billion (approximately US$54.2 billion), organisers announced at a Sept. 29 Anhui briefing. Held Sept. 20–23 under the theme "Intelligent Manufacturing for a Better Future," it featured keynote addresses, business matchmaking, research and data releases, and exhibitions. Guests and exhibito...

2 Oct 2026 | Friday | NEWS
Synopsys and OpenAI Partner to Develop GPT-Synopsys for Semiconductor Design

Synopsys (Nasdaq: SNPS) and OpenAI announced a strategic partnership that brings together OpenAI's advanced AI capabilities with Synopsys' industry-leading EDA tools and agentic AI capabilities to revolutionise the design of semiconductors. The companies signed an expansive, multi-year agreement to jointly develop GPT-Synopsys, a specialised model, optimised to use Synopsys EDA tools to perform se...

2 Oct 2026 | Friday | NEWS
AI Moves Deeper into Semiconductor Design as Chipmakers Automate More Development Tasks

Artificial intelligence is becoming increasingly involved in semiconductor development, moving beyond individual optimisation tasks to support wider parts of the chip-design process. Electronic design automation (EDA) companies have already introduced machine-learning and reinforcement-learning tools for areas such as floorplanning, placement, routing and power, performance and area (PPA) optimisa...

1 Oct 2026 | Thursday | NEWS
Intel Patents Glass Substrate Packaging with Embedded MicroLEDs for Advanced Chip Connectivity

Intel has secured a US patent describing a chip-packaging approach that places MicroLEDs directly within a glass substrate, potentially opening another route towards optical connectivity inside advanced semiconductor packages. The design embeds semiconductor dies equipped with MicroLEDs into glass and uses through-glass vias (TGVs) to provide the required power and signal connections. The LEDs can...

1 Oct 2026 | Thursday | NEWS
Renesas Launches 650V GaN Device with Dual-Side Cooling for 800V AI Datacentres

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, launched the industry's first 650V GaN device with dual-side cooling for high-density power conversion in 800V high-voltage DC (HVDC) AI data centre architectures. The new TP65H020G4PLSGBD D-Mode device delivers 20 milliohms (mΩ) on-resistance — one of the lowest in its class — in...

1 Oct 2026 | Thursday | NEWS
UL Solutions Launches Certification Programme for Liquid Cooling Components in AI Datacentres

AI chips generate intense heat, making effective cooling essential to data centre performance and reliability. The certification provides a consistent way to assess critical cooling components before deployment in AI data centres. Certification can help manufacturers demonstrate product readiness and help data centre customers make informed purchasing and integration decisions. UL Solut...

1 Oct 2026 | Thursday | NEWS
LG Innotek Expands Semiconductor Substrates and Physical AI Businesses for Future Growth

LG Innotek is demonstrating tangible results from its business portfolio transformation, delivering a remarkable performance rebound in the first half of the year—traditionally an off-peak season for the company. For the first half of the year, LG Innotek posted revenue of USD 8.22 billion and an operating profit of USD 401.96 million, representing year-over-year increases of 24 per cent an...

1 Oct 2026 | Thursday | NEWS
Ezurio Launches BL54LM20 Series with More Memory and On-Device Processing for IoT

Semicon Leaders Asia speaks with Jonathan Kaye, VP of Product Management and Marketing at Ezurio, about the company’s BL54LM20 Series, growing demand for higher memory and connectivity in IoT devices, the move towards on-device processing, and the opportunities for secure, low-power Edge AI across connected products. Q. What customer and market needs are driving the launch of the BL54L...

1 Oct 2026 | Thursday | Interaction
Hanmi Semiconductor Secures $5.8 Million MSVP Equipment Order from UTAC Thailand

South Korean semiconductor equipment maker Hanmi Semiconductor has secured a KRW 7.87 billion (approximately US$5.8 million) order from UTAC Thailand, the Thai subsidiary of Singapore-based semiconductor packaging and testing company UTAC. The order covers Hanmi Semiconductor’s micro SAW & VISION PLACEMENT (MSVP) equipment and is scheduled to run until 28 December 2026. The value of the ...

30 Sep 2026 | Wednesday | NEWS
Teradyne Launches Magnum E2 Memory Test System for Advanced DRAM and NAND

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, announced Magnum E2, a next-generation high-speed memory test system for advanced DRAM and flash interfaces, including LPDDR6, DDR6, GDDR7, and NAND flash. Built on Teradyne's proven Near-DUT Test (NDT) architecture, the foundation of the widely deployed Magnum EPIC platform, Magnum E2 supports both...

30 Sep 2026 | Wednesday | NEWS
MIPS and Xcelsa Labs Partner to Speed Custom Silicon Development with AI Design Optimisation

Accelerating the path to custom silicon: MIPS processor IP and Xcelsa’s Apex platform help customers move from software and workload requirements to formally verified, differentiated silicon faster. Optimizing hardware for demanding workloads: The collaboration combines MIPS’ software-first, workload-focused platforms with AI-driven design optimization to improve performance, powe...

30 Sep 2026 | Wednesday | NEWS
SEMIFIVE Signs $52 Million AI Inference Accelerator Development Contract in North America

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced that it has signed a contract worth approximately KRW 70.3 billion (USD 52 million) with a U.S.-based AI fabless company to develop a next-generation AI inference accelerator. The project marks SEMIFIVE's first "Spec Hand-off" engagement in the North American market. The contract alone represents more than ...

30 Sep 2026 | Wednesday | NEWS
SUNON Showcases Liquid Cooling Solutions for AI Datacentres

As AI computing continues to advance at an unprecedented pace, rising chip power densities and increasing thermal loads in data centers are creating new challenges for thermal management. Liquid cooling is rapidly becoming a critical technology for supporting the next generation of AI infrastructure. At the 2026 OCP Global Summit, SUNON will showcase its latest liquid cooling innovations under th...

30 Sep 2026 | Wednesday | NEWS
Hanmi Semiconductor Ships First FC Bonder 75 to Expand AI Advanced Packaging Portfolio

South Korean semiconductor equipment manufacturer Hanmi Semiconductor has shipped its first FC Bonder 75 system to a global customer, marking a move into advanced packaging equipment for AI system semiconductors. The company has traditionally been known for its thermal compression (TC) bonding equipment used in high-bandwidth memory (HBM) production, while the new system broadens its focus towards...

29 Sep 2026 | Tuesday | NEWS
Wise Integration and Navitas Partner to Advance GaN and SiC Power Solutions for AI Datacentres

Wise Integration has announced a collaboration with Navitas Semiconductor to develop next-generation power-conversion solutions aimed at supporting the rapidly growing power requirements of artificial intelligence and high-performance computing systems. Under the collaboration, the two companies will combine Wise Integration’s digital power-control capabilities with Navitas Semiconductor&rsq...

29 Sep 2026 | Tuesday | NEWS
Synopsys Launches AgentEngineer Portfolio to Advance Autonomous Silicon-to-Systems Engineering

Synopsys, Inc. (Nasdaq: SNPS) announced Synopsys AgentEngineer™ solutions, the industry's broadest portfolio of domain-specific long-horizon agents that can reason, plan, and execute complete engineering workflows from silicon to systems across verification, system validation, implementation, analog, manufacturing, and simulation and analysis domains. Built on the Synopsys Autopilo...

29 Sep 2026 | Tuesday | NEWS
Wolfspeed Launches Premium 200 mm SiC Substrate to Improve Device Manufacturing Yield

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide (SiC) technology, announced the commercial availability of its new Premium 200 mm n-type silicon carbide substrate, expanding its 200 mm SiC materials portfolio with a higher-quality starting material designed to improve yield through reduced defects and greater wafer-shape stability. As the SiC devices industry pushes toward higher...

29 Sep 2026 | Tuesday | NEWS
POLYN Advances VibroSense TMS Chip for Real-Time Tyre-Road Friction Detection

POLYN Technology, developer of innovative application-specific neuromorphic analogue signal-processing (NASP™) chips, announced a major milestone in the rollout of its VibroSense TMS solution, which tests have already shown enhances vehicle safety through improved braking. The VibroSense TMS engineering chip, the integrated circuit for tire-road friction detection, is being delivered for as...

29 Sep 2026 | Tuesday | NEWS
Shanghai Chengwei Launches High-Purity Chemical Delivery Systems for Advanced Manufacturing

Shanghai Chengwei Semiconductor Equipment has announced the global commercial launch of new high-purity chemical delivery and bulk chemical distribution systems designed for advanced semiconductor manufacturing. The company said the systems are intended to support stringent contamination-control requirements in semiconductor fabs, as well as flat-panel display and photovoltaic production facilitie...

28 Sep 2026 | Monday | NEWS
Tower Semiconductor Plans US$3 Billion Japan Expansion for Silicon Photonics and Optical Packaging

  Tower Semiconductor is set to invest up to US$3 billion in expanding its semiconductor manufacturing operations in Japan, with additional government support taking the total investment to around US$4 billion. The expansion is aimed at creating a large-scale manufacturing hub for silicon photonics, silicon-germanium electronic integrated circuits and advanced optical packaging. ...

28 Sep 2026 | Monday | NEWS

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