• Wednesday | 24 June 2026
SEMIFIVE and ICY Tech Achieve Tape-Out of 8nm eMRAM-Based Edge AI SoC

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, and ICY Tech, a Chinese AI semiconductor company, announced the successful tape-out of a next-generation Edge AI SoC jointly developed utilising Samsung Foundry's 8nm (8LPU) embedded Magnetic Random Access Memory (eMRAM) technology. This marks a significant milestone toward the first commercial deployment of 8nm ...

4 Jun 2026 | Thursday | NEWS
ASPEED and Lattice Partner to Deliver Flexible Server Management for AI Data Centres

ASPEED Technology, the global leader in Baseboard Management Controllers (BMC) and Lattice Semiconductor (NASDAQ: LSCC), the low-power programmable leader, announced a strategic partnership to advance flexible, growth-oriented control capabilities for next-generation datacenter systems. As a first commercial result of this collaboration, ASPEED introduced the AST1840 Satellite Management Con...

3 Jun 2026 | Wednesday | NEWS
Nordic Semiconductor Expands AI Across the Entire IoT Development Lifecycle

Nordic Semiconductor (OSE: NOD), a global leader in low-power wireless connectivity solutions, brings AI-assisted development to all parts of the IoT device lifecycle. Nordic's complete chip-to-cloud solution is the first in wireless IoT to enable AI-assisted workflows across every stage - from the prototype to the deployed fleet. For developers, Nordic's AI capabilities deliver three concrete be...

3 Jun 2026 | Wednesday | NEWS
Imec and EVG Advance Hybrid Bonding Technology for Next-Generation 3D Chip Architectures

IEEE Electronic Components and Technology Conference (ECTC), imec, a world-leading research and innovation hub in advanced semiconductor technologies, and EV Group (EVG), leading provider of semiconductor manufacturing equipment and process solutions, present a robust and highly yielding wafer-to-wafer hybrid bonding technology at 200nm Cu interconnect pad pitch, demonstrated on a test vehicl...

3 Jun 2026 | Wednesday | NEWS
AuthenX Unveils Detachable Optical Interconnect Technology to Accelerate AI Data Centre Scaling

AuthenX Inc., a leading innovator in high-speed optical interconnect solutions, announced its exhibition lineup for COMPUTEX Taipei 2026 (June 2–5). The company will present advanced silicon photonics and meta-optics portfolios designed to eliminate the critical physical constraints impeding next-generation AI and HPC cluster scaling. The showcase will be headlined by the first live technica...

3 Jun 2026 | Wednesday | NEWS
Samsung Ships Industry’s First 12-Layer HBM4E Samples to Strengthen AI Memory Leadership

Samsung Electronics, a global leader in advanced memory technology, has begun shipping the industry's first 12-layer HBM4E samples to major global customers, further strengthening its leadership in the next-generation HBM market. Following the industry’s first mass production and commercial shipment of its industry-leading HBM4 earlier this year, Samsung now extends its HBM roadmap with the...

3 Jun 2026 | Wednesday | NEWS
HPE Launches NVIDIA Vera-Powered Server for Agentic AI and High-Performance Computing

COMPUTEX – HPE (NYSE: HPE) announced the expansion of its industry-leading server portfolio with the introduction of the HPE ProLiant Compute DL394 Gen12, powered by NVIDIA Vera CPU. This next-generation server is engineered specifically to address the compute demands of emerging high-performance AI and data processing workloads, delivering industry-leading agentic AI CPU performance, m...

3 Jun 2026 | Wednesday | NEWS
Cadence Unveils Autonomous AI Design Engineer to Accelerate Chip Verification

At Computex 2026, Cadence (Nasdaq: CDNS) announced the industry’s first fully autonomous virtual agentic AI design engineer, extending the ChipStack™ AI Super Agent to Level-5 autonomy. Built on Cadence’s AI-driven electronic design automation (EDA) portfolio with NVIDIA Nemotron models and secured by NVIDIA OpenShell runtime, the new agentic capabilities enab...

2 Jun 2026 | Tuesday | NEWS
Invisix Raises €20 Million to Advance Semiconductor Metrology Technology

Invisix, the semiconductor metrology company developing next-generation measurement tools for advanced chip manufacturing, has raised an oversubscribed €20 million seed round, which includes Hitachi Ventures, Transition Ventures, and imec. xpand, Doosan Investment Co., and a tier-1 semiconductor manufacturer. The funding will be used to grow the Invisix team, accelerate development of its fir...

2 Jun 2026 | Tuesday | NEWS
XCENA Raises $135 Million to Accelerate Global Growth in AI Memory Computing

XCENA, providing memory-centric computing solutions for AI infrastructure, announced it has closed $135 million (KRW 202 billion) in a Series B financing round. XCENA will use the funding to accelerate the company’s global expansion, scale customer deployments, and advance its next-generation computational memory solution. Total fundraising now stands at $185 million with a current valu...

2 Jun 2026 | Tuesday | NEWS
Altium Backs Mexico’s Semiconductor Talent Drive Through Mayan-on-Chip Programme

Altium, a global leader in software and solutions for the electronics industry, announced the successful completion of the first Mayan-on-Chip cohort through Altium Education. Mayan-on-Chip is a regional initiative designed to develop highly specialised semiconductor and electronics design talent in Yucatán, Mexico. Altium Education joined academic, government, and industry leaders to celeb...

2 Jun 2026 | Tuesday | NEWS
Cadence and Samsung Foundry Expand 2nm AI Design Partnership

Cadence (Nasdaq: CDNS) and Samsung Foundry announced the development of a full portfolio of Memory and Interface IP and expanded certification of Cadence’s agentic AI digital, custom, 3D‑IC and system design and analysis (SDA) flows for Samsung Foundry’s second-generation 2nm process technology. This collaboration delivers a sign-off-ready platform for next‑generation AI infrastruc...

2 Jun 2026 | Tuesday | NEWS
Keysight Technologies, Inc. Introduces AI-Ready RF Design Workflow Platform to Capture Engineering Expertise

Keysight Technologies, Inc. (NYSE: KEYS) announced a new capability within its RF Circuit Simulation Professional software, which enables engineers to capture their design process on an executable whiteboard. It replicates the engineer’s decision process, capturing simulations, optimisations, decision trees, and design parameters built on prior analyses. Each step generates editable Pyt...

1 Jun 2026 | Monday | NEWS
Qnity Electronics, Inc. Wins 2025 ASE Best Supplier Award for Advanced Packaging Materials

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced it received the 2025 ASE Best Supplier Award from ASE Technology Holding Co., Ltd., one of the world’s largest outsourced semiconductor assembly and test providers (OSATs), headquartered in Taiwan, for its silicone-based materials. An honor besto...

1 Jun 2026 | Monday | NEWS
FuriosaAI and Broadcom Partner on Next-Generation AI Accelerator for Hyperscale Inference

FuriosaAI, a builder of high-performance inference silicon, announced a strategic partnership with Broadcom (NASDAQ: AVGO) to develop its third-generation AI accelerator. This collaboration evolves Furiosa’s Tensor Contraction Processor (TCP) architecture into a scale-up inference platform engineered for serving frontier agentic systems at a massive scale in a global hyperscale environment. ...

1 Jun 2026 | Monday | NEWS
RFMW Signs Global Distribution Agreement with RFHIC

RFMW, a Division of Exponential Technology Group, Inc., a premier distributor of RF, microwave, and power components, announced a global distribution agreement with RFHIC, a compound semiconductor company specialising in high-power GaN-based RF and microwave solutions for wireless infrastructure, radar, and RF energy applications. Under the agreement, RFMW will provide global technical sales supp...

1 Jun 2026 | Monday | NEWS
GigaDevice Secures Multi-Product Automotive Design Wins with Brazil’s Tury

GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, announced a broad multi-product design wins and strategic collaboration with Tury, a leading automotive electronics manufacturer in Brazil. This milestone underscores GigaDevice’s accelerating expansion into the Latin American automotive...

1 Jun 2026 | Monday | NEWS
TDK Ventures Inc. Invests in C2i Semiconductors to Boost AI Data Centre Power Efficiency

TDK Corporation (TSE:6762) announced that TDK Ventures Inc. has invested in C2i Semiconductors, a pioneer in software-defined Voltage Regulator (VR) platforms. The investment is part of C2i’s $16.7 million Series A funding round, which includes participation from Peak XV Partners and other prominent semiconductor industry leaders. Solving the “Last-Inch” power challenge As AI w...

1 Jun 2026 | Monday | NEWS
Polar Semiconductor, LLC and Nexperia B.V. Partner to Expand US Power MOSFET Manufacturing Capacity

Polar Semiconductor, LLC and Nexperia B.V. announced a strategic collaboration to manufacture next‑generation power MOSFET devices at Polar Semiconductor’s U.S.-- based wafer foundry. The partnership supports an expanded power MOSFET portfolio while strengthening supply for customers worldwide. By combining Polar’s deep expertise in power semiconductor manufacturing and ongoing capa...

29 May 2026 | Friday | NEWS
Aeonsemi Begins Production Shipments of Next-Generation ChronoPHY Ethernet Transceiver for AI Edge Infrastructure

Aeonsemi (www.aeonsemi.com), an innovator of mixed-signal and DSP connectivity ICs, today announced production shipments of AS22010, the second generation of its ChronoPHY™ multi-rate 10GBASE-T Ethernet transceiver family. The AS22010 reduces typical per-port power by 40% compared to the previous generation while simultaneously improving link stability, electromagnetic interference (EMI) imm...

29 May 2026 | Friday | NEWS

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