• Sunday | 10 May 2026
Kyocera Corporation Launches Ceramic Core Substrate for Next-Generation AI Semiconductor Packaging

Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) announced that it is commercialising a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs(1) and switch ASICs, which are rapidly scaling in complexity as AI data centre architectures evolve. The new product will be unveiled at ECTC 2026, an international conference ...

29 Apr 2026 | Wednesday | NEWS
Kingston Digital, Inc. Expands DC3000ME Gen5 SSD Line with New 30.72TB Enterprise Model

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced the launch of the Kingston DC3000ME Gen5 U.2 NVMe SSD with a new high-capacity 30.72TB1 option, expanding the DC3000ME family to address the growing storage density and performance demands of modern data centres. The DC3...

28 Apr 2026 | Tuesday | NEWS
Seoul Viosys Accelerates Expansion into Next-Generation Photonics and Optical Interconnects

Seoul Viosys (KOSDAQ: 092190), a company specialising in opto-semiconductor devices, is accelerating its entry into the next-generation photonics market supported by its proprietary “No-wire” and “No-package” fundamental patents—essential technologies for micrometre (μm)-scale miniaturisation of opto-semiconductors—as well as its competitiveness in VCSEL...

28 Apr 2026 | Tuesday | NEWS
Palliser Capital Urges SMC Corporation to Unlock Shareholder Value Through ¥600 Billion Buyback

Palliser Capital (“Palliser”), a top 25 shareholder of SMC Corporation (“SMC” or the “Company”),  published a comprehensive plan (“Value Enhancement Plan”) outlining the opportunities available to unlock substantial long-term value at the Company. To promote market transparency and respond to growing interest from shareholders and other stakeho...

28 Apr 2026 | Tuesday | NEWS
Trio-Tech International Announces $10 Million Registered Direct Offering

Trio-Tech International (“Trio-Tech” or the “Company”) (NYSE MKT: TRT), a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced that it has entered into securities purchase agreements with fundamental institutional investors for the purchase and sale of 1,052,632 shares of its common stock in a regist...

28 Apr 2026 | Tuesday | NEWS
Omdia Raises 2026 Semiconductor Revenue Forecast on Surging Memory Demand

Omdia has significantly raised its semiconductor revenue forecast for 2026 to 62.7%, again reflecting unprecedented growth in DRAM and NAND driven by sustained demand and ongoing supply shortages expected to persist through the year. The DRAM market is forecast to nearly double in value, while the smaller NAND segment could quadruple compared to 2025. Supply constraints in conventional memory IC ...

28 Apr 2026 | Tuesday | NEWS
Marvell Technology, Inc. Acquires Polariton to Advance Next-Generation Optical Connectivity

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, announced the acquisition of Polariton Technologies, a developer of high-speed, low-power plasmonics-based silicon photonics devices. The acquisition strengthens Marvell’s optical technology portfolio by adding advanced modulation capabilities that enable continued scaling in bandwidth, power ef...

28 Apr 2026 | Tuesday | NEWS
Taiwan Semiconductor Manufacturing Company Unveils A13 Process to Advance AI, HPC and Next-Generation Semiconductor Innovation

TSMC (TWSE: 2330, NYSE: TSM) debuted its latest innovation in its most advanced process technology at the Company’s 2026 North America Technology Symposium. TSMC’s new A13 process is a direct shrink of its industry-leading A14 node announced in 2025, enabling even more compact and efficient designs to address insatiable customer demand in computational requirements for next-generation ...

27 Apr 2026 | Monday | NEWS
JEDEC Solid State Technology Association Previews Next-Generation LPDDR6 Enhancements for AI and Data Centre Workloads

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, previewed a set of new features planned for incorporation into the next version of its JESD209‑6 LPDDR6 standard. Building on the foundational JESD209‑6 published in July 2025, JEDEC’s JC‑42.6 Subcommittee has been working to enhance the next version of th...

27 Apr 2026 | Monday | NEWS
Wolfspeed, Inc. Appoints Yasuhisa Harita as Asia Pacific Regional President

Wolfspeed, Inc. announced the appointment of Yasuhisa Harita as regional president for Asia Pacific. Harita will be based in Tokyo and lead Wolfspeed’s commercial strategy across Japan, Korea and the ASEAN region with responsibility for driving revenue growth, enhancing strategic customer relationships, and executing the company’s regional commercial and operational objectives. Harita...

27 Apr 2026 | Monday | NEWS
GigaDevice Launches GD32F5HC Microcontroller Series for HMI and IoT Edge Applications

GigaDevice, a leading global supplier of semiconductor devices, announced the official launch of the GD32F5HC series 32‑bit general‑purpose microcontrollers. Designed with compact size, high frequency operation, large memory, and strong security, while also offering ultra‑low power consumption and rich peripheral configuration, the new series expands the GD32 Arm® Cortex®...

27 Apr 2026 | Monday | NEWS
SK hynix Inc. Wins IEEE Corporate Innovation Award for Leadership in AI Memory

SK hynix Inc. (or "the company", www.skhynix.com) announced that it received the Corporate Innovation Award at the '2026 IEEE1 Honours Ceremony' held in New York on the 24th (local time). IEEE is the world's largest technical professional organisation dedicated to advancing technology for the benefit of humanity. Established more than a century ago, the IEEE Awards Program recognises in...

27 Apr 2026 | Monday | NEWS
Arasan Launches UFS 5.0 Host Controller IP for High-Performance Mobile and Edge AI Applications

Arasan extends its long history of support for JEDEC and MIPI standards with the immediate availability of UFS 5.0 Host controller IP. Arasan's UFS 5.0 Host Controller IP supports a maximum throughput of 46.694 Gbps with M-PHY HS-Gear 6 operation, providing very high data transfer rates with low power consumption for advanced mobile applications such as high-end smartphones and edge AI devices. A...

27 Apr 2026 | Monday | NEWS
MetaOptics Ltd Secures Design Wins and Advances Commercialisation of Metalens Technology

MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group") is pleased to announce that it has achieved a progressive milestone in securing design/evaluation orders of its metalenses and modules from world-class customers. As announced in the Company's annual report for the financial year ended 31 December 2025, the Company noted that custo...

24 Apr 2026 | Friday | NEWS
Synopsys Expands Collaboration with TSMC to Advance AI Chip Design

Synopsys, Inc. (Nasdaq: SNPS) announced major advances in silicon-proven IP, AI-powered EDA flows, and system-level enablement across TSMC's most advanced processes and packaging technology nodes, including the TSMC 3nm and 2nm families, as well as A16™ with Super Power Rail and A14. By unifying intelligent digital, analogue, and verification flows, advanced 3D multi-die design, a...

24 Apr 2026 | Friday | NEWS
Arasan Chip Systems Achieves ASIL-D Certification for CAN XL IP

Arasan Chip Systems, the industry's leading provider of IP for Mobile and Automobile SoCs, announced that its CAN XL IP has achieved the ASIL-D Certification. The CAN  XL IP has been independently certified by SGS-TÜV Saar as ASIL-D, the highest safety level of functional safety defined in ISO 26262, the international standard for functional safety in road vehicles.   The CAN ...

24 Apr 2026 | Friday | NEWS
Neurophos Rapidly Expands Team with Senior Hires from NVIDIA, Intel, and Qualcomm

 Neurophos, a leader in photonic AI chip technology, announced it has nearly tripled in headcount since closing its $110M Series A round in January 2026. In less than six months, the company has grown by nearly 3x — a trajectory that reflects both the importance and the opportunity for next-generation AI compute infrastructure. The latest wave of hires brings deep industry experience t...

23 Apr 2026 | Thursday | NEWS
yieldWerx Enters Taiwan Semiconductor Market via Strategic Collaboration

yieldWerx is expanding its presence in Taiwan through a collaboration with Enlight Technology Co., Ltd., bringing advanced test data aggregation and analysis capabilities to one of the world's most concentrated semiconductor markets. The collaboration combines Enlight Technology's established role across Taiwan's semiconductor design, manufacturing, and research landscape with yieldWerx's experti...

23 Apr 2026 | Thursday | NEWS
Expedera Wins “Best Edge AI Processor IP” at 2026 Edge AI Awards

Expedera, a leading provider of AI accelerator IP for edge and data–centre systems,  announced that its Origin Evolution™ NPU IP has been named "Best Edge AI Processor IP" in the 2026 Edge AI and Vision Product of the Year Awards, presented by the Edge AI and Vision Alliance. The award recognises innovative building–block IP powering edge AI and visi...

23 Apr 2026 | Thursday | NEWS
CVD Equipment Corporation Advances Silicon Carbide Manufacturing with Successful Boule Growth

CVD Equipment Corporation (NASDAQ: CVV) announced the successful growth of single-crystal silicon carbide (SiC) boules grown on CVD Equipment (CVDE) Physical Vapour Transport (PVT) Systems and characterised by Stony Brook University (SBU) in support of their new semiconductor research centre, “onsemi Research Centre for Wide Bandgap Materials”. The SiC boule was analyzed at SBU a...

23 Apr 2026 | Thursday | NEWS

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