• Sunday | 10 May 2026
Kioxia Corporation Launches EG7 Series SSDs with Next-Gen QLC Technology

Kioxia Corporation announced KIOXIA EG7 Series solid state drives (SSDs), the first client solution to adopt Kioxia’s BiCS FLASH™ generation 8 4-bit-per-cell, quadruple-level cell (QLC) technology. The QLC-based KIOXIA EG7 Series delivers equivalent performance as TLC-based solutions(1), enabling better total cost of ownership (TCO) for value-oriented slim laptops, as well as comm...

23 Apr 2026 | Thursday | NEWS
Syenta Secures $26M to Tackle AI Chip Packaging Bottlenecks

Syenta, a next-generation semiconductor company developing advanced packaging solutions, announced it has raised $26 million in Series A funding led by Playground Global and Australia’s National Reconstruction Fund (NRF), with participation from existing investors Investible, Salus Ventures, Jelix Ventures and Wollemi Capital. This brings the company’s total funding to date to more tha...

23 Apr 2026 | Thursday | NEWS
AXT Announces $550 Million Public Offering of Common Stock

AXT, Inc. (NasdaqGS: AXTI) (“AXT” or the “Company”), a leading manufacturer of compound semiconductor wafer substrates, announced today the pricing of an underwritten public offering of 8,560,311 shares of common stock at a price to the public of $64.25 per share. The gross proceeds to the Company from the offering are expected to be approximately $550 million, before deduc...

22 Apr 2026 | Wednesday | NEWS
Magnachip Launches New MOSFETs for Smartphone Battery Protection

Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the launch of two new 8th-generation Ultra Low-Ron 12V low-voltage (LV) MOSFETs designed for high-performance smartphone battery protection circuits (PCMs). These new products target next-generation smartphones, where ultra-fast charging and energy efficiency are increasingly critical, and represent an expansion of M...

22 Apr 2026 | Wednesday | NEWS
Teledyne e2v Launches Caiman Module to Strengthen Position in Low-Light Imaging Market

Teledyne e2v, a global innovator of imaging solutions, announced the launch of the Caiman™ imaging module, a small, lightweight, low-power solution designed for demanding low-light applications. Built around the OnyxMax™ sensor, Caiman delivers high quantum efficiency, high spatial resolution in the near-infrared spectral band, and low noise performance, prov...

22 Apr 2026 | Wednesday | NEWS
RoboSense Unveils SPAD-SoC Breakthrough to Lead Next Phase of LiDAR Commercialisation

RoboSense (HKEX: 2498), an AI-driven robotics technology company, hosted its 2026 Tech Day in Shenzhen, marking a landmark moment with the global debut of its pioneering self-developed SPAD-SoC architecture, EOCENE, and two flagship image-grade chipsets, Phoenix and Peacock. Alongside these core launches, RoboSense offered a strategic preview of its revolutionary...

22 Apr 2026 | Wednesday | NEWS
DEEPX and Hyundai Motor Group Forge Strategic Partnership to Commercialise Next-Gen Robotics AI

DEEPX (CEO Lokwon Kim), a pioneer in ultra-low-power AI semiconductor technology, and Hyundai Motor Group's Robotics LAB have announced a strategic collaboration to jointly develop a next-generation Physical AI computing platform for advanced robotics. The partnership aims to co-develop an AI computing architecture capable of running large-scale generative AI models in real time within robotic sy...

22 Apr 2026 | Wednesday | NEWS
InPHRED Expands into Data Centre Optical Interconnect Market

InPHRED, a developer of next-generation photonics solutions for consumer sensing and digital health, announced its formal expansion into the data centre optical interconnect market, extending its nanoporous platform into high-speed connectivity solutions for next-generation AI infrastructure. As demand for AI infrastructure surges and hyperscalers push for higher bandwidth density, lower power co...

21 Apr 2026 | Tuesday | NEWS
LG Innotek Wins Major Automotive Wi-Fi 7 Deal to Accelerate Connected Car Strategy

LG Innotek (CEO Moon Hyuksoo) announced this month that it will supply its Automotive Wi-Fi 7 Communication Module, featuring cutting-edge Wi-Fi technology, to a leading European automotive parts company. The order is worth approximately USD 68M. Mass production of the module will begin in 2027. LG Innotek's Automotive Wi-Fi 7 Communication Module will be integrated into Audio, Video, and Navigat...

21 Apr 2026 | Tuesday | NEWS
Mitate Zepto Technica, Inc. Partners in National AI Semiconductor Initiative to Advance Genome Analysis

Mitate Zepto Technica, Inc. (hereinafter "MZT"), based in Tokyo's Shibuya district, announced that it has joined the national research initiative "Next-Generation Edge AI Semiconductor Research and Development Program" promoted by the Japan Science and Technology Agency (JST). MZT participates as a designated social implementation and commercialisation partner for the research theme "Accelerating ...

21 Apr 2026 | Tuesday | NEWS
SK hynix Inc. Begins Mass Production of 192GB SOCAMM2 for AI Servers

SK hynix Inc. (or "the company", www.skhynix.com) announced that it has begun mass production of the 192GB SOCAMM2, a next-generation memory module standard based on the 1cnm process (sixth-generation of the 10-nanometer technology) LPDDR5X low-power DRAM. SOCAMM2[1] is a module that adapts low-power memory – previously used mainly in mobile products like smartphones - for server ...

21 Apr 2026 | Tuesday | NEWS
Global AMOLED Display Market Faces 7% Contraction in 2026, Says Omdia

AMOLED smartphone display shipments are expected to decline sharply in 2026 amid rising memory prices and increasing market uncertainty, according to Omdia’s latest OLED Display Market Tracker. A surge in memory prices since the second half of 2025 has significantly increased component costs for smartphones, putting pressure on pricing for new models in 2026. Chinese smartphone brands,...

21 Apr 2026 | Tuesday | NEWS
Cirrus Logic Expands Industrial Portfolio with New Imaging IC Family

Cirrus Logic (NASDAQ: CRUS) announced the launch of a new family of industrial imaging integrated circuits (ICs) designed for high-precision scanning systems. This expands Cirrus Logic’s industrial portfolio and delivers a high-performance, highly integrated analogue front-end solution for multi-function printers, scanners, and advanced industrial imaging platforms. Designed for applic...

20 Apr 2026 | Monday | NEWS
Toshiba Electronic Devices & Storage Corporation Launches SmartMCD Motor Control Device for Automotive Electrification

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has begun shipping engineering samples of “TB9M030FG,” the latest addition to its “SmartMCD™”[1] series of motor control devices. The new device integrates a microcontroller (MCU) and a motor driver, and incorporates sensorless control technology for low‑speed operation of threeâ€...

20 Apr 2026 | Monday | NEWS
Teradyne Acquires TestInsight to Strengthen Semiconductor Test Capabilities

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment (ATE) and advanced robotics, announced it has acquired TestInsight, a leading provider of semiconductor test development, validation, and conversion software widely used across the industry. TestInsight's advanced tools and expert team will be pivotal in accelerating the development of test solutions on Teradyne...

20 Apr 2026 | Monday | NEWS
Cadence Design Systems and Google Cloud Partner to Advance AI-Driven Chip Design

Cadence, an industry leader in AI-driven computational software for semiconductor and system design, announced a strategic collaboration with Google to optimise the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud. This collaboration positions Cadence at the forefront of the shift toward agentic design automation, creating an agent-driven, scalable, cloud-native platfo...

20 Apr 2026 | Monday | NEWS
Nuvoton Technology Corporation Japan Advances High-Power Violet Laser Diodes for Semiconductor Packaging

Nuvoton Technology Corporation Japan (hereinafter "NTCJ") announced that it will start mass production of a "high-power violet laser diode (402 nm, 4.5 W)" that achieves industry-leading-class (*1) optical output in a 9.0 mm diameter CAN package (TO-9) in May. This product achieves 1.5 times the optical output compared to NTCJ's conventional product (*2) through its proprietary device structure an...

20 Apr 2026 | Monday | NEWS
Iceotope Expands IP Portfolio Amid Rising Demand for AI Infrastructure Cooling

Iceotope, the global pioneer in precision liquid cooling for AI infrastructure, announced it reached a significant intellectual property (IP) milestone: more than 200 patents granted and pending. The achievement underscores the company's technology leadership in solving one of the AI industry's most pressing challenges: efficiently cooling increasingly powerful computing systems to maximise perfor...

17 Apr 2026 | Friday | NEWS
ACCM Introduces Breakthrough Materials to Solve AI Accelerator Packaging Constraints

Advanced Chip and Circuit Materials announces the commercial availability of Celeritas HM50 and Celeritas HM001, which eliminate the root causes of warpage, package bow, solder fatigue, and high-frequency signal loss in large-format AI accelerators and advanced chip packaging architectures. Celeritas HM50 is a negative CTE (-8 PPM/°C) material, and Celeritas HM001 is a near-zero CTE material. ...

17 Apr 2026 | Friday | NEWS
QuickLogic Expands Sales Network with Quantum Leap Solutions Partnership

QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened, Antifuse and ruggedised FPGAs, announced the appointment of Quantum Leap Solutions as an authorised sales representative. Quantum Leap Solutions will represent QuickLogic's portfolio of IP and chiplet-related offerings, expanding customer engagement across strategic markets. Qua...

17 Apr 2026 | Friday | NEWS

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