Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced general availability of its 7-15GHz Daybreak™ beamforming ICs for emerging 5G/6G FR3 applications as well as multi-function defence arrays. FR3 frequencies are the next frontier for 5G-Advanced and 6G network deployments, combining the benefits of superior propagation ...
SEALSQ Corp (NASDAQ: LAES) (“SEALSQ” or the “Company”), a global leader in semiconductors, PKI, and post-quantum cryptography (PQC) hardware and software solutions, announced a live demonstration exploring its Post-Quantum Cryptography Robotic Concept during the Physical AI Roundtable held in Davos on the margins of the World Economic Forum Annual Meeting. The demonstration...
MIPS, a GlobalFoundries company, announced a collaboration with Inova Semiconductors GmbH, to deliver a robotics control reference platform for advanced humanoids and physical AI edge platforms. Building on the strengths of Inova’s Automotive expertise in zonal architectures, the platform will enable mixed-criticality compute featuring real-time control loops and secure AI workloads, manufac...
DEEPX, a Seoul-based fabless semiconductor company developing ultra-low-power AI inference chips for physical AI applications, has secured 27 commercial purchase orders across eight countries within seven months of starting mass production of its first-generation AI chip — a pace that industry observers describe as highly unusual for an emerging fabless company at such an early sta...
GS Microelectronics U.S., Inc. (GSME) announced a strategic partnership with Tarana Wireless, Inc. to support RF transceiver products and accelerate the future roadmap of wireless technologies. The deal strengthens the long-standing partnership between GSME and Tarana, enhancing the overall market value by providing dedicated RF-Analogue engineering support for Tarana's products. The team will sup...
Wolfspeed, Inc. (NYSE: WOLF) (“Wolfspeed” or the “Company”), a global leader in silicon carbide technology, announced the closing of its previously announced private placements of convertible notes, common stock, and pre-funded warrants (the “Private Placements”). In connection with the Private Placements, the Company redeemed approximately $475.9 million of the...
The AR Alliance, a division of SPIE that is focused on augmented reality (AR), proudly announces the addition of Ainstec, ams-Osram, Fraunhofer ISIT, Hong Kong Highpower International Co., Infineon, Kyocera Corporation, Morphotonics, Moveon Technologies, Murata Manufacturing Co., Seagate, Sunny Optical Technology, and Ushio to its membership. SPIE is the international society for optics ...
Every second, scientific experiments produce a flood of data — so much that transmitting and analysing it can slow down even the most advanced research. To help scientists better manage this data deluge, researchers at the U.S. Department of Energy’s (DOE) Argonne National Laboratory have developed a new computer chip that rapidly compresses and processes the huge amounts of ...
Nox Group, a hyper-scale industrial builder, is making a new home in Reno through a major data centre development, driving investment in the region’s workforce as it enters one of the country’s most sought-after markets for mission-critical infrastructure. Nox Group is one of the fastest-growing construction enterprises in the United States with four operating companies, including ele...
Colo.--(BUSINESS WIRE)--Frontgrade™ Technologies, a leading provider of high-reliability electronic solutions for space and national security missions, announced two complementary products delivering scalable, high-performance processing and high-speed connectivity for next-generation missions: the RPMG1-SVPX Reconfigurable Processing Module and the FIOM-RPMG1 Fibre Optic Mezzanine Card. Tog...
Pacific Defence announced the launch of the DSP3100VP, a next-generation digital signal processing module engineered to bring advanced artificial intelligence and machine learning (AI/ML) capabilities to the edge. Built on the AMD Versal™ AI Edge Series Gen 2 adaptive SoC, the DSP3100VP combines heterogeneous compute, adaptive acceleration, and deterministic real-time control to meet th...
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, announced the publication of JESD406-5D: LPDDR5/5X Serial Presence Detect (SPD) Contents standard, an update of the Revision C standard that adds support for calculating recovery time when switching operating modes. JESD406-5D is available for free download from the JEDEC we...
Keysight Technologies, Inc. (NYSE: KEYS) announced three new semiconductor teaching lab solutions designed to help universities prepare students for careers in the global semiconductor industry. The three solutions—Basic Design and Measurement, Parametric Test and On-Wafer Measurement, and Photonics IC Measurement—provide students with practical experience using professional-grade...
DG Matrix, the global leader in solid-state transformer solutions, announced that it will source the latest-generation silicon carbide (SiC) MOSFETs from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, for use in its Interport™ multi-port solid-state transformer platform. The relationship strengthens DG Matrix’s semiconductor ...
Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering data center networking, Internet of Things (IoT) connectivity and cellular infrastructure solutions, announced the TDS5311P, the industry’s first circuit protection device to deliver near-constant clamping voltage for USB Power Delivery (PD) Extended Power Range (EPR) applications at ...
Kulicke and Soffa Industries, Inc. ("K&S", "Company") announced an expanded portfolio of memory–focused interconnect solutions, reinforcing its leadership across Ball, Vertical Wire, Advanced Thermo–Compression, and Hybrid Bonding technologies. As memory assembly evolves to support higher bandwidth, greater power efficiency, and tighter integration for AI-driven workloads, manufac...
Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("K&S" or the "Company"), a global leader in semiconductor assembly solutions and wedge bonding technology, announced ASTERION™-TW, a new ultrasonic terminal welding system designed to support next-generation power module manufacturing. ASTERION™‑TW leverages K&S's longstanding leadership in interconnect innovation, expan...
Jabil Inc. (NYSE: JBL), a global engineering, supply chain, and manufacturing solutions provider, announced it will donate a total of $1.1 million over three years to St. Petersburg College (SPC) to support the development of the College’s advanced manufacturing training programs. This funding is intended to strengthen SPC’s career-focused training; expand student acces...
MaxLinear, Inc. (Nasdaq: MXL) announced the debut of its modular intelligent power management solution for next-generation broadband SoC designs. The platform combines the MxL7080 power management controller, MxL76500 smart regulating stage (SRS) modules, and the high-efficiency MxL76125 22V / 15A synchronous buck regulator to deliver a thermally optimised power architecture for high‑bandwi...
indie (Nasdaq: INDI), an automotive solutions innovator, has released its first Ultraviolet (UV) Visible Distributed Feedback (DFB) 399 nm single-frequency laser diode optimized for quantum computing systems based on cooled Ytterbium atoms. With the addition of this new device in the UV spectrum, indie is expanding on its previously announced LXM-U and narrow-linewidth visible DFB lasers, furtheri...