• Sunday | 08 November 2026
ChipAgents and NVIDIA Launch Benchmark for End-to-End Chip Design Automation

ChipAgents developed Build-A-Chip-Bench with NVIDIA to evaluate AI agents across the end-to-end digital IC design flow, from specification through physical implementation and verified Graphic Design System (GDS). Unlike point benchmarks focused primarily on RTL generation or verification, Build-A-Chip-Bench tests whether agents can meet functional, timing, power, area, and physical-verification...

16 Oct 2026 | Friday | NEWS
IBM, Siemens Partner to Advance 3D Nanostack Transistors Beyond 7 Angstroms

IBM has joined forces with Siemens on semiconductor research aimed at moving its nanostack transistor architecture closer to scalable manufacturing, combining IBM’s device development expertise with Siemens’ capabilities in electronic design automation, process simulation and lithography optimisation. The companies will work on the design, modelling and manufacturing techniques requir...

16 Oct 2026 | Friday | NEWS
Great Lakes Semiconductor Launches First Great American ChipForge Project

Great Lakes Semiconductor (GLS) announced the first project on its Great American ChipForge™ platform, launched under the company's Innovation Funnel™ initiative. The project draws on multiple GLS design centers, ChipForgeTM modular wafer fabrication, and FINPAT™ packaging and test, demonstrating the company's distributed, end-to-end integration capabilit...

15 Oct 2026 | Thursday | NEWS
WPG Americas Partners with Nuvoton to Expand Semiconductor Distribution in North America

WPG Americas Inc. (WPGA), a leading distributor of electronic components and supply chain services, announced a strategic partnership with Nuvoton Technology Corporation America (NTCA), a leading provider of microcontroller, audio, cloud security, battery monitoring, component, and visual sensing IC solutions. Through the partnership, WPGA will distribute Nuvoton's portfolio of high-performance, ...

15 Oct 2026 | Thursday | NEWS
Rocket One and VCU Partner to Advance SKYMRAM Magnetic Memory Technology

Rocket One Inc. (Nasdaq: RKTO) ("Rocket One" or the "Company")  announced that it has executed a sponsored research agreement with Virginia Commonwealth University (VCU) to advance SKYMRAM, a skyrmion-based magnetic memory technology with potential applications in next-generation AI chips and computing systems. The agreement establishes a one-year research program scheduled to begin Nov...

15 Oct 2026 | Thursday | NEWS
eInfochips Demonstrates Integrated Custom Silicon Platform for Power Monitoring and Control

eInfochips, an Arrow Electronics company and provider of semiconductor and product engineering services, announced that it has successfully demonstrated end-to-end turnkey ASICdesign capability through the development, fabrication, packaging, and bring-up of a test chip. The architecture includes a built-in microcontroller for current and voltage monitoring, smart programable control, diagnostics...

15 Oct 2026 | Thursday | NEWS
10 Policy and Trade Moves That Redrew the Global Chip Map in 2026

KEY TAKEAWAYS Governments spent 2026 managing flows rather than stopping them: licences with conditions, tariffs with carve-outs, minerals rules backed by enforcement. Industrial policy moved beyond the fab into packaging, materials, equipment, design and talent, from New Delhi to Brussels to Seoul. For buyers, available capacity and accessible capacity are no longer the same thing. Complianc...

14 Oct 2026 | Wednesday | Analysis
Tower Semiconductor and Semtech Expand SiGe Partnership for AI Data Centre Interconnects

Tower Semiconductor (Nasdaq/TASE: TSEM), the leading foundry for high-value analogue semiconductor solutions, and Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data centre networking and intelligent, connected Internet of Things ("IoT") devices worldwide, announced an expanded multi-year agreement that builds on the companies’ 20-year p...

14 Oct 2026 | Wednesday | NEWS
QuickLogic Secures eFPGA IP Design Win for Automotive and Industrial SoC

QuickLogic® Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened and Antifuse FPGAs, and ruggedised programmable logic solutions, announced a new eFPGA Hard IP design win for a programmable system-on-chip (SoC) targeting battery management, precision motor control, and industrial robotic applications on a 16nm automotive process technology...

14 Oct 2026 | Wednesday | NEWS
Marvell Unveils Second-Generation Structera X CXL Memory Expanders for AI Systems

Expanding memory capacity for AI: Second-generation Marvell® Structera™ X 3406 and 3506 CXL 3.2 memory expanders add six DDR4/DDR5 channels (50% more than the prior generation) and PCIe Gen 6 connectivity, supporting up to 9TB of DDR4 or 6TB of DDR5 per controller. Addresses growing memory demand: Multi-host sharing and inline LZ4 compression deliver up to 2–3x more effective ca...

14 Oct 2026 | Wednesday | NEWS
EHT Semi Integrates Bird RF Measurement Technology into Semiconductor Power Systems

EHT Semi announced the integration of Bird RF measurement technology into its semiconductor power platforms, including the Orion™ Direct RF™ System and tailored waveform generators. An embedded Bird probe, with NIST-traceable calibration, provides the primary measurement of power, voltage, current, and impedance. The integration reflects a collaborative relationship between EHT Semi an...

14 Oct 2026 | Wednesday | NEWS
Microchip Expands AI Data Centre Portfolio with PCIe 6.0 Switch and Storage Upgrades

Microchip Technology has introduced new connectivity and storage products aimed at AI, cloud and high-performance computing systems, as data centres face growing pressure to move and manage larger volumes of information between processors, accelerators and storage. The additions include a Switchtec PCIe 6.0 Low-Lane-Count switch, an enhanced version of the company’s Flashtec PCIe Gen 5 NVMe...

14 Oct 2026 | Wednesday | NEWS
Applied Materials Opens $5 Billion EPIC Center for Semiconductor R&D

$5 billion investment creates the world’s largest semiconductor equipment and process technology R&D facility Purpose-built to accelerate the path from breakthrough innovation to high-volume manufacturing of next-generation chipmaking technologies Leading chipmakers, systems companies, equipment partners and research universities have committed to develop inside EPIC ...

14 Oct 2026 | Wednesday | NEWS
GigaDevice Expands LVGL Support Across Eight GD32 MCU Families

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analogue products, is deepening its ecosystem collaboration with LVGL. LVGL's Open graphics library is one of the world’s most widely‑adopted open‑source embedded frameworks. Eight GD32 MCU product families have now been officially included in the LVGL ecosystem, providi...

13 Oct 2026 | Tuesday | NEWS
Samsung Ventures and Applied Ventures Back Flexcompute’s Physics World Model

Flexcompute, the physics company, announced a strategic investment from Samsung Ventures and Applied Ventures, LLC, the venture capital arm of Applied Materials, Inc., among other investors. The funding will accelerate Flexcompute's work on the Physics World Model: AI that predicts how any design will behave in the real world by learning the laws of physics themselves, from a chip package warping ...

13 Oct 2026 | Tuesday | NEWS
Accelsius Expands Austin Lab for Megawatt-Scale AI Cooling Tests

Accelsius, a leader in two-phase, direct-to-chip liquid cooling for AI and high-performance computing, announced that it has upgraded its Springdale lab and facility in Austin, Texas, to multi-megawatt power for two-phase liquid cooling testing. The upgraded environment allows Accelsius to validate its NeuCool® platform at the rack densities and facility water temperatures that next-generation...

13 Oct 2026 | Tuesday | NEWS
LG Expands Chiller Production in US and South Korea for AI Data Centres

LG Electronics is expanding chiller production across three manufacturing facilities by establishing a new factory in the United States and expanding production at its existing facilities in Changwon and Pyeongtaek, South Korea. The new U.S. facility in Virginia will enable local chiller production and help LG respond quickly to growing chiller demand across North America. Through its “O...

13 Oct 2026 | Tuesday | NEWS
Kioxia Joins Applied Materials’ EPIC Center to Advance AI Memory

Companies will collaborate to develop advanced memory structures, chip stacking technologies and materials engineering innovations to increase AI memory performance KIOXIA joins Applied Materials’ growing EPIC Center ecosystem, which includes chipmakers, chip designers, equipment partners and universities Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering solut...

13 Oct 2026 | Tuesday | NEWS
Microchip Acquires VORAGO to Expand Radiation-Hardened Chip Portfolio

Microchip Technology has acquired VORAGO Technologies, strengthening its position in radiation-hardened semiconductors used in space, defence and other applications where electronics must operate reliably in extreme environments. VORAGO, a privately held semiconductor company based in Austin, Texas, develops radiation-hardened and radiation-tolerant microcontrollers and microprocessors. Financial...

13 Oct 2026 | Tuesday | NEWS
Lapmaster Wolters Secures Minority Investment from Cynosure and Fernweh

Lapmaster Wolters and Precision Surfacing Solutions (“Lapmaster Wolters”), a leading global supplier of high-precision machine systems and consumables to the semiconductor, advanced materials, precision optics, and advanced packaging industries, announced the completion of a minority equity investment by affiliates of The Cynosure Group (“Cynosure”) and Fernweh Group (&ldqu...

12 Oct 2026 | Monday | NEWS

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