• Sunday | 08 February 2026
United Semiconductors Partners with Aegis Aerospace to Advance Semiconductor Manufacturing in Space

Aegis Aerospace Inc., a leader in space and defence technology, has announced a groundbreaking partnership with United Semiconductors LLC to pioneer semiconductor manufacturing in space. This collaboration follows Aegis Aerospace's recent grant agreement with the Texas Space Commission to develop an in-space manufacturing platform for advanced materials in low Earth orbit (LEO). "We are thrilled ...

9 Jan 2026 | Friday | NEWS
SonicEdge Partners with Global Semiconductor Manufacturer to Integrate Modulated Ultrasound into Audio Chipsets

SonicEdge, a pioneer in micro-acoustic innovation, announced at CES 2026 a new strategic partnership with a leading global semiconductor manufacturer to integrate its modulated ultrasound IP directly into next-generation audio chipsets. The audio chipset will natively drive SonicEdge’s modulated ultrasound speakers. Additional major chip companies are expected to follow as the industry recog...

9 Jan 2026 | Friday | NEWS
Ventiva Unveils Zoned Cooling™ Architecture at CES 2026

Ventiva®, a leader in thermal solutions, at CES 2026 unveiled its Zoned Cooling™ reference design, a new architectural approach to thermal management that transforms how heat is managed in electronic devices, from laptops to client-edge devices to data center infrastructure. As AI workloads grow, requiring more compute power, memory, storage, and 24/7 responsiveness, traditional fan...

9 Jan 2026 | Friday | NEWS
GCT Semiconductor Begins Commercial Shipments of 5G Chipset

GCT Semiconductor Holding Inc. (“GCT” or the "Company") (NYSE: GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, announced the first commercial shipments of its 5G chipset to GCT’s lead customers. The shipments follow successful qualification and adoption, as highlighted in GoGo’s recent announcement, marking a key mileston...

8 Jan 2026 | Thursday | NEWS
QuantalRF Expands RF Semiconductor and Antenna Ecosystem with DockOn® Models in Ansys HFSS

QuantalRF, the pioneering developer of RF semiconductor and antenna solutions, announced that its DockOn® antennas are now available in Ansys HFSS™ high-frequency electromagnetic software component libraries — now part of the Synopsys line of simulation and analysis solutions. This inclusion in HFSS gives RF engineers access to QuantalRF's antenna models, enabling faster and more p...

8 Jan 2026 | Thursday | NEWS
Canaan Launches 3.0 MW Heat-Reuse Pilot With Bitforest in Canada

Canaan Inc. an innovator in crypto mining, announced a 3.0 MW proof-of-concept (PoC) with Bitforest Investment Ltd. ("Bitforest" or the "Host") in Manitoba, Canada, to recover heat from an Avalon computing system and use the heat as a supplemental source for greenhouse operations. The pilot is part of Canaan's broader initiatives to make high-density computing operations more efficient t...

8 Jan 2026 | Thursday | NEWS
Synopsys Showcases AI-Driven Automotive Engineering Solutions at CES

Synopsys, Inc. is showcasing AI-driven and software-defined engineering solutions this week at CES that tackle one of the industry's biggest challenges: accelerating automotive engineering innovation in the age of AI while reducing cost and complexity. From intelligent system-level simulation to semiconductor design at the atomic scale, Synopsys enables automakers and suppliers to virtualize ...

8 Jan 2026 | Thursday | NEWS
NXP Integrates Ceva AI DSP Into S32Z2 and S32E2 Processors for Software-Defined Vehicles

As vehicles evolve into software-defined platforms, the demand for real-time processing, safety, and intelligence is accelerating. Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced that NXP® Semiconductors has integrated Ceva's AI DSP into its S32Z2 and S32E2 processors, designed to power the next generation of rea...

7 Jan 2026 | Wednesday | NEWS
Ceva Licenses SensPro™ AI DSP to BOS Semiconductors for ADAS SoC

As vehicles evolve toward software-defined architectures and complex ADAS, the industry is turning to real-time sensor processing, safety-critical intelligence, and physical AI to bridge perception and actuation. In line with this trend, Ceva, Inc. (NASDAQ: CEVA) announced that BOS Semiconductors has licensed its SensPro™ AI DSP architecture for the Eagle-A standalone ADAS Sys...

7 Jan 2026 | Wednesday | NEWS
Nordic Semiconductor Brings Ultra-Low-Power Edge AI to Battery-Powered IoT Devices

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, is bringing AI intelligence and functionality to the smallest battery-powered IoT devices. With an industry-leading, ultra-low-power Edge AI solution, Nordic accelerates the arrival of a new generation of devices with integrated edge AI intelligence - combining energy efficiency with unmatched ease of use for devel...

7 Jan 2026 | Wednesday | NEWS
Azimuth AI Secures New Funding to Scale Edge-AI Semiconductor Platform

Azimuth AI, a fast-growing semiconductor company with offices in Sacramento, California, and Hyderabad, India, is building custom edge-AI System-on-Chips (SoCs) for smart utilities, energy, and industrial infrastructure. The company announced the successful close of a new funding round led by Jetha Global, with participation from existing venture capital partners Moneta Ventures, AU...

7 Jan 2026 | Wednesday | NEWS
Chips & Media and Visionary.ai Launch World’s First AI-Based Full Image Signal Processor

Chips & Media, Inc. a leading hardware IP provider with more than 20 years of leadership in the multimedia industry, and Visionary.ai, the Israeli startup pioneering AI software for image processing, announced the launch of the world's first AI-based full Image Signal Processor (ISP). The new ISP offers a software-defined imaging pipeline that supercharges video quality in real time. The new ...

6 Jan 2026 | Tuesday | NEWS
Valens Semiconductor and Sakae Riken Launch First Production-Ready MIPI A-PHY E-Mirror

Valens Semiconductor (NYSE: VLN) and Sakae Riken Kogyo Co., Ltd announced the automotive market's first production-ready MIPI A-PHY-enabled e-mirror. The product, which integrates the Valens VA7000 chipset, delivers an order of magnitude more imaging data than other camera monitoring system solutions on the market, enabling more accurate ADAS and autonomous driving decisions. MIPI A-PHY ...

6 Jan 2026 | Tuesday | NEWS
SUDOKOO Makes Global Debut With High-Performance PC Cooling Lineup at CES 2026

SUDOKOO, an engineering-driven PC cooling brand, will make its first official global debut, unveiling a new lineup of high-performance CPU air coolers and liquid cooling solutions designed for workstations, PC enthusiasts, creators, and professional users. The showcased products span workstation-class air cooling, low-profile vapor-chamber air coolers, enthusiast-grade tower coolers, and LCD-equip...

6 Jan 2026 | Tuesday | NEWS
LG Display to Showcase Next-Generation OLED Lineup at CES 2026

LG Display, the world's leading innovator of display technologies, will showcase a full lineup of strategic OLED products built on its world-leading technology at CES 2026. During the show, the company will operate two separate exhibition booths — a large-sized OLED booth at the Conrad Hotel and an automotive display booth in the West Hall of Las Vegas Convention Center (LVCC). This year's...

6 Jan 2026 | Tuesday | NEWS
U.S. Automaker Selects Mobileye EyeQ™6H for Hands-Free Driving Systems

Mobileye announced that a US-based automaker has chosen the Mobileye EyeQ™6H to power future advanced driver assistance systems with hands-free driving on select highways across millions of vehicles worldwide. This deal reflects accelerating demand for Mobileye Surround ADAS™ systems globally, and Mobileye now estimates future delivery of more than 19 million EyeQ6H-based Surround syst...

6 Jan 2026 | Tuesday | NEWS
Macnica Promotes Sebastien Dignard to CEO of Atlantic Region

Macnica Inc. announced the promotion of Sebastien Dignard to chief executive officer of the company’s Atlantic region. In this role, Dignard will lead Macnica’s business across North America, Europe and South America, accelerating the company’s component-to-solutions strategy and strengthening cross-regional collaboration to deliver long-term value for customers an...

6 Jan 2026 | Tuesday | NEWS
Baidu’s AI Chip Unit Kunlunxin Files Confidentially for Hong Kong IPO

China’s leading search and AI company Baidu has taken a strategic step to strengthen its semiconductor ambitions, with its artificial intelligence chip subsidiary Kunlunxin filing confidentially for an initial public offering in Hong Kong, according to sources familiar with the matter. The proposed listing signals Baidu’s intent to sharpen focus on custom AI processors at a time when ...

5 Jan 2026 | Monday | NEWS
INCERGO and Visual Semiconductor Advance Merger, Unveil GF3D™ at CES 2026

INCERGO SA (ICG) announced the continued progress of its merger with Visual Semiconductor Inc. (VSI), including the issuance of shares to support the transaction and the continued expansion of Visual Semiconductor's GF3D™ platform. From black and white to color. From flat 2D to GF3D™. The next visual revolution is here. INCERGO and Visual Semiconductor will present live demonstrations...

5 Jan 2026 | Monday | NEWS
Sandisk Appoints Alexander R. Bradley to Board of Directors

Sandisk Corp (Nasdaq: SNDK) announced that Alexander R. Bradley has joined its board of directors and been appointed to the audit committee. Since 2016, Bradley has served as Chief Financial Officer of First Solar, a leading American solar technology and manufacturing company. He first joined the company in 2008 and held key leadership roles, including as vice president of both treasury and proje...

5 Jan 2026 | Monday | NEWS

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