Silicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles. Chiplet technology is recognised as a critical solution to address rising costs and bottlenec...
Molex, a global electronics leader and connectivity innovator, announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fibre-to-chip connectivity solutions optimised for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications. Teramount's TeraVERSE® platform, based on its universal photonic coupler and wafer-level self-aligning optics, pr...
Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a collaboration with Jabil, a global engineering, supply chain, and manufacturing solutions provider. Through this collaboration, Jabil plans to develop a 1.6T linear receive optical (LRO) transceiver module using Sivers' high-performance Distributed Feedback (DFB) laser...
Western Maricopa Education Centre (West-MEC) officially celebrated the grand opening of its Advanced Manufacturing Cleanroom on April 13, marking a historic milestone as the nation's first K–12 CTE semiconductor cleanroom of its size. West-MEC extends a special thank you to Advanced Technologies Consultants (ATC), McCarthy Building Companies, and Grace Design Studios for their outstanding e...
Celera Semiconductor, the leading analogue IC supplier using AI to slash the cost and time to develop and supply analogue ICs, announced the appointment of Jeff Sexton as vice president of Worldwide Sales. "We are very pleased to welcome Jeff to Celera to lead our global sales team," said Patrick Brockett, CEO of Celera Semiconductor. "Jeff is an accomplished leader with a proven track record of ...
Silanna UV, a global innovator in ultraviolet semiconductor technology, announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) LEDs. This latest development expands the company's comprehensive metal–can UVC LED portfolio, delivering greater optical flexibility, compact integration,...
IonQ (NYSE: IONQ), the world’s leading quantum technology company, announced that it has been awarded a contract in the Defence Advanced Research Projects Agency (DARPA)’s Heterogeneous Architectures for Quantum (HARQ) program. As a part of HARQ, IonQ plays a critical role in enabling a new class of networked quantum computers that combine distinct qubit types—such as trapped io...
The 2026 International Symposium on VLSI Technology, Systems and Applications (VLSI TSA), hosted by the Industrial Technology Research Institute (ITRI), is taking place in Hsinchu, Taiwan. Now in its 43rd year, the symposium remains a leading global forum for semiconductor innovation, bringing together over 800 experts from around the world. Discussions this year focus on generative AI infere...
The mission of LZE GmbH is to translate technologies from research into products and, as a fabless semiconductor company, to bring high‑performance integrated circuits and semiconductor solutions to market. This also applies to the unique FH3DXX family of 3D magnetic field sensors, which is based on the innovative HallinOne® technology developed by Fraunhofer IIS and has already been success...
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, announced its IP solutions on UMC’s 28nm platform with SST-ESF4 eNVM, designed to enable next-generation MCU and AIoT SoCs targeting endpoint AI applications. The comprehensive IP solution integrates SST eFlash controller and BIST, together with silicon-proven analogue and high-speed interface P...
Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, marks a historic expansion of its global manufacturing footprint with the official inauguration of Kaynes Semicon’s state-of-the-art OSAT facility in Sanand, Gujarat. At...
Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, announces that it has been awarded the Americas Distributor of the Year Award from Harwin, a world leader in the manufacture of interconnect components. Harwin cited Mouser's continued sales and customer growth for the fiscal year (April 2025 to March 2026), co...
Electronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average rose 10.1%, based on a comparison of the most recent fo...
Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, announced a family of compact, high-efficiency platforms powered by AMD EPYC™ 4005 series processors. The edge-optimised systems are designed to accelerate AI inferencing and general-purpose workloads in space and power-constrained environments, including retail, manufacturing...
Rapidus Corporation announced that it opened an Analysis Centre and its Rapidus Chiplet Solutions (RCS). The Analysis Centre is a facility adjacent to Rapidus' Innovative Integration for Manufacturing (IIM-1) semiconductor foundry in Chitose, Hokkaido. It conducts the physical analysis, environmental and chemical analysis, electrical characterisation, and reliability testing necessary ...
As artificial intelligence, robotics, automation, and advanced computing continue to push demand for semiconductors to new heights, the pressure to expand manufacturing capacity has become one of the most urgent challenges facing the global chip industry. The bottleneck is not simply building new fabs. It requires getting the facility, tools, infrastructure, and processes right from the start...
Specs Inc., a Snap subsidiary, and Qualcomm Technologies, Inc. announced a multi-year strategic agreement to power future generations of Specs with Qualcomm Technologies’ industry-leading Snapdragon system-on-a-chip (SoC). This is the first flagship engagement for Specs Inc., which is launching Specs, advanced eyewear that seamlessly integrates digital experiences into the physical wor...
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, was honoured to accept the 2025 EM Asia Best Supplier of the Year award at the 21st EM Asia Innovation Awards ceremony held March 27 during Productronica Shanghai at the Shanghai New International Expo Centre. The event was organised by the Messe Muenchen Shanghai. Jacky He, commercial lead, Nordson...
Rebellions, a global leader in AI inference infrastructure, announces a collaboration with SK Telecom (SKT) and Arm to develop AI inference infrastructure designed to support sovereign AI and telecommunications-focused AI data centres. Through this collaboration, the companies plan to develop an AI server combining Arm AGI CPU, the first Arm-designed data centre CPU, with Rebellion’s AI chip...
Lattice Semiconductor (NASDAQ: LSCC), the low-power programmable leader, announced it has been recognised as a 2026 USA TODAY Top Workplaces award winner. Lattice won the award based on direct employee survey feedback, including 15 culture drivers that are shown to predict high performance against industry benchmarks. Ford Tamer, Chief Executive Officer at Lattice, said, “Our people ar...