IntelPro and Ceva Partner to Launch AI-Powered, Matter-Ready IoT SoC

First product based on collaboration, the IntelPro IPRO7AI, integrates multi–mode wireless, security, multimedia, and AI processing to power next–generation smart home, industrial, and consumer IoT devices As artificial intelligence and seamless connectivity converge to redefine the Internet of Things (IoT), demand is rising for platforms that combine low–power wireless, securit...

14 Nov 2025 | Friday | NEWS
Fabric8Labs Secures $50 Million to Expand U.S. Electrochemical Additive Manufacturing Capacity

Fabric8Labs, the company pioneering Electrochemical Additive Manufacturing, announced a $50 million funding round to expand its U.S.-based advanced manufacturing facilities, boosting capacity to produce tens of millions of components annually. Powered by its breakthrough Electrochemical Additive Manufacturing (ECAM) technology, Fabric8Labs is scaling up production of next-generation electronic...

14 Nov 2025 | Friday | NEWS
SK keyfoundry Accelerates Entry into SiC Power Semiconductor Market with Acquisition of SK powertech

SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it is accelerating the development of SiC (Silicon Carbide)-based compound power semiconductor technology, bolstering its efforts into the global power semiconductor market. Leveraging its advanced manufacturing expertise and extensive intellectual property (IP) portfolio across the semiconductor manufacturing process, the compa...

13 Nov 2025 | Thursday | NEWS
Renesas Sets New Standard for DDR5 Memory Interfaces with 9600 MT/s RCD Optimized for AI and HPC Workloads

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, announced that it has delivered the industry’s first sixth-generation Registered Clock Driver (RCD) for DDR5 Registered Dual In-line Memory Modules (RDIMMs). The new RCD is the first to achieve a data rate of 9600 Mega Transfers Per Second (MT/s), surpassing the industry standard. This brea...

13 Nov 2025 | Thursday | NEWS
AKM Brings Breakthrough AgeTech and PetTech Innovations to CES® 2026

Asahi Kasei Microdevices Corporation (AKM) will showcase its latest sensing technologies for the growing AgeTech and PetTech markets at CES® 2026. The demonstrations, featuring technologies such as millimeter-wave radar and energy-harvesting innovations, will be presented in the Digital Health section of the Venetian Expo at booth 54829. With aging populations driving increased demand for s...

13 Nov 2025 | Thursday | NEWS
Baya Systems Expands to Cambridge as Strategic Center for Chiplet and AI Compute Innovation

New Cambridge location to be the center of U.K. and EU semiconductor operations Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI and high-performance computing, announced the opening of its first European office in the U.K. The move represents a strategic step in Baya’s global growth, expanding its reach into Europe’s rapidl...

12 Nov 2025 | Wednesday | NEWS
POET and QCi to Develop 400G/Lane TFLN-Based 3.2Tbps Optical Engines

400G/Lane, TFLN modulator-based innovation to play a key role in the future of computing POET Technologies Inc.a leader in the design and implementation of highly-integrated optical engines and light sources for artificial intelligence networks, and Quantum Computing Inc. (QCi) (NASDAQ: QUBT), an innovative integrated photonics and quantum optics technology company, today an...

12 Nov 2025 | Wednesday | NEWS
United Micro Integrates Ceva’s PentaG Lite 5G Platform in RedCap SoC for Automotive

United Micro integrates Ceva-PentaG Lite 5G platform IP in RedCap SoC, delivering cost–efficient, secure, and scalable connectivity for next–generation vehicles As automakers expand connected vehicle offerings, 5G RedCap is emerging as a cost–efficient complement to traditional 5G, enabling mass–market adoption of vehicle connectivity without compromi...

12 Nov 2025 | Wednesday | NEWS
Wolfspeed and Hopewind Collaborate to Bring Silicon Carbide Innovation to Global Wind Energy Systems

Wolfspeed, Inc. (NYSE: WOLF), a global leader in innovative silicon carbide power solutions, announced a collaboration with Hopewind, a global innovator in renewable energy solutions. Together, the two companies will advance the development of the next generation of wind power solutions by integrating Wolfspeed’s cutting-edge 2.3kV LM Pack Module into Hopewind’s advanced highly modul...

11 Nov 2025 | Tuesday | NEWS
vCluster Labs Launches Infrastructure Tenancy Platform for AI on NVIDIA GPU Systems

New platform provides a Kubernetes-native foundation for running AI workloads on NVIDIA AI infrastructure, combining advanced isolation, dynamic scaling, and hybrid networking. (KubeCon + CloudNativeCon North America 2025, ) —vCluster Labs, the company pioneering Kubernetes virtualization, today announced its Infrastructure Tenancy Platform for AI to help organizations build and...

11 Nov 2025 | Tuesday | NEWS
Valens Semiconductor Gains Momentum in Medical Imaging Market with First VA7000-Powered Endoscopes

Three new endoscopes set to launch, including an innovative laparoscope, a 3D imaging solution for robotic surgeries, and the first single-use colonoscope with 4K video resolution Valens Semiconductor announced  that the first endoscopes powered by its VA7000 chipset will be launched by three OEMs, signaling strong momentum for Valens' entry into the medical imaging market. The products in...

11 Nov 2025 | Tuesday | NEWS
Stäubli Introduces Mini-QD Connector and Advances UQD v2 Standard for Next-Gen Liquid Cooling in High-Performance Computing

New Mini-QD connector enables use of next-generation optical pluggable modules; UQD v2 specification enforces greater precision As AI workloads push thermal limits in data centers higher than ever, Stäubli is leading a new phase of standardization in liquid-cooling technology designed for the next generation of high-performance computing.   At the Open Compute Project (O...

10 Nov 2025 | Monday | NEWS
Pixelworks' Distributed Rendering Solution Powers realme GT8 Series R1 Gaming Chip for PC-Level Visuals

Distributed Rendering Solution Unlocks a New Visual Experience with Low Power Consumption and High Image Quality Pixelworks, Inc. (NASDAQ: PXLW), a leading provider of visual processing solutions,  announced that it offers an advanced distributed rendering solution for the R1 gaming chip equipped in the realme GT8 series smartphones. By integrating ultra-low latency MotionEngi...

10 Nov 2025 | Monday | NEWS
Universal Display to Acquire Merck’s OLED Emissive IP Portfolio in Strategic Expansion

-Universal Display Corporation (Nasdaq: OLED) (UDC), enabling energy-efficient displays and lighting with its UniversalPHOLED® technology and materials, announced that it has entered into a definitive agreement to acquire OLED patent assets from Merck KGaA, Darmstadt, Germany, a leading science and technology company. This portfolio, which has an average remaining lifetime of ap...

10 Nov 2025 | Monday | NEWS
Sivers Semiconductors and POET Technologies Partner to Deliver Scalable, Energy-Efficient Light Sources for AI Data Centers

Strategic Collaboration Combines Sivers' Lasers With POET's Optical Interposer™ to Deliver Scalable, Energy-Efficient Light Sources Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced additional details on the strategic partnership with POET Technologies Inc. (NASDAQ: POET), a leader in the design and implementation of highly integr...

7 Nov 2025 | Friday | NEWS
Amphenol Completes Acquisition of Trexon for Approximately $1 Billion

Amphenol Corporation announced that it has completed its previously announced acquisition of Trexon from Audax Private Equity for approximately $1 billion in cash. “We are excited to welcome the entire Trexon team to the Amphenol family,” said Amphenol President and Chief Executive Officer, R. Adam Norwitt. “With the closing of the Trexon acquisition, we look forward to the in...

7 Nov 2025 | Friday | NEWS
Lenovo Adds Cornelis CN5000 to EveryScale Platforms to Eliminate AI/HPC Network Bottlenecks

-Cornelis, a leading provider of intelligent, high-performance networking solutions, announced the successful qualification and integration of its CN5000 Omni-Path® networking solution across Lenovo’s ThinkSystem V3 and V4 servers. The CN5000 is now a fully supported networking fabric in Lenovo’s EveryScale Solution, empowering customers to deploy tightly integrated, high-perform...

7 Nov 2025 | Friday | NEWS
SEMI Reports Continued Strength in Advanced Node Wafer Demand as Global Shipments Increase Year-on-Year

Growth in 300 mm Shipments Fueled by AI to Support Advanced Logic, Cloud Computing and Memory Applications  The SEMI Silicon Manufacturers Group (SMG) reported , in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 3.1% year-on-year to 3,313 million square inches (MSI) from the 3,214 MSI recorded during the same quarter of 2024. Sequent...

6 Nov 2025 | Thursday | Analysis
Mouser Electronics Launches New EIT Series Focused on the Future of Urban Air Mobility

--Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, released its latest installment of the Empowering Innovation Together (EIT) technology series, Urban Transport Takes Flight, examining the emerging sector of Advanced Air Mobility (AAM). This series details the technology behind electric vertical takeoff and lan...

6 Nov 2025 | Thursday | NEWS
Tinicum to Acquire TriMas Aerospace and Merge with PennAero to Create Leading Independent Aerospace Components Supplier

Tinicum, L.P. (“Tinicum”) today announced that one of its affiliates has signed an agreement to acquire the aerospace assets of TriMas Corporation (“TriMas Aerospace”), through which TriMas Aerospace will be merged with PennAero, a Tinicum portfolio company (“the Transaction”). Funds managed by Blackstone will be a minority investor in the Transaction. This in...

6 Nov 2025 | Thursday | NEWS