• Friday | 15 May 2026
Longsys Showcases Artificial Intelligence Driven Semiconductor Storage Solutions at Embedded World 2026

At Embedded World 2026, branded semiconductor memory enterprise Longsys (301308.SZ) demonstrated its integrated storage innovation capabilities and dual business-model value under the theme "AI Storage for Embedded World". Automotive-grade Portfolio Powers Intelligent Vehicles With seven years of expertise in automotive-grade storage, Longsys has built comprehensive capabilities across chi...

19 Mar 2026 | Thursday | NEWS
Innatera and Joya Design Bring Neuromorphic Semiconductor Technology to Consumer Audio

Innatera, a specialist in neuromorphic computing for ultra-low-power edge AI, has partnered with Joya Design to deliver a commercially viable consumer audio solution powered by its Pulsar chip. The collaboration marks a significant step in transitioning brain-inspired computing from development into real-world product deployment. Joya Design has successfully integrated Innatera’s Pulsar mic...

19 Mar 2026 | Thursday | NEWS
Kinaxis Inc. Accelerates Semiconductor Supply Chain Optimisation with Artificial Intelligence Computing

Kinaxis® Inc. (TSX: KXS), a global leader in supply chain orchestration, announced a new milestone in advancing large-scale supply chain optimisation within the Kinaxis Maestro™ platform. Maestro already delivers high-performance optimisation across complex global supply chains, and Kinaxis is now extending that leadership by leveraging GPU acceleration powered by NVIDIA cuOpt&...

19 Mar 2026 | Thursday | NEWS
Sivers Semiconductors AB Partners with O-Net Technologies and Enablence Technologies Inc. on Optical Interconnect Solution for Artificial Intelligence Data Centres

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a strategic partnership with O-Net Technologies and Enablence Technologies Inc. (TSXV: ENA) to develop an advanced external light source (ELS) module with Sivers laser arrays to support Co-Packaged Optics (CPO) roll-out in AI datacenters and HPC systems. O-Net ...

19 Mar 2026 | Thursday | NEWS
Sony Semiconductor Solutions Corporation Launches 4K Image Sensor with Advanced LOFIC Pixel Technology

Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming launch of the IMX908, a 4K CMOS image sensor for security cameras featuring the industry's smallest 1.45 µm LOFIC pixels. * The new sensor utilises newly developed LOFIC pixels to achieve 96dB high dynamic range images with a single exposure at 4K resolution. This results in improved low-light performance...

18 Mar 2026 | Wednesday | NEWS
Tower Semiconductor and Oriole Networks Partner to Advance Optical Switching for Artificial Intelligence Infrastructure

Tower Semiconductor has announced a strategic collaboration with Oriole Networks to accelerate the development of next-generation AI infrastructure, leveraging nanosecond optical circuit switching technology. The partnership brings together Oriole’s advanced networking architecture with Tower’s high-volume silicon photonics manufacturing platform. The objective is to commercialise opt...

18 Mar 2026 | Wednesday | NEWS
Qualitas Semiconductor Selects Anritsu Corporation Solution for High-Speed Semiconductor Validation

Qualitas Semiconductor has selected a vector network analyser from Anritsu Corporation as part of its strategy to enhance signal integrity verification in high-speed interface development. As a provider of advanced PHY IP solutions, Qualitas operates in increasingly demanding semiconductor markets, including AI, data centres, automotive and mobile systems. With data transmission speeds continuing...

18 Mar 2026 | Wednesday | NEWS
Wolfspeed, Inc. Positions 300 MM Silicon Carbide Platform for Artificial Intelligence and High Performance Computing

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, announced that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade. “As AI workloads continue to increase package size, power density, and integration complexity, ...

18 Mar 2026 | Wednesday | NEWS
Gallium Oxide Emerges as Next-Generation Power Semiconductor Material

Recent progress in fabrication tools and processing techniques is accelerating the development of gallium oxide (Ga₂O₃) as a promising material for next-generation power semiconductors. Researchers, including teams from leading academic and industrial institutions, have reported important breakthroughs that enhance how this material is grown and adapted for practical device applications. Gall...

18 Mar 2026 | Wednesday | NEWS
Semtech Corporation Launches 224Gbps Optical Interconnect Chipset for AI Data Centres

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a family of 224Gbps per lane Transimpedance Amplifiers (TIAs) and Mach-Zehnder Modulator (MZM) drivers for half retimed (LRO), LPO, XPO, Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) interconnect applications. ...

17 Mar 2026 | Tuesday | NEWS
Marvell Technology and Mojo Vision Partner on Micro-LED Optical Interconnects for AI Data Centres

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, and Mojo Vision, the high-performance micro-LED platform company, announced a long-term collaboration to develop a new class of optical interconnect solutions to power the next wave of high-performance AI data center infrastructure. Today’s rapidly growing AI workloads are beginning to str...

17 Mar 2026 | Tuesday | NEWS
KIOXIA America, Inc. Showcases AI-Optimised Flash and SSD Solutions at NVIDIA GTC 2026

Next week at NVIDIA GTC 2026, KIOXIA America, Inc. will showcase its latest high-performance memory and solid-state drive (SSD) solutions designed to meet the growing demands of artificial intelligence (AI) workloads. As the premier global AI conference, GTC brings together developers, researchers, and business leaders to explore advances in accelerated computing and AI. At this ye...

17 Mar 2026 | Tuesday | NEWS
Polar Semiconductor Achieves AS9100D Certification for Semiconductor Wafer Manufacturing

Polar Semiconductor is pleased to announce that its Quality Management System (QMS) has achieved certification conforming to AS9100D and ISO 9001:2015 for the manufacture of semiconductor wafers. The certification audit was conducted by BSI, a fully accredited certification body and affirms that Polar meets the stringent standards established by the International Aerospace Quality G...

16 Mar 2026 | Monday | NEWS
Allegro DVT Launches DWP300 DeWarp IP for Advanced Video Processing

Allegro DVT, the worldwide leader in Semiconductor Video IPs and Video Compliance Tools, announces the addition of its new DWP300 DeWarp IP to its Zinia Pixel Processing IPs portfolio. This latest innovation further reinforces Allegro DVT’s commitment to delivering comprehensive, high-performance solutions for next-generation imaging and video applications. The new DWP30...

16 Mar 2026 | Monday | NEWS
Qnity Electronics Opens Advanced Semiconductor Materials Facility in Newark, Delaware

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, celebrated the opening of its new 385,000-square-foot facility with a ribbon-cutting ceremony in Newark, Delaware. The new facility, part of a multi-year investment to expand advanced manufacturing, increases capacity to meet rising demand for semiconductor material...

16 Mar 2026 | Monday | NEWS
HyperLight Corporation, United Microelectronics Corporation Partner on TFLN Photonics Foundry Production

HyperLight Corporation (“HyperLight”), United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, announced a strategic manufacturing partnership for high-volume foundry production of HyperLight’s TFLN (thin-film lithium niobate) Chiplet™ Platform on both...

16 Mar 2026 | Monday | NEWS
Mouser Electronics Returns as Platinum Sponsor of Create the Future Design Contest

Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, announces it is once again a Platinum sponsor of the Create the Future Design Contest. Create the Future is a global challenge for engineers and innovators to design the next great thing, with a chance to win the grand prize. Mouser, which has sponsored the contest for over a decade, is joined ag...

16 Mar 2026 | Monday | NEWS
Corning Incorporated Licenses PRIZM TMT optical ferrule technology to Boost AI Data Centre Connectivity

Corning Incorporated (NYSE: GLW) announced a collaboration with US Conec to become a licensee of PRIZM® TMT optical ferrule technology, a solution that allows for higher fibre counts in tighter spaces inside data centers. The addition of PRIZM® TMT expands Corning’s full spectrum of high‑density optical connectivity solutions for next‑generation AI networks. “AI infra...

16 Mar 2026 | Monday | NEWS
Synopsys Launches Ansys 2026 R1 with Integrated Engineering and AI Capabilities

 Synopsys, Inc. (NASDAQ: SNPS) launched Ansys 2026 R1, delivering the first wave of integrated Synopsys-Ansys capabilities built on nearly a century of combined engineering expertise. The release also expands the Ansys simulation AI portfolio with a new AI-enhanced training offering designed to make learning more effective and efficient, along with advanced AI features that help engineer...

13 Mar 2026 | Friday | NEWS
Synopsys Advances Hardware-Assisted Verification for AI Chip Development

Synopsys, Inc. (Nasdaq: SNPS) announced advancements across its leading hardware-assisted verification (HAV) portfolio, including new hardware platforms and capabilities to support the ever-expanding demand for AI chip verification from the data centre to the edge. Synopsys HAV platforms, powered by the company's unique software-defined capabilities, set new performance, scalability, and use ...

13 Mar 2026 | Friday | NEWS

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