MegaChips and proteanTecs Advance Embedded Silicon Monitoring for AI and High-Performance ASICs

Q. What was the key business opportunity behind bringing proteanTec’s embedded monitoring technology into MegaChips’ next-generation ASIC and LSI platforms?

The opportunity is to give customers deeper visibility into how their silicon behaves across development, production and in-field operation. As AI and high-performance devices become more complex, customers need actionable data from within the silicon to optimise power, performance and thermal behaviour, improve reliability, reduce development risk and accelerate time-to-market.

The collaboration also supports proteanTecs’ continued expansion in Japan by enabling us to work with an established Japanese semiconductor company and bring our technology to more customers developing advanced ASIC and LSI products in the region.

Q. How does the combination of MegaChips’ DFT expertise and proteanTecs’ silicon monitoring and analytics differentiate the companies’ offering in the growing AI and high-performance electronics market?

MegaChips’ DFT expertise provides a strong foundation for testing advanced devices, while proteanTecs adds embedded monitoring and analytics that extend visibility across the product lifecycle. Conventional testing methods typically do not provide this level of detailed silicon telemetry from within the device, particularly under real workloads and operating conditions. proteanTecs uniquely provides this deep, high-resolution visibility into actual silicon behaviour.

This combination enables a more data-driven approach to device characterisation, production, power and performance optimisation, and long-term reliability. These capabilities are particularly valuable in AI and high-performance electronics, where power, thermal, timing and reliability constraints are increasingly interconnected.

Q. What specific benefits will customers see from gaining deeper visibility into silicon behaviour from development and production through to in-field operation?

During development and bring-up, embedded monitoring helps engineers understand actual silicon behaviour and optimise devices against power, performance and thermal targets. In production, telemetry-based analytics can support more informed quality, yield and device-characterisation decisions.

After deployment, the same monitoring foundation provides visibility under real workloads and operating conditions. This can support dynamic power and performance management, continuous health monitoring and more predictable operation.

Overall, customers can benefit from:

• Faster bring-up and time-to-market
• Improved quality and yield
• Better power, performance and thermal optimisation
• Earlier identification of anomalous behaviour
• Improved reliability and predictability in the field
• Greater correlation among development, production and field data.

Q. With AVS Pro™ enabling dynamic, workload-aware power reduction, which customer applications and market segments do you see as the strongest opportunities for this capability?

The strongest opportunities are applications in which power efficiency, performance and reliable operation must be managed simultaneously. These include AI and high-performance computing, data centres, edge computing, telecommunications, and power- or battery-constrained systems.

AVS Pro monitors timing margin within the silicon under actual workloads and operating conditions. This enables dynamic voltage adjustment while maintaining a built-in protection layer for reliable operation. proteanTecs has publicly reported average power reductions of 8 to 14 per cent, depending on the device and application.

For AI and data centre infrastructure, the benefits can include improved performance per watt and more efficient use of available power and cooling capacity. At the edge and in battery-powered systems, reducing unnecessary power consumption can help systems operate more efficiently within tight power and thermal limits.

Q. The collaboration also targets advanced ASIC and CPO designs. How significant is the growing demand for monitoring, yield optimisation and reliability management in these markets, and where do you see the biggest commercial opportunities?

The demand is growing as advanced ASICs and co-packaged optics bring greater compute and connectivity into increasingly integrated systems. Higher power density, complex operating conditions and the rising value of completed devices make early detection, yield optimisation, and long-term reliability management increasingly important.

The greatest opportunities are in applications where efficiency, uptime and predictable performance have a direct economic impact. These include AI accelerators, data centre processors, networking and switching devices, high-speed communications infrastructure and other advanced application-specific systems.

In these markets, embedded monitoring can create value throughout the lifecycle by supporting faster development, more informed production decisions, runtime optimisation, and continuous health monitoring.

Q. Looking ahead, how could this collaboration evolve into a broader product and business relationship, and what role could it play in strengthening MegaChips’ ASIC offering and proteanTec’s presence in the AI and advanced electronics markets?

The collaboration provides an important channel for bringing embedded monitoring and analytics into more advanced ASIC and LSI designs. It expands opportunities to support customers across development, production, and in-field operation with capabilities including power and performance optimisation, production analytics, and health and reliability monitoring.

The relationship also complements proteanTecs’ growing presence in Japan, an important market for semiconductor and advanced electronics innovation. Working with MegaChips can help proteanTecs engage with more customers in Japan while extending our technology into additional AI, high-performance computing, communications and other advanced electronic applications. Any future developments will be guided by customer requirements and mutually agreed areas of collaboration.