NSING Technologies Surpasses 250 Million Bluetooth Chip Shipments Using Ceva Wireless IP
The milestone highlights the long-standing partnership between Ceva and NSING Technologies, with Ceva-Waves Bluetooth Low Energy technology powering chips used in wearables, smart home devices, automotive electronics and industrial applications.
Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced that NSING Technologies, a leading provider of microcontrollers and semiconductor solutions, has surpassed 250 million Bluetooth chips shipped incorporating Ceva-Waves Bluetooth Low Energy (LE) IP. The milestone highlights the success of the companies' long-standing collaboration and the widespread adoption of NSING Technologies' Bluetooth-enabled products across wearables, consumer electronics, smart home, automotive and industrial applications.
NSING Technologies has built its Bluetooth product portfolio on Ceva-Waves Bluetooth LE IP, combining Ceva's proven connectivity technology with its own low-power RF designs and MCU architectures. This approach has enabled NSING Technologies to develop a broad range of highly integrated, power-efficient Bluetooth solutions while accelerating product development and maintaining consistent performance and standards compliance across successive product generations.
The collaboration spans multiple generations of NSING Technologies' Bluetooth products, including its N32WB452 series of dual-core Bluetooth LE MCUs and N32WB03x series of ultra-low-power Bluetooth LE SoCs. These solutions support a diverse range of applications, including electronic toll collection systems, wireless remote controls, smart lighting, e-bike security systems, indoor positioning and industrial wireless connectivity.
"Reaching 250 million Bluetooth chip shipments reflects the strength of our product portfolio and the trust our customers place in our technology," said Xinhui Mu, Vice President, NSING Technologies. "Ceva has been a valued technology partner in our growth, and we look forward to building on this success as we expand our presence in new markets and applications."
"The scale of NSING Technologies' Bluetooth shipments illustrates the tremendous reach of wireless connectivity and the role Ceva plays in enabling it," said Ziv Hammer, Executive Vice President, Connectivity & Sensing Division at Ceva. "With billions of Ceva-powered devices deployed worldwide, milestones like this demonstrate how our IP licensing model translates into sustained, high-volume production and long-term royalty opportunities."
Ceva's comprehensive Ceva-Waves wireless connectivity IP portfolio includes Bluetooth LE, Bluetooth Dual Mode, Bluetooth High Data Throughput (HDT), Wi-Fi and Ultra-Wideband (UWB), supported by integrated hardware and software solutions. These technologies underpin the Connect pillar of Ceva's strategy to enable devices to Connect, Sense, and Infer as part of the broader industry shift toward Physical AI. Licensed by leading semiconductor companies worldwide, Ceva's wireless connectivity IP is deployed in billions of devices.
