For semiconductor equipment and materials suppliers, 2027 is shaping up as a big capacity year. TSMC expects new 3nm capacity in both Taiwan and Arizona. Micron is preparing its first new US memory fab for wafer output. SK hynix is opening the first production phase of its Yongin cluster. Rapidus still targets 2nm mass production in Japan. India expects its first commercial front-end fab to begin...
SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, announced a new gaming peripherals platform in collaboration with Nordic Semiconductor that speeds time to market for the next generation of high-performance wireless gaming devices The platform combines Nordic Semiconductor’s nRF54LM20 wireless SoC, part of the ...
Cohu, Inc. (NASDAQ: COHU), a global supplier of equipment and services optimizing semiconductor manufacturing yield and productivity, announced that a new fabless semiconductor customer has selected Cohu’s Eclipse platform for production testing of its next-generation high-performance computing (HPC) devices. The Eclipse ships with PAICe® Prescriptive software analytics tool that continu...
Advantech, a global leader in embedded computing and edge AI solutions, has announced the launch of the SOM-5994, a COM Express Basic Type 7 module powered by Intel Atom P6900 processors. Designed for compute-intensive edge networking, 5G infrastructure, and next-generation telecommunication applications, the SOM-5994 delivers high-core-density processing, advanced networking connectivity, and fle...
Sivers Semiconductors AB (NASDAQ: SIVE) announced a global distribution agreement with WT Microelectronics Co., Ltd. (TWSE: 3036), a world-leading electronics and semiconductors distributor. With a 15% global market share, WT Microelectronics will serve as a strong global distribution partner for Sivers' InP (Indium Phosphide) lasers and wireless beamformer products and solutions, connecting its ...
Automation: Optis FIB-SEM reduces operator-dependent sample preparation with automated, wafer-based workflows that give semiconductor manufacturers more consistent, traceable transmission electron microscopy (TEM) sample data. Precision: Critical for advanced logic and memory devices, Optis FIB-SEM supports ultra-high-precision final lamella thinning with AI-driven endpointing for high-...
Reed Semiconductor announced a favorable jury verdict in the patent infringement litigation brought by Monolithic Power Systems in the United States District Court for the District of Delaware. The jury found that Reed Semiconductor did not infringe either of the asserted patents. Following the verdict, Dr. Wenkai Wu, Chief Executive Officer and Chairman of the Board of Reed Semiconductor, issued...
Keysight Technologies, Inc. (NYSE: KEYS) has certified Advanced Design System (ADS) Photonic Designer to support Tower Semiconductor’s PH18 silicon photonics process design kits (PDKs). Engineers can now work from schematic through simulation and layout in one environment. Teams already working on high-speed digital and radio frequency (RF) projects in ADS can use Tower processes to design p...
Accelerates component research by up to 80%: Unifies schematic design, component discovery, expertise and procurement in Cadence OrCAD Xplore Design Platform, reducing time-consuming component research from hours to minutes. Provides trusted content in workflow: Delivers manufacturer-verified models, reference designs, documentation and expert guidance from Texas Instruments, STMicroelectronics...
Developers can now quickly build application-specific solutions using sub-$12 RA MCU-based hardware with extended functionality through analog, power and connectivity modules, all in a single, end-to-end cloud development environment. Guided development support includes 100+ use-case-driven software building blocks designed for end applications, expansion modules and tools from Renesas and its ex...
MaxLinear, Inc. (Nasdaq: MXL), a leader in high-speed connectivity, mixed-signal and power-management semiconductor solutions, introduced Jeju™ (MxL77904), a highly integrated, custom multiphase power management IC (PMIC) designed for maximum efficiency in DSP-based 1.6T pluggable optical modules used in AI infrastructure networks. Purpose-built for advanced 3nm and 4nm CMOS Optical PAM4 DS...
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, announced that it is supporting quantum chip developers and manufacturers in addressing the complex manufacturing requirements associated with scaling quantum computing systems. Building on its ongoing contributions to quantum chip dev...
Ambiq® Micro, Inc. (“Ambiq”), a technology leader in ultra-low-power semiconductor solutions for edge AI, introduced heliaAOT 1.0, its ahead-of-time AI compiler for the HELIA™ AI ecosystem. This development further highlights Ambiq’s focus on building an integrated silicon and software platform that enables Edge AI compute on low-power, memory-constrained devices. heli...
German semiconductor manufacturer Infineon Technologies and South Korea's SOLUM have signed a memorandum of understanding (MoU) to expand their collaboration on high-voltage direct current (HVDC) power solutions for artificial intelligence data centres. Announced on 5 November 2026, the agreement builds on an existing technical relationship between the companies and will focus on three areas of p...
US semiconductor manufacturer onsemi has cancelled its proposed $2 billion silicon carbide (SiC) manufacturing expansion in the Czech Republic following discussions with the country's Ministry of Industry and Trade. The decision, announced on 6 November 2026, ends plans to establish additional end-to-end SiC power semiconductor production at the company's existing facility in Rožnov pod Radho&sc...
Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, launched the SGP.32 version of its Smart Connectivity Premium. The global, multi-network, multi-profile eSIM solution gives IoT customers one SKU that pairs the Smart Connectivity profile wi...
MIPS introduces advances in the Actus reference platform, an energy-efficient, open RISC-V platform that integrates real-time control, inference and communications to turn Physical AI into precise, trusted movement. Actus combines dual MIPS Atlas M8500 real-time RISC-V microcontrollers, accelerated motor-control processing and edge inference capabilities on GlobalFoundries’ (GF) energy-ef...
G&H (Gooch & Housego), a leading provider of advanced photonics solutions, announced its acquisition of IntraAction Corp., bringing together two established businesses with a long heritage in acousto-optic technology. “We are continuing to invest in acquisitions that accelerate G&H’s ability to bring enhanced value to our customers in strategic growth areas. The combined b...
Diodes Incorporated (Diodes) (Nasdaq: DIOD) announces the release of the API21550/API21552 series within its RobustISO™ family of isolation products. These dual-channel isolated gate drivers are designed for system engineers who require robust, high-voltage isolation and reliable signal transmission for power-switch driving. Applications include motor drives, solar inverters, battery managem...
Sensitron Semiconductor, a U.S.-based manufacturer of high-reliability power electronics, announced the SPHM/SEHM Series, a family of programmable Solid State Power Controllers (SSPCs) for 270VDC power distribution. Built on a microcontroller-based, commercial off-the-shelf (COTS) architecture, the series replaces discrete circuit breakers, solid state relays and system monitors with one int...