DEEPX, a leading fabless AI semiconductor company specialising in ultra-low-power Neural Processing Units (NPUs), announced a strategic partnership with Ultralytics, creator of Ultralytics YOLO—the world's most widely deployed computer vision architecture with over 130K GitHub stars. Ultralytics has become a leading platform in the global vision AI ecosystem, with YOLO models widely used ac...
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, announced the release of its 14nm embedded high-voltage (eHV) FinFET technology platform for display driver ICs, with the process design kit now available for customer designs. Successfully validated at UMC’s Fab 12A, the new process boosts power efficiency and performance...
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has begun shipping engineering samples of "TB9M040FTG," a motor control device with built-in power MOSFETs for three-phase brushless DC motor drives. The latest addition to Toshiba‘s "SmartMCD™"[1] series of motor control devices that integrates a microcontroller (MCU) and a motor driver, TB9M040FTG,...
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, announces it has been honored for the twelfth time as the Global High Service Distributor of the Year from TE Connectivity (TE). Recognised worldwide as a leader in connectors and sensors, TE awarded Mouser this prestigious distribution accolade, also know...
AI-related semiconductor stocks rallied again on Wednesday after Nvidia chief executive Jensen Huang joined former US President Donald Trump during a prominent visit to China. Investors viewed the development as a positive indication for future discussions surrounding trade and technology cooperation between the United States and China. The surge in chip shares was also driven b...
In this interview with Semicon Leaders Asia, Sean Dougherty, Vice President of Worldwide Sales at Everspin Technologies, discusses how advanced Toggle MRAM technology is enabling resilient, high-performance memory solutions for next-generation defense and aerospace applications while strengthening trusted domestic semiconductor manufacturing capabilities What does this agreement repr...
T-Global Technology announced that its flagship project, "Development of High Thermal Conductivity Materials and Two-Phase Liquid Cooling Modules for HPC Chips," has been officially approved under Taiwan's Ministry of Economic Affairs' "A+ Driving Industrial Innovation with AI" Program. As demand for AI, high-performance computing (HPC), and data centre infrastructure continues to ...
Modelithics®, the leading provider of high-accuracy RF and microwave simulation models, announced that new high-power GaN models from Guerrilla RF, Inc. (OTCQX: GUER) — a leading provider of high-performance radio frequency (RF) and microwave semiconductors — have been added to the Modelithics COMPLETE Library™. These new nonlinear models were developed through Guerrilla RF&r...
Global semiconductor materials market revenue increased 6.8% year-over-year to $73.2 billion in 2025, SEMI, reported in its Materials Market Data Subscription (MMDS). Growth was supported by gains in both the wafer fab materials and packaging materials segments, reflecting higher process complexity, advanced-node demand, and continued investment in high-performance computing and hig...
HYFIX Spatial Intelligence announced the immediate availability of samples and evaluation kits for the H1P Positioning, Navigation, and Open-Compute Module for small unmanned systems. The announcement will be showcased at AUVSI XPONENTIAL 2026 (Booth 34005), the leading industry event for autonomy and robotics. The H1P integrates HYFIX's H1 Autonomous Systems Chip into a compact, i...
Oracle announced that the Oracle Java SE Universal Subscription will help standardise global software development at Samsung Electronics, a world leader in advanced semiconductor technology. With the Oracle Java SE Universal Subscription, Samsung can simplify IT operations and strengthen security by consolidating its global internal application development on Oracle Java. To continue to expa...
Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; “Rigaku”), announced the expansion of its metrology technology development for next-generation semiconductors, leveraging global research environments. As part of this initiative, Rigaku is working with ime...
Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has shipped more than 100 million units of the Kingston A400 SATA solid-state drive. Launched in 2017, the Kingston A400 quickly gained recognition for its impressive performance in terms of booting, loading, and transferr...
indie Semiconductor (Nasdaq: INDI), an automotive solutions innovator, has announced the signing of a definitive agreement to acquire the fabless CMOS image sensor group from ams OSRAM AG for a total consideration of 40 million euros. With primary operations in Belgium and Portugal, this product line includes intelligent, high‑performance CMOS image sensors for a broad range of industrial, auto...
Macnica ATD Europe today announced the acquisition of Indesmatech, a pan-European technology and advisory company specialising in advanced semiconductor representation, design-in support and consulting, as well as point click buying services. The acquisition is a strategic move by Macnica ATD Europe to strengthen its commercial and engineering presence across Scandinavia and Northern Eu...
Cyient Semiconductors Private Limited announced the launch of seven new gallium nitride (GaN) power devices for the Indian market, developed using Navitas Semiconductor's (Nasdaq: NVTS) industry-leading GaN technology. The launch marks Cyient Semiconductors' first commercial GaN product family and a major milestone in advancing India's domestic power semiconductor ecosystem. The new p...
Infineon's Startup Challenge brings together promising founder teams and young high-tech companies from across the globe to work jointly on a highly relevant topic: humanoid robotics. The Challenge is a structured innovation program designed to develop technological concepts into market-ready applications. It is part of Infineon's global Co–Innovation Program, in which Infineon drives innova...
Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced a major customer win for its Bluetooth® High Data Throughput (HDT) solution, including Ceva's internally developed RF technology, a significant commercial milestone validating the company's strategy to expand its wireless offering and deliver comprehensive, system-level solutions to it...
FotoNation Ltd., a European-based Perception-Recognition company, and SEMIFIVE Inc., a leading global provider of custom AI semiconductor solutions, today announced a strategic collaboration agreement under which SEMIFIVE will lead turnkey development for TriSilica, FotoNation's ultra-low-power perceptual AI chip family. TriSilica is an ultra-low-power, compact-footprint perceptual AI silicon pla...
At the 2026 European Economic Congress (EEC 2026), MICROIP Chairman Dr James Yang participated in a high-level dialogue at the "Poland-Taiwan Economic Cooperation Forum." Joined by Ambassador Liu Yong-jian and HCG Vice Chairman Michael Chiu, Dr Yang advocated leveraging Taiwan's semiconductor prowess to propel Poland into a strategic hub for European Edge AI. Addressing the "Last Mile" of A...