• Tuesday | 22 September 2026
Nordson Launches ASYMTEK Vantage XL for High-Precision Panel-Level Packaging

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, introduces the new ASYMTEK Vantage® XL fluid dispensing platform, designed specifically to address the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging applications. The ASYMTEK Vantage XL extends Nordson's proven Vantage dispensing platf...

26 Aug 2026 | Wednesday | NEWS
AMD Plans $10 Billion Taiwan Investment with TSMC to Expand Advanced Chip Packaging

AMD is committing more than US$10 billion to Taiwan’s semiconductor ecosystem as it prepares for sustained growth in artificial intelligence (AI) and data-centre computing. The investment, which is expected to run through 2029, is aimed at expanding advanced packaging, semiconductor substrates and manufacturing capacity rather than being directed solely towards Taiwan Semiconductor Manufactu...

25 Aug 2026 | Tuesday | NEWS
Samsung Exynos 2700 Reportedly Beats Qualcomm Snapdragon 8 Elite Gen 6 in Performance Tests

Samsung Electronics’ next-generation mobile processor, the Exynos 2700, has reportedly delivered stronger results than Qualcomm’s upcoming Snapdragon 8 Elite Gen 6 in internal performance testing, according to industry sources. The reported results suggest that Samsung’s latest in-house application processor could strengthen its position in the premium smartphone market and pote...

25 Aug 2026 | Tuesday | NEWS
Northwestern Mutual Invests $31.34 Million in Semtech as AI and Data Centre Demand Grows

Northwestern Mutual Wealth Management Co. has established a new position in Semtech Corporation, purchasing 193,626 shares of the semiconductor company during the second quarter. The investment was valued at approximately $31.34 million, giving the investment firm a 0.21% stake in Semtech at the end of the reporting period. The move comes as several institutional investors have increased their ex...

25 Aug 2026 | Tuesday | NEWS
Infineon’s €30 Billion Order Book Faces New Test as Semiconductor Market Shifts

German semiconductor manufacturer Infineon Technologies is facing a growing disconnect between strong business fundamentals and weakening investor sentiment, with its nearly €30 billion order backlog coming under scrutiny as semiconductor stocks experience a broad market correction. The company recently reported record third-quarter revenue and maintained its full-year outlook, highlighting ...

25 Aug 2026 | Tuesday | NEWS
IBM Unveils Dual-Architecture Mainframe Processor with Native Arm Support

At the annual Hot Chips conference, IBM (NYSE: IBM) is announcing the first dual-architecture mainframe processor, which is being designed to enable enterprises to run operating systems and applications on both the IBM and Arm® compute platforms in future IBM Z and LinuxONE systems. This marks the first processor milestone to emerge from the IBM and Arm collaboration establ...

25 Aug 2026 | Tuesday | NEWS
Primemas Showcases CXL Memory Innovations for AI and HPC at FMS 2026

Primemas Inc., a pioneer in next-generation AI memory system architectures and chiplet-based silicon, showcased its latest CXL memory innovations at the Future of Memory and Storage (FMS) 2026. At the event, the company highlighted the industry's most comprehensive CXL memory portfolio and its strategic collaboration with Micron on the Abaco Project, a rack-scale compute system with over 100TB of ...

25 Aug 2026 | Tuesday | NEWS
Chiplets Market to Reach $605 Billion by 2036 as AI and Advanced Packaging Drive Growth

The global chiplets market is projected to grow from $54 billion in 2025 to $605 billion by 2036, supported by rising AI and HPC workloads, advanced packaging adoption and demand for scalable semiconductor architectures. The semiconductor industry is increasingly turning to chiplet-based architectures as conventional monolithic chip designs become more complex and costly at advanced process nodes...

24 Aug 2026 | Monday | NEWS
Nvidia Develops New AI Chip for China as It Seeks to Rebuild Market Presence

Nvidia is reportedly developing a new artificial intelligence (AI) processor specifically for the Chinese market, as the US chipmaker looks to maintain its position in one of the world's largest technology markets amid tightening export restrictions. The reported move comes as Nvidia faces growing challenges in China. US export controls have restricted the sale of some of the company's most advan...

24 Aug 2026 | Monday | NEWS
Qualcomm Snapdragon 8 Elite Gen 6 Extreme Could Introduce New Flagship Chip Naming

Qualcomm is reportedly preparing a new naming structure for its upcoming flagship smartphone processors, with the company potentially adding an ‘Extreme’ designation to its most powerful mobile chip. According to recent leaks, Qualcomm could introduce two flagship platforms under the Snapdragon 8 Elite Gen 6 family. The standard processor is expected to retain the Snapdragon 8 Elite G...

24 Aug 2026 | Monday | NEWS
SK hynix Reviews Chongqing Packaging Operations as AI Demand Drives HBM Expansion

South Korean memory semiconductor manufacturer SK hynix is reviewing the future of its packaging operations in Chongqing, China, as the company adjusts its manufacturing strategy to meet rapidly rising demand for artificial intelligence (AI) memory. The review comes as SK hynix continues to increase its focus on high-bandwidth memory (HBM) and advanced packaging technologies, which have become in...

24 Aug 2026 | Monday | NEWS
Qnity Electronics Appoints Ken Rizvi as Chief Financial Officer

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced that it has appointed Ken Rizvi, a seasoned semiconductor finance executive, as Senior Vice President and Chief Financial Officer, effective October 1. Michael Goss, who has been serving as interim Chief Financial Officer, will assume the role of Qnity&rsqu...

24 Aug 2026 | Monday | NEWS
Mouser Launches Consumer Technology Resource Centre for Smarter Product Development

Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, highlights its new digital resource centre for consumer technology, providing engineers with emerging technologies, reference designs, and implementation guidance to accelerate product development. This resource centre supports faster prototyping, streamlined i...

24 Aug 2026 | Monday | NEWS
TekSiC Advances Europe’s First Domestic Semi-Insulating SiC Wafer Supply for Defence and Space

Swedish semiconductor materials company TekSiC has reached several important milestones in its efforts to establish Europe’s first commercially available domestic supply of semi-insulating silicon carbide (SI-SiC) wafers for space, defence and radio-frequency (RF) applications. The company is developing a European supply base for a material that is increasingly important in high-frequency a...

21 Aug 2026 | Friday | NEWS
BrainChip Launches Open-Source Akida Bundle for AI Workload Scheduling with IBM Symphony

BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), a global leader in ultra-low power, fully digital, event-based neuromorphic AI, has released the Symphony Community Akida Bundle, a free, open-source software bundle that lets developers run BrainChip Akida neuromorphic processors alongside their existing compute under a workload scheduler built on IBM Spectrum Symphony Community E...

21 Aug 2026 | Friday | NEWS
Qnity Electronics Installs KLA Surfscan SP7XP to Advance Semiconductor Materials Innovation

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced the installation of a Surfscan® SP7XP unpatterned wafer defect inspection system from KLA as part of its ongoing investment in advanced semiconductor materials innovation. The system enhances Qnity's ability to develop and manufacture leading-...

21 Aug 2026 | Friday | NEWS
Toshiba Launches 80V eFuse IC for 48V Industrial Power Systems and Equipment

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added “TCKE1401NM,” an 80V-rated electronic fuse (eFuse IC), to its lineup of eFuse ICs with multiple built-in power line protection functions. Shipments start today. The new product adopts the VQFN24D package, an industry-leading[1] small package for 80V-rated eFuse ICs, which contributes to improved safet...

21 Aug 2026 | Friday | NEWS
SEMICON India 2026: PM Modi to Inaugurate Global Semiconductor Industry Event in New Delhi

Prime Minister Narendra Modi will inaugurate SEMICON India 2026 at Yashobhoomi, the India International Convention and Expo Centre in New Delhi. The event will bring together stakeholders from across the global semiconductor ecosystem, including manufacturers, technology companies, equipment and materials suppliers, investors, researchers and policymakers. Organised by SEMI in collaboration with ...

21 Aug 2026 | Friday | NEWS
Hanmi Semiconductor Invests $94 Million in New Incheon Plant to Expand HBM and AI Chip Equipment Capacity

South Korean semiconductor equipment maker Hanmi Semiconductor is investing approximately KRW 130 billion (around US$94 million) to establish its eighth production facility in Incheon, marking the largest manufacturing investment in the company’s history. The expansion comes as demand for equipment used in artificial intelligence (AI) semiconductor and high-bandwidth memory (HBM) production ...

21 Aug 2026 | Friday | NEWS
proteanTecs Expands Chiplet Analytics Solutions for Advanced Multi-Die Packaging

proteanTecs®, the leading provider of deep data visibility for advanced electronics, unveiled a dedicated suite of health, power and performance management solutions for multi-die systems. Based on the company’s unique on-chip monitoring technology, semiconductor and system companies can now improve yield, reduce risk and protect investments in high-value systems-in-package. AI is ...

20 Aug 2026 | Thursday | NEWS

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