• Thursday | 26 March 2026
Airspan Networks Holdings LLC Launches AirUnity Small Cells Powered by EdgeQ Chip

Airspan Networks Holdings LLC (“Airspan”), a leading global provider of wireless network solutions, announced the launch of AirUnity Small Cells, a next-generation small cell portfolio designed to help mobile network operators (MNOs) and enterprises expand 4G and 5G coverage and capacity through targeted deployments that support scalable network densification across diverse indoor and ...

26 Feb 2026 | Thursday | NEWS
Renesas Electronics Corporation ADAS SoC Selected for Toyota Motor Corporation RAV4

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced that its ADAS automotive system-on-chip (SoC), R-Car V4H, has been selected for the TSS(LSS) control unit used in Toyota Motor Corporation’s new RAV4 model, which debuted in December 2025. The control unit is supplied by Denso Corporation. Engineered for advanced ADAS (Advanced Drive...

26 Feb 2026 | Thursday | NEWS
Vinci Launches Thermo-Mechanical Simulation for Semiconductor Warpage Analysis

Vinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under real-world thermal conditions. This capability is built on the world’s first foundation model for physics, developed by Vinci to transform hardware design—mirroring how generative A...

26 Feb 2026 | Thursday | NEWS
Guerrilla RF, Inc. Expands Semiconductor Push into UAS and Counter-Drone Markets

Guerrilla RF, Inc. (OTCQX: GUER), a leading provider of state-of-the-art radio frequency (RF) and microwave semiconductors, announced its expanded focus and readiness to support the rapidly evolving Unmanned Aerial Systems (UAS) and Counter-UAS (C-UAS) markets. With a deep portfolio spanning low-noise small-signal devices through high-power RF power amplifiers, Guerrilla RF offers over 90 componen...

26 Feb 2026 | Thursday | NEWS
The Chemours Company Executive Joins SEMI North America Advisory Board

The Chemours Company (Chemours) (NYSE: CC), a global chemistry company, announced that Gerardo Familiar, President of the company's APM business, has been appointed to the SEMI North America Advisory Board (NAAB). SEMI is a global industry association serving thousands of member companies across the semiconductor and electronics design and manufacturing supply chain. The SEMI N...

25 Feb 2026 | Wednesday | NEWS
SambaNova Systems Unveils SN50 AI Chip, Plans Strategic Collaboration with Intel

SambaNova introduced their SN50 AI chip, which boasts a max speed that’s 5X faster than competitive chips. The company also announced a planned collaboration with Intel to deliver high‑performance, cost‑efficient AI inference solutions, and more than $350M in investment from new and existing investors. Positioned as the most efficient chip for agentic AI, the SN50 chip offers ...

25 Feb 2026 | Wednesday | NEWS
Apple Inc. Expands U.S. Chip and Semiconductor Manufacturing in Houston

Apple® announced a significant expansion of factory operations in Houston, bringing the future production of Mac mini® to the U.S. for the first time. The company will also expand advanced AI server manufacturing at the factory and provide hands-on training at its new Advanced Manufacturing Center beginning later this year. Altogether, Apple’s Houston operations will create thousands...

25 Feb 2026 | Wednesday | NEWS
KIOXIA America, Inc. Begins Shipping UFS 5.0 Evaluation Samples

KIOXIA America, Inc. today announced that it has begun shipping evaluation samples1 of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being standardized by JEDEC®2. UFS 5.0 is a new standard for embedded flash storage designed to meet the performance requirements of next-generation mobile devices such as high-end smartphones equip...

25 Feb 2026 | Wednesday | NEWS
proteanTecs and Gubo Technologies Partner to Enhance AI Chip Visibility

proteanTecs®, a leading provider of deep data health and performance monitoring solutions for advanced electronics, and Gubo Technologies Co., Ltd., China’s first post silicon workflow automation solution provider, today announced a collaboration to deliver combined semiconductor analytics solutions. The collaboration is intended to provide broad, actionable insights into yield, quality,...

25 Feb 2026 | Wednesday | NEWS
Fractilia Secures First Production Deployment of FAME 300 System

Fractilia, the industry leader in high-accuracy stochastics metrology and control, announced that its FAME 300™ system has been adopted for production use by a top-five semiconductor device maker, marking the first time an in-line stochastics control solution has been fully integrated into a modern manufacturing environment. Fractilia confirmed that FAME 300 has been deployed as a fully aut...

25 Feb 2026 | Wednesday | NEWS
Vanguard Group Inc. Increases Stake in Lattice Semiconductor Corporation

Vanguard Group Inc. has boosted its holdings in Lattice Semiconductor Corporation, purchasing an additional 189,147 shares of the company. The transaction reflects continued institutional interest in the US-based developer of low-power field-programmable gate array (FPGA) technology. The latest filing reveals that Vanguard acquired the shares at prevailing market prices during the reporting perio...

24 Feb 2026 | Tuesday | NEWS
Baya Systems and Aion Silicon Partner to Accelerate SoC and Chiplet Development

Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI, high-performance computing (HPC), and automotive applications, today announced a partnership with Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture and design services company. Together, the companies are delivering a joint solution that enables faster definition, design,...

24 Feb 2026 | Tuesday | NEWS
Powerchip Semiconductor Manufacturing Company Partners with Intel and SoftBank to Develop AI Memory Alternative

Powerchip Semiconductor Manufacturing Company (PSMC) has joined forces with major technology players, including Intel and SoftBank, in a collaborative effort to develop an alternative memory solution to high-bandwidth memory (HBM) for artificial intelligence applications. The initiative aims to reduce reliance on existing memory technologies and strengthen supply chain resilience for next-generati...

24 Feb 2026 | Tuesday | NEWS
Meta Expands AI Data Center Infrastructure with NVIDIA Technology

Meta is significantly increasing its investment in artificial intelligence infrastructure by deploying a new generation of data centre systems powered by NVIDIA technologies. The expanded collaboration aims to support Meta’s advanced AI workloads and to enhance the performance and efficiency of its underlying compute platforms. The social media and technology company has continued to adopt ...

24 Feb 2026 | Tuesday | NEWS
SEALSQ Corp Expands Quantum Strategy with New Investment in EeroQ

SEALSQ Corp has reinforced its quantum technology strategy through an additional strategic investment in US-based quantum hardware developer EeroQ. The move forms part of the company’s broader “Quantum Made in USA” initiative, aimed at accelerating domestic innovation and building secure, sovereign quantum computing capabilities. The follow-on investment, made via SEALSQ’s...

24 Feb 2026 | Tuesday | NEWS
INCERGO S.A. Expands Share Capital to Advance Merger with Visual Semiconductor Inc.

INCERGO S.A. (Symbol: ICG) announces that, effective February 19, 2026, its issued share capital has increased from 5,060,000 to 151,283,387 registered ordinary shares. The issuance of 146,223,387 new shares has been duly registered and is effective on the Vienna Stock Exchange as of today. The company announced further progress in its merger with Visual Semiconductor Inc. (VSI). The newly issued...

24 Feb 2026 | Tuesday | NEWS
SPIE and Cadence Design Systems, Inc. Establish Ya-Chieh Lai Memorial Scholarship

SPIE, the international society of optics and photonics, Cadence Design Systems, Inc., and the Cadence Giving Foundation have partnered to jointly fund the Ya-Chieh Lai Memorial Scholarship. Starting in 2027 and spanning five years, the annual $10,000 scholarship will be awarded to a university student during the SPIE Design Technology Co-Optimization (DTCO) conference at ...

23 Feb 2026 | Monday | NEWS
Asahi Kasei Microdevices Corporation Thin-Film Hall Technology Earns Institute of Electrical and Electronics Engineers Milestone Recognition

Asahi Kasei Microdevices Corporation (AKM) has announced that its commercialization of thin-film Hall elements, initiated in 1983, has been recognized as an IEEE Milestone by the Institute of Electrical and Electronics Engineers (IEEE). The IEEE Milestone program honors historic achievements that represent groundbreaking innovations in electrical and electronic engineering. To be recognized, at le...

23 Feb 2026 | Monday | NEWS
Teledyne HiRel Semiconductors Launches Ultra-Low-Power 4 GHz Wideband LNA

Teledyne HiRel Semiconductors, a leader in ruggedized semiconductors for mission-critical environments, today announced the TDLNA0840EP, an ultra-low-power, wideband, low-noise amplifier (LNA) that delivers guaranteed operation to 4.0 GHz, while consuming only tens of milliwatts from a single 1.5-volt supply. With a typical gain of 29 dB and a typical noise figure of 1.5 dB across 0.3–4...

23 Feb 2026 | Monday | NEWS
SEMIFIVE Wins U.S. Design Contract for FHE Hardware Accelerator

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced that it has secured a design win from Niobium, a U.S.-based leader in Fully Homomorphic Encryption (FHE) hardware acceleration platforms. This partnership represents a strategic milestone in SEMIFIVE's expansion in the U.S. market. The contract, valued at around KRW 10 billion (USD 6.86 million), covers the...

23 Feb 2026 | Monday | NEWS

Asia Pacific

Europe

United States of America