• Tuesday | 22 September 2026
Anderon Secures $1 Billion CHIPS Award to Advance Quantum Wafer Manufacturing

Anderon LLC ("Anderon"), an IBM (NYSE: IBM) company, announced the finalisation of a $1 billion award under the CHIPS and Science Act with the U.S. Department of Commerce (the "Department"). The award will accelerate Anderon's R&D efforts to advance the nation's quantum wafer manufacturing capabilities. Announced in May under a letter of intent between the Department and IBM, Anderon operates...

17 Sep 2026 | Thursday | NEWS
Air Products Invests $250 Million in Arizona to Support US Semiconductor Expansion

Air Products (NYSE: APD) announced it has signed a long-term agreement with one of the leading semiconductor manufacturers to supply high-purity industrial gases and related infrastructure to support the customer's plant and production expansion plans in the United States (U.S.). This is the second semiconductor manufacturing supply win Air Products has recently announced, with a combined inv...

17 Sep 2026 | Thursday | NEWS
MIPI Alliance Forms Kinematics Working Group to Standardise Radar and Lidar Data

The MIPI Alliance, an international organisation that develops specifications that standardise wired interfaces for mobile and other connected ecosystems, announced the formation of a Kinematics Working Group focused on the development of a specification to standardise the format of kinematic sensor data streams transported over the broadly implemented MIPI CSI-2 camera and imaging interface. Kin...

17 Sep 2026 | Thursday | NEWS
Cadence and Analog Devices Develop Next-Generation SHARC-FX DSP for Automotive Audio

Cadence (Nasdaq: CDNS) announced that its Tensilica IP Group and Analogue Devices, Inc. (ADI) worked together to develop the latest generation of SHARC® automotive audio processors, further strengthening ADI’s industry-leading position in premium in-vehicle audio solutions. The joint effort brings Cadence’s highly optimised Tensilica DSP architecture into the next-generation ADSP p...

17 Sep 2026 | Thursday | NEWS
TeRAM Emerges from Stealth with $37 Million to Develop 3D SRAM for AI Datacentres

TeRAM emerged from stealth with $37 million in equity financing from early-stage investors to tackle the memory wall facing AI deployment. The company is developing custom 3D SRAM for frontier AI applications, initially in data centers. As AI models scale beyond two trillion parameters, new memory technology is needed to increase capacity and throughput while reducing power consumption. TeRAM is v...

18 Sep 2026 | Friday | NEWS
Aeonsemi Advances Ultra-Compact Timing Solutions for Automotive, Robotics and Physical AI

Semicon Leaders Asia speaks with Foeking Wu, Clock Product Line Manager at Aeonsemi, about the company’s ArcadiumNano™ silicon oscillator family and how ultra-low power, flexible frequency coverage and compact packaging are enabling next-generation intelligent systems. Q. Aeonsemi is bringing its proven Arcadium™ timing technology into the new ArcadiumNano™ family. What ma...

16 Sep 2026 | Wednesday | Interaction
Valens Semiconductor Appoints Semtech COO Asaf Silberstein to Board of Directors

Valens Semiconductor (NYSE: VLN), a leading provider of high-performance connectivity chipsets, announced the appointment of Asaf Silberstein, Executive Vice President and Chief Operating Officer of Semtech Corporation, to its Board of Directors. Silberstein brings more than two decades of leadership experience in the semiconductor industry, with extensive expertise in global operations, business...

16 Sep 2026 | Wednesday | NEWS
EUCLYD Secures More Than €200 Million Series A to Advance AI Infrastructure

EUCLYD has signed a Series A financing round of more than €200 million, the company announced. The round is co-led by Samsung, Somerset Capital Partners, Scaleup Europe Fund, which is managed by EQT, and Innovation Industries, with participation from EIFO, the Export and Investment Fund of Denmark, imec. xpand, Brabant Development Agency (BOM), and Quadri. Peter Wennink, former President...

16 Sep 2026 | Wednesday | NEWS
MediaTek Launches Dimensity 9600 Pro with 2nm Process and Agentic AI

MediaTek, the world's number one provider of mobile chipsets, announced the launch of the Dimensity 9600 Pro. This flagship SoC achieved a significant technological milestone, adopting the new 2nm process node; as the first company to announce reaching this threshold, MediaTek is showcasing its leadership in innovation with the Dimensity 9600 Pro. With the next generation of silicon now avail...

16 Sep 2026 | Wednesday | NEWS
Lorentz Solution and NVIDIA Advance 3D EM Sign-Off for AI Chip and Silicon Photonics Designs

Lorentz Solution, Inc., the world's leading provider of 3D electromagnetic (EM) design platforms for IC, 3DIC, and advanced packaging, announced that it is jointly presenting with NVIDIA at the TSMC 2026 Open Innovation Platform (OIP) Ecosystem Forum, to be held in Santa Clara, CA. Their paper, "Large-scale Chip-level 3D EM Extraction and Sign-off of Ultra-high-speed Silicon Photonics and Custom S...

16 Sep 2026 | Wednesday | NEWS
Teradyne Opens Bengaluru Office to Support India’s Growing Semiconductor Manufacturing Industry

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, announced the opening of an office in India focused on supporting semiconductor manufacturing, located in Bengaluru, Karnataka. The new office formalises Teradyne’s growing presence in the country and underscores the company’s long-term commitment to India’s semiconductor and elect...

16 Sep 2026 | Wednesday | NEWS
Singular Photonics Launches Litavis SPAD Sensor with In-Pixel Photon Processing

Singular Photonics, an innovator in single-photon imaging, announced the launch of its most advanced image sensor to date. Litavis is the world's first single-photon avalanche diode (SPAD) sensor using in-pixel processing to unify imaging, timing, histogramming and photon statistics on a single chip. Designed to bring unprecedented flexibility and intelligence to imaging applications, Litavis int...

15 Sep 2026 | Tuesday | NEWS
Taiyo Holdings and imec Demonstrate 700nm RDL Technology for Advanced Semiconductor Packaging

Taiyo Holdings Co., Ltd. (Securities code: 4626; hereinafter "Taiyo Holdings"), based in Tokyo, presented a paper, at the 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026), held in Helsinki, Finland, on the "FPIM Series" (hereinafter the "Material"), a next-generation semiconductor-packaging material. The FPIM Series is a fine-pitch RDL (*1) negative-tone i-line photo...

15 Sep 2026 | Tuesday | NEWS
Arasan Chip Systems Advances MIPI I3C Interoperability with Host, Device and Software IP Testing

Arasan Chip Systems announces its participation in the I3C® Interoperability Session to be held at the sidelines of the Member Meeting in Taipei. Arasan will test its I3C® Host IP, I3C® Dual Mode IP (supports I3C® Host & Device) and I3C® Device IP with other I3C® interop participants. Arasan will also test its licensable proprietary I3C®...

15 Sep 2026 | Tuesday | NEWS
TAITRA Showcases 56 Taiwanese Manufacturers and Advanced Manufacturing Technologies at IMTS 2026

The Taiwan External Trade Development Council (TAITRA) is launching its premier showcase, inviting manufacturing leaders from around the world to IMTS 2026 on September 14 at McCormick Place. Beyond a week on the show floor, Taiwan is bringing 56 of its manufacturers directly through a full schedule of programming, from hands-on sessions to networking events built for real business excha...

15 Sep 2026 | Tuesday | NEWS
LattePanda Launches Mu Ultra x86 Compute Module for On-Device AI

LattePanda Team launched LattePanda Mu Ultra, a micro x86 compute module purpose-built for on-device AI. Powered by Intel Core Ultra 5 226V and Ultra 7 256V processors, it delivers up to 115 TOPS of AI performance in a compact 69.6 × 60mm form factor. Built to address the hardware, compute, and software challenges of running AI locally, LattePanda Mu Ultra brings powerful AI comput...

15 Sep 2026 | Tuesday | NEWS
Analog Devices to Acquire Alif Semiconductor for $1.35 Billion to Advance Physical Intelligence

Analog Devices, Inc. (NASDAQ: ADI) and Alif Semiconductor announced that they have entered into a definitive agreement under which ADI will acquire Alif in an all-cash transaction for $1.35 billion. Artificial intelligence is entering a new phase as models move beyond interpreting words and images to understanding context and interacting with the physical world. This transition requires syst...

15 Sep 2026 | Tuesday | NEWS
Stäubli Showcases Connectivity and Automation Solutions for Semiconductor Manufacturing

Building on decades of semiconductor expertise, Stäubli delivers electrical and fluid connectivity solutions that help OEMs maintain process stability, protect yield, and maximise tool availability. As an industry leader, Stäubli will highlight these capabilities this October when Semicon West takes place in San Francisco, California. Visitors will have the opportunit...

14 Sep 2026 | Monday | NEWS
Alif Semiconductor Launches Low-Cost StartKits for Edge AI Microcontrollers

Alif Semiconductor®, a leading global supplier of secure, connected, power-efficient Artificial Intelligence and Machine Learning (AI/ML) microcontrollers (MCUs) and fusion processors, launched a new family of Low-Cost evaluation boards for its Edge AI-enabled Ensemble® and Balletto® Microcontrollers. The SK-B1 and SK-E1C StartKits lower the barrier of ent...

14 Sep 2026 | Monday | NEWS
Kyocera and Tohoku University Develop Laser-Annealed Optical Isolators for Silicon Photonics

Kyocera Corporation (President: Shiro Sakushima; "Kyocera") and the Research Institute of Electrical Communication (RIEC), Tohoku University (Director: Kazushi Ishiyama; "Tohoku University") have developed a new technology*1 for integrating optical isolators onto silicon photonics chips using "laser annealing," a localised, laser-based heat-treatment method.An optical isolator is a component ...

14 Sep 2026 | Monday | NEWS

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