• Monday | 09 November 2026
AXT’s Tongmei Secures Up to US$545 Million in Private Equity Financing to Expand Indium Phosphide Wafer Production

AXT, Inc. (NasdaqGS: AXTI), a leading manufacturer of compound semiconductor substrates announced that its majority-owned subsidiary, Beijing Tongmei Xtal Technology Co., Ltd. (“Tongmei”), has entered into definitive agreements for a private equity financing to fund further expansion of its manufacturing capacity for indium phosphide semiconductor substrates, expansion of its principal...

30 Oct 2026 | Friday | NEWS
High NA EUV Lithography Benefits, Challenges, and the Path to Continued Scaling

As the semiconductor industry begins the 2nm manufacturing ramp and accelerates R&D toward the sub-2nm node, high numerical aperture (NA) extreme ultraviolet (EUV) lithography is emerging as a critical enabler of continued device scaling. By improving resolution and enhancing pattern fidelity, high NA EUV lithography is expected to play a central role in future semiconductor manufacturing. Her...

30 Oct 2026 | Friday | Feature
ChipAgents Expands AI-Powered Platform Across Digital and Analog Chip Design with NVIDIA Collaboration

ChipAgents is expanding its agentic AI platform across digital and analog chip design, bringing traditionally fragmented workflows onto a common AI-native foundation. The platform is powered by IC-star, the chip neural engine that combines persistent design knowledge, advanced reasoning and orchestration, dynamic model routing and physics-aware models. ChipAgents’ full-stack approach bui...

29 Oct 2026 | Thursday | NEWS
Sony Introduces 50MP LYTIA 720 Smartphone Image Sensor with Improved Low-Light Performance and 4K HDR Video

Sony Semiconductor Solutions Corporation (Sony) announced the upcoming release of the LYTIA 720, an approximately 50-effective megapixel*1 image sensor for mobile applications that delivers industry-leading*2 low-light performance and supports 4K 60 fps HDR video recording. Designed for use on the main camera of mobile devices, the new sensor inherits technologies developed for Sony's LYTIA high-...

29 Oct 2026 | Thursday | NEWS
ChipNexus Launches NEX Analog Agent to Automate Semiconductor Design and Verification

ChipNexus™, a developer of agentic AI software for semiconductor and hardware design, announced the availability of the NEX™ Analog Agent, which brings analog design capabilities to NEX™, its multi-agent engineering platform. The Analog Agent works directly with Cadence Virtuoso, Spectre simulation and Siemens Calibre physical verification, using the EDA licenses and process desi...

29 Oct 2026 | Thursday | NEWS
Phison Electronics Wins Two Micron Supplier Awards for Semiconductor Performance and Quality

Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, is honored to announce that it was presented with Outstanding Supplier Performance Awards in the Semiconductor category and the Best in Quality – Assembly and Test category at the Micron Supplier Day 2026. The event, held in Boise, Idaho, United States was attended by top-level management of Micron ...

29 Oct 2026 | Thursday | NEWS
Movandi Launches 60GHz Wireless Connectivity Platform Delivering Over 5Gbps for Edge AI and 5G Networks

Movandi, the semiconductor and systems innovator powering next-generation wireless communications, announced its new 60GHz connectivity platform, powered by the MV6055 60GHz transceiver, to address the growing bandwidth and latency requirements across multiple markets including physical AI, fixed wireless access (FWA), integrated sensing and communications (ISAC), and network backhaul. The platfor...

29 Oct 2026 | Thursday | NEWS
SambaNova and Oracle Partner to Deploy SN50 AI Inference Chips in OCI Data Centres

SambaNova and Oracle are collaborating to deploy SambaRack SN50 inference chips in Oracle Cloud Infrastructure (OCI) data centers. Oracle will offer the capacity to AI model builders. The plan adds high-performance inference chips to OCI’s growing range of AI infrastructure, giving customers more choice in how they run inference at scale. SambaNova, the AI chip company delivering ...

29 Oct 2026 | Thursday | NEWS
Nexperia Targets Doubling of India Revenue and Tripling of Local Footprint

Netherlands-based semiconductor maker Nexperia expects to double its revenue in India over the next few years and has committed to tripling its existing footprint in the country within five years, according to Interim CEO Stefan Tilgner. Tilgner made the remarks to ANI in The Hague during Union Commerce and Industry Minister Piyush Goyal's visit to the Netherlands. He said Nexperia has signed a j...

28 Oct 2026 | Wednesday | NEWS
Infineon Invests €1.1 Billion in 300mm GaN Power Semiconductor Manufacturing in Austria

Infineon Technologies has announced an investment of around €1.1 billion at its Villach site in Austria to establish what it describes as the world's first high-volume manufacturing facility for gallium nitride (GaN) power semiconductors on 300mm wafers. High-volume production is scheduled to begin at the end of 2027, with investment continuing through 2034. The expansion will upgrade infras...

28 Oct 2026 | Wednesday | NEWS
China's Chip Manufacturing Expansion Threatens South Korean Memory Margins, PwC Says

South Korea's semiconductor industry needs to strengthen its cost competitiveness and move towards higher-value products as China expands its chip manufacturing capacity, according to a new report from Samil PwC, the South Korean member firm of PricewaterhouseCoopers. Published on 26 October 2026, the report examines how China's semiconductor industry has developed beyond individual technology in...

27 Oct 2026 | Tuesday | NEWS
JST Launches Apex Wafer Dryer with Faster Processing and Improved Defect Control

 JST, a leading provider of wet benches, wafer cleaning and processing tools for the semiconductor industry, announced Apex, its upgraded Marangoni-type, isopropyl alcohol (IPA)-based wafer dryer. The new Apex dryer enables improved device yields by delivering reduced particle defect size and density and 10% to 15% shorter drying cycle times compared to JST’s existing IPA dryer. &n...

27 Oct 2026 | Tuesday | NEWS
Nagare Labs Introduces Z2RAM Memory Technology to Address AI Chip Performance Bottlenecks

Nagare Labs emerged from stealth with $5M led by Playground Global and a new memory technology designed to overcome the most critical hardware bottleneck in AI innovation. Combining density and speed, Nagare’s memory technology promises to make AI compute systems more fluid, responsive, and economically scalable. A spinout of Georgia Tech, Nagare Labs was co-founded by Dr Suman Datta and Dr...

27 Oct 2026 | Tuesday | NEWS
Samsung SDI Secures 1.5 GWh Battery Storage Supply Agreements with Alpha Omega Power in the US

Supply deals with AOP totaling 1.5 GWh, with all products to be manufactured at the SPE plant in Indiana SBB 1.7 features high-nickel NCA prismatic batteries and proven fire safety, supporting AOP projects in the WECC and ERCOT power markets Samsung SDI expands its North American ESS presence as AOP grows its U.S. storage portfolio Samsung SDI announced that its Michigan-based subsidi...

27 Oct 2026 | Tuesday | NEWS
RAAAM Memory Technologies Appoints Former Intel Foundry and Samsung Executive Hong Hao as Strategic Advisor

RAAAM Memory Technologies, a startup company providing an ultra-high-density, low-power on-chip memory technology, announced the appointment of Hong Hao, a former executive at Intel Foundry and Samsung Electronics, as Strategic Advisor. In this role, Mr Hao will work closely with RAAAM's executive team to support the company’s strategic growth and accelerate market engagement with customers ...

27 Oct 2026 | Tuesday | NEWS
HCLTech and Rapidus Open Two Semiconductor Engineering Centres in India

HCLTech (NSE: HCLTECH) (BSE: HCLTECH), a leading global technology company, and Rapidus Corporation, a Japanese company developing and manufacturing advanced logic semiconductors, officially inaugurated two HCLTech development centres in India dedicated to supporting Rapidus' evolving semiconductor engineering requirements. The centres, located in Bengaluru and Hubli, will leverage HCLTech's...

27 Oct 2026 | Tuesday | NEWS
How AlpSemi Is Reinventing Power Semiconductors for Solid-State Circuit Breakers

AlpSemi aims to transform this landscape by developing advanced power semiconductor devices specifically designed for solid-state circuit breakers (SSCBs). This approach addresses a key challenge: improving the efficiency, compactness and cost competitiveness of semiconductor-based protection. Founded in 2024 by Frédéric Dupont and Fabrice Letertre, both former executives at Soitec,...

26 Oct 2026 | Monday | Feature
Atomera, IQE Partner to Develop RF GaN-on-Silicon for Volume Manufacturing

Atomera has signed a joint development agreement with IQE plc to develop gallium nitride-on-silicon (GaN-on-Si) wafers for radio-frequency (RF) semiconductor applications, targeting improved device performance and lower manufacturing costs in high-volume markets. The collaboration will bring together Atomera's Mears Silicon Technology (MST) and IQE's compound semiconductor epitaxy capabilities to...

26 Oct 2026 | Monday | NEWS
Helion Secures Agreement for Up to $175 Million in US CHIPS Funding for Fusion Semiconductor Development

Funds will support next-generation semiconductor research and development in Everett, Washington, enabling substantial power module manufacturing capability in Washington State. The project will also support research and development for domestic next-generation semiconductor tooling. Helion, a Washington-based fusion energy company, announced it has signed a letter of intent with the U.S. De...

26 Oct 2026 | Monday | NEWS
TASKING and NXP Introduce Unified Software Development Toolchain for S32K5 Automotive Microcontrollers

TASKING, a leading provider of embedded software development tools, announced the first and only single-vendor unified toolchain for NXP® Semiconductors’ S32K5 microcontroller family. Developed in close collaboration with NXP, this toolchain brings compilation, debugging, and verification together in one workflow, accelerating development of next-generation zonal architectures and electr...

26 Oct 2026 | Monday | NEWS

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