• Tuesday | 22 September 2026
Ezurio Launches Compact Wi-Fi 6/6E Connected MCU Modules for IoT Devices

Ezurio, a global leader in wireless connectivity and Premium Partner for Infineon Technologies, announces that the Veda IF912 and IF913 series connected MCU modules are now in stock and available for purchase through its global distribution network. Powered by Infineon's AIROC™ CYW55912 and CYW55913 chipsets, the Veda series is a breakthrough, low-power high, high-performance solution that c...

31 Aug 2026 | Monday | NEWS
NEPCON ASIA 2026 to Showcase AI, Advanced Packaging and Smart Manufacturing in Shenzhen

Driven by booming AI‑led innovation, advanced packaging evolution and global supply‑chain realignment, the electronics manufacturing industry is undergoing profound transformation, with Asia accounting for more than 58% of worldwide electronics production output. As Asia's premier PCBA and smart‑manufacturing event rooted in Shenzhen — China's core electronics‑manufact...

31 Aug 2026 | Monday | NEWS
Diodes Completes $250 Million ElevATE Semiconductor Acquisition to Expand ATE Portfolio

Diodes Incorporated (Diodes) (Nasdaq: DIOD) announced the successful completion of its acquisition of ElevATE Semiconductor, Inc. ("ElevATE"), a leading provider of high-performance integrated circuits for the Automated Test Equipment (ATE) market, in an all-cash transaction for $250 million. ElevATE is a fabless semiconductor company based in San Diego, California that specialises in the develop...

31 Aug 2026 | Monday | NEWS
Movandi Launches Ultra-Low-Power Frequency Synthesiser ICs for 5G, AI Data Centres and Robotics

Movandi, the semiconductor and systems connectivity company powering intelligent wireless infrastructure, announced the MV3564 and MV3514 frequency synthesisers, two new pin- and feature-compatible devices designed for wireless communications, AI data centres, and physical AI applications. Leveraging TSMC’s 40nm radio frequency (RF) CMOS process, the devices deliver 75 fs total jitter at jus...

28 Aug 2026 | Friday | NEWS
Aeonsemi Launches Ultra-Compact ArcadiumNano Silicon Oscillators for Automotive and Robotics

Aeonsemi, an innovator of mixed-signal and DSP connectivity ICs, announced the ArcadiumNano™ family of silicon oscillators, bringing the company’s field-proven Arcadium™ DSP timing technology to ultra-compact packages for automotive, robotics, industrial and other space-constrained applications. ArcadiumNano™ supports any output frequency from 10 kHz to 125 MHz and pac...

28 Aug 2026 | Friday | NEWS
Kioxia Starts Fab3 Construction in Japan to Expand 3D Flash Memory Capacity

Kioxia Corporation, a world leader in memory solutions, announced that it has commenced site preparation and related work for the construction of Fab3, a new state-of-the-art manufacturing facility at the Kitakami Plant in Iwate Prefecture, Japan, to expand production capacity for its advanced three-dimensional flash memory, BiCS FLASH™. Fab3 will be constructed on land south of Fab2, with o...

28 Aug 2026 | Friday | NEWS
Qnity Unveils Advanced Packaging Materials Platform to Support AI Chip Growth

Qnity Electronics has introduced an integrated materials and process technology platform aimed at addressing the manufacturing demands of next-generation 2.5D and 3D semiconductor packaging. The platform is designed to support advanced applications including chiplet-based architectures, high-bandwidth memory (HBM) and emerging substrate technologies, as growing AI workloads drive demand for hi...

28 Aug 2026 | Friday | NEWS
LG Chem Targets AI Semiconductor Growth with Advanced Packaging Materials at SEMICON Taiwan 2026

LG Chem is set to showcase a broad portfolio of advanced packaging and power semiconductor materials for AI applications at SEMICON Taiwan 2026, as the South Korean chemical company seeks to strengthen partnerships with semiconductor manufacturers, OSAT providers and substrate companies. The exhibition will take place from 2–4 September at the Taipei Nangang Exhibition Centre. At the event,...

28 Aug 2026 | Friday | NEWS
Keysight Helps AttoTude Cut AI Chip Design Cycles by More Than 50%

Keysight Technologies has announced that AttoTude, a developer of advanced ASICs for AI and hyperscale data-centre applications, has expanded its use of Keysight’s electronic design automation (EDA) software across its complete IC design workflow. The collaboration has enabled AttoTude to reduce its chip design cycles by more than 50% and achieve first-pass silicon success across advanced RF...

28 Aug 2026 | Friday | NEWS
Achronix Launches 32Gbps JESD204C IP for High-Speed AI and Data Acquisition Applications

Achronix Semiconductor Corporation, the leader in data acceleration FPGAs, announced the availability of its high-performance JESD204C IP core for the Speedster®7t FPGA family. Designed to connect advanced analogue-to-digital converters (ADCs) and digital-to-analogue converters (DACs) to programmable logic, each core supports data rates of up to 32 Gbps per lane and up to eight lanes per link,...

27 Aug 2026 | Thursday | NEWS
GCT Semiconductor Partners on Next-Generation UAV Connectivity and Defence Technologies

GCT Semiconductor Holding, Inc. (“GCT”) (NYSE: GCTS), a leading designer and supplier of 5G semiconductors powering the AI data pipeline with wireless connectivity, announced a strategic partnership and license agreement with a leading infrastructure provider for utilities and IoT to accelerate the development of next-generation UAV control and communication technologies. As part ...

27 Aug 2026 | Thursday | NEWS
Agentrys Raises $24.5 Million to Advance AI-Powered Chip Design Automation

Agentrys, a startup focused on automating and continuously improving chip design, announced that it has raised $24.5 million in funding. The total comprises an oversubscribed $19.1 million seed round led by Etna Labs, following a $5.4 million pre-seed round led by MediaTek, the company’s first strategic backer. The new funding will go toward recruiting, agent-native tooling, and expanding cu...

27 Aug 2026 | Thursday | NEWS
E&R Engineering Showcases Laser and Plasma Solutions for AI and Advanced Packaging at SEMICON Taiwan 2026

E&R Engineering Corp. (Taipei Exchange: 8027), a specialist in semiconductor laser and plasma processing equipment, will showcase its latest technologies at SEMICON Taiwan 2026. Highlights will include high-precision laser drilling for Fiber Array Units (FAUs), Glass Core and Through-Glass Via (TGV) processing, Glass Carrier applications, and the PHB-600A laser processing system and R-300...

27 Aug 2026 | Thursday | NEWS
Lam Research and NY CREATES Launch Semiconductor Training Programme to Address US Talent Shortage

Robert E. Geer, Vice President for Education and Workforce Development at NY CREATES, speaks to Semicon Leaders Asia about the five-year partnership with Lam Research to strengthen semiconductor talent development. The programme aims to equip around 3,500 students with advanced process integration skills through virtual fabrication and digital-twin technology, helping prepare the workforce for the...

27 Aug 2026 | Thursday | Interaction
AMD Brings UCIe Connectivity to Select Versal Adaptive SoCs for Advanced Chiplet Designs

AMD is expanding the capabilities of its Versal adaptive SoC portfolio by introducing native support for the Universal Chiplet Interconnect Express (UCIe) 1.1 standard. The move will initially apply to selected Versal RF Series devices, enabling high-bandwidth, low-power communication between the adaptive SoCs and specialised chiplets integrated within the same package. The addition of UCIe refle...

27 Aug 2026 | Thursday | NEWS
Baya Systems Expands in Japan to Support AI, HPC and Chiplet Semiconductor Growth

Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP, announced its expansion into Japan, one of the world's fastest-growing semiconductor markets. Amid Japan's investment in advanced manufacturing and AI infrastructure, Baya is deepening engagement with Japanese semiconductor companies, foundries and technology leaders building AI, HPC, automotive and chiplet-based sy...

26 Aug 2026 | Wednesday | NEWS
Apple Unveils M6 and M5 Ultra Chips With Major AI and Performance Gains

Apple® debuted M6 in the new Mac mini® and M5 Ultra in the new Mac Studio®, providing an extraordinary leap in performance and AI capabilities. M6, Apple’s first state-of-the-art 2-nanometer chip, advances every compute block, delivering gains across every dimension of performance. The chip features a larger 12-core CPU complex with the world’s fastest CPU core, a larger 12...

26 Aug 2026 | Wednesday | NEWS
GPPC and AIR WATER Invest in Taiwan Semiconductor Speciality Gas Market

Amid growing demand for advanced semiconductor materials, Grand Pacific Petrochemical Corporation (GPPC) (TWSE: 1312) announced that it has partnered with Japanese industrial gas manufacturer AIR WATER INC. (AWI) to participate in Hong-Kuang Hi-Tech Corp.’s capital increase, a manufacturer of speciality gases for the semiconductor industry. GPPC and AWI will each hold a 35% stake, making the...

26 Aug 2026 | Wednesday | NEWS
Infineon Acquires C2i Semiconductors to Strengthen Silicon Carbide Power Portfolio

Infineon Technologies has acquired Bengaluru-based C2i Semiconductors, strengthening its capabilities in power management technologies for AI data centres and high-performance computing platforms. C2i specialises in software-defined multiphase controllers and intelligent power stages, technologies that complement Infineon’s existing portfolio of power semiconductors and power systems. The tr...

26 Aug 2026 | Wednesday | NEWS
Micron Opens Boise Training Centre to Strengthen US Semiconductor Workforce

Micron Technology has opened a new 60,000-square-foot training centre in Boise, Idaho, as it expands efforts to develop the skilled workforce needed for advanced semiconductor manufacturing in the United States. The facility combines practical technical training, education programmes and apprenticeship opportunities, creating a dedicated pathway into semiconductor careers. New Training Facility S...

26 Aug 2026 | Wednesday | NEWS

Asia Pacific

Europe

United States of America