• Sunday | 26 July 2026
Teledyne e2v Validates Radiation Performance of High-Speed ADC for Space Missions

Teledyne e2v Semiconductors announced new radiation test results for its EV10AS940, a 10-bit, 12.8 GSps, Ka-band-capable analogue-to-digital converter, or ADC, developed for demanding space payloads and mission-critical applications. These results give space engineers additional confidence when designing high-performance satellite communications payloads, synthetic aperture radar, or SAR, systems...

2 Jul 2026 | Thursday | NEWS
Keysight and WIN Semiconductors Streamline GaN MMIC Design for First-Pass Tapeout Success

Keysight Technologies, Inc. (NYSE: KEYS) and WIN Semiconductors Corp. announced a joint MMIC design workflow that enables GaN MMIC design houses to achieve first-pass tapeout success. The workflow connects on-chip multi-domain simulation, 3D layout with verifications, and off-chip MMIC evaluation board design into a single environment. It supports the growing number of companies developing Ga...

1 Jul 2026 | Wednesday | NEWS
Allegro DVT Supports European CHASSIS Programme with Video IP for Automotive Chiplet Platform

Allegro DVT announced its contribution to the European CHASSIS program's implementation of the Automotive Base Die chiplet. The 5nm chiplet is set to revolutionize the automotive semiconductor landscape, laying the foundation for the open and standardized chiplet ecosystem that will enable the next generation of software-defined vehicles. The Automotive Base Die acts as the central...

1 Jul 2026 | Wednesday | NEWS
Stathera Raises $55 Million to Scale Silicon Timing Solutions for AI Data Centres

Stathera Inc., a fabless semiconductor company pioneering silicon timing solutions, announced the close of an oversubscribed US$55 million Series B financing. As the market consolidates around a dominant incumbent, the round positions Stathera to become the leading independent alternative for AI data centre and hyperscale customers. The round was led by new investor Maverick Silicon with cont...

1 Jul 2026 | Wednesday | NEWS
LG Innotek Targets AI Semiconductor Boom with High-Value Substrate Portfolio Expansion

LG Innotek, renowned for its optical solution business and leadership in high-performance camera modules, is quickly establishing itself as a key player in package solutions, including high-value-added semiconductor substrates. Backed by a combination of structural growth drivers—including the rollout of 5G networks, trend toward higher-performing components in premium smartphones, ongoing ...

1 Jul 2026 | Wednesday | NEWS
Toshiba Launches 80V Power MOSFET to Boost AI Data Centre Power Supply Efficiency

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched “TPM1R408RH,” an 80V N-channel power MOSFET fabricated using U-MOS11-H, Toshiba’s latest-generation process[1]. The MOSFET targets applications such as switched-mode power supplies for industrial equipment used in AI data centres and communications base stations. Shipments start. The ongoing expan...

1 Jul 2026 | Wednesday | NEWS
Tema ETFs and SemiAnalysis Partner to Launch Research-Driven Semiconductor and AI Infrastructure ETFs

Tema ETFs (“Tema”), a leader in institutional-quality and actively managed exchange-traded funds, announced an exclusive ETF partnership with SemiAnalysis, the leading independent research firm specialising in semiconductors and AI infrastructure, founded by Dylan Patel. Through the partnership, Tema and SemiAnalysis will launch the first suite of institutional-grade, research-driven ...

1 Jul 2026 | Wednesday | NEWS
Quectel Unveils FCM365X Module with Wi-Fi, Bluetooth LE, Zigbee and Thread Connectivity

Quectel Wireless Solutions, a global end-to-end IoT solutions provider, announces the launch of the FCM365X, a dual-band Wi-Fi 6 and Bluetooth Low Energy (BLE) 5.4 module that is based on the NXP® Semiconductors RW612 wireless MCU and supports multiple protocols, including Zigbee and Thread. The module is powered by a high-performance Arm® Cortex®-M33 processor with TrustZone® tech...

30 Jun 2026 | Tuesday | NEWS
OMNIVISION Launches Ultra-Thin OVMed Cable Modules to Accelerate Single-Use Endoscope Development

OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog, and display technology, announced the availability of several new OVMed® ultra-thin medical-grade LED cable modules for single-use endoscopes. These complete, turnkey solutions include an image sensor with wafer-level optics, illumination, and cabling, and they provide a cost-eff...

30 Jun 2026 | Tuesday | NEWS
Ambiq Launches heliaCORE to Accelerate Edge AI Development on Apollo SoCs

Ambiq Micro, Inc. ("Ambiq®"), a technology leader in ultra-low-power semiconductor solutions for edge AI, announced heliaCORE™, the foundational software layer powering its HELIA™ Edge AI ecosystem. Built specifically for Apollo SoCs, heliaCORE provides optimized AI kernels, broad operator acceleration, and production-scale validation to help developers bring AI-enabled p...

30 Jun 2026 | Tuesday | NEWS
SEMI Forecasts Global 300mm Memory Fab Equipment Investment to Exceed $50 Billion in 2026

Worldwide 300mm fab equipment investment in the memory sector is projected to surpass $50 billion for the first time in 2026, rising 29% to $52 billion before increasing another 11% to $57 billion in 2027, SEMI reported in its latest 300mm Fab Outlook. The growth reflects continued AI-driven demand for advanced memory, supported by rising investment in AI infrastructure, data centers, an...

30 Jun 2026 | Tuesday | NEWS
Parker Madison Uses AI to Create Brand Identity for Europe's First Advanced Semiconductor Packaging Venture

Facing a tight deadline for the French government's Choose France investment summit, Parker Madison used its proprietary AI brand diagnostic tool, LucidifyPro, to align three global executive teams and deliver both a name and a logo in just six weeks. The long-standing brand strategy firm developed the successful new identity for Tessalia Technology SAS, the first advanced...

30 Jun 2026 | Tuesday | NEWS
MEXC Reports Surge in AI Memory Futures Trading Following Micron Earnings

MEXC, a pioneer in 0-fee digital asset trading, releases its observations on equity-related futures trading activity around Micron's (MU) earnings report. Micron posted quarterly revenue of approximately $41.4 billion, significantly exceeding market expectations. Following the earnings release, capital concentrated into AI memory and storage, with notable increases in trading activity ac...

30 Jun 2026 | Tuesday | NEWS
Chuck Xu of Qnity on Enabling the Next Generation of AI Infrastructure Through Advanced Packaging Materials

In this interview with Semicon Leaders Asia, Chuck Xu, President, Interconnect Solutions at Qnity, shares how advanced packaging materials are becoming a critical enabler of AI-driven semiconductor innovation. He explains how Qnity is working closely with foundries, OSATs, substrate manufacturers, and equipment partners to accelerate the adoption of organic interposers, glass-cor...

29 Jun 2026 | Monday | Interaction
DEEPX Brings Ultra-Low-Power AI Acceleration to Raspberry Pi 5 with Sixfab AI HAT+

DEEPX, an on-device AI semiconductor pioneer, announced that its ultra-low-power NPU technology is powering the Sixfab AI HAT+ for Raspberry Pi 5, a new edge AI acceleration board developed by Sixfab, an edge AI hardware solutions company and Official Raspberry Pi Design Partner. Marked as "Intelligentized by DEEPX," the product brings high-performance, low-power AI inference capabilities to the ...

29 Jun 2026 | Monday | NEWS
Reed Semiconductor Secures $100 Million to Accelerate AI Power Solutions Growth

Reed Semiconductor has completed an upsized and oversubscribed funding round worth $100 million, attracting investment from several leading global semiconductor companies. The successful fundraising marks a significant milestone for the company as it seeks to expand its presence in the rapidly growing AI infrastructure market. The fresh capital will be used to accelerate product development, stre...

29 Jun 2026 | Monday | NEWS
I-Pulse Secures $250 Million CHIPS Award to Advance Silicon Carbide Semiconductor and Geothermal Technologies

I-Pulse Co-founders Robert Friedland, CEO, and Laurent Frescaline, CTO, announced a definitive agreement with the U.S. Department of Commerce’s CHIPS Research and Development Office for a $250 million award for the further development of I-Pulse’s proprietary semiconductor and pulsed power technology. “With today’s announced investment, the Trump administration is strength...

29 Jun 2026 | Monday | NEWS
Code Metal Expands Semiconductor and Communications Capabilities with SPT Acquisition, Launches Advanced RF Group

Code Metal, the company that accelerates the path from code to metal with provable AI, announced its acquisition of Signal Processing Technologies, Inc. (SPT) and the launch of its new Advanced RF Group. The acquisition extends Code Metal's platform into advanced communications, spectrum awareness, and digital signal processing — capabilities that underpin commercial telecommunications, auto...

29 Jun 2026 | Monday | NEWS
SK keyfoundry Advances Automotive Semiconductor Portfolio with On-Chip EMC Protection Technology

SK KeyFoundry, an 8-inch pure-play foundry in Korea, announced that it has recently developed a 'Bi-SCR (Bi-directional Silicon Controlled Rectifier)-based On-Chip EMC protection technology' capable of dramatically enhancing the EMC (ElectroMagnetic Compatibility) of automotive semiconductors. The company stated it has successfully applied this technology to its 0.13-micron BCD (Bipolar-CMOS-DMOS)...

29 Jun 2026 | Monday | NEWS
ChipAgents Joins AWS Partner Network to Expand AI-Driven Semiconductor Engineering Capabilities

ChipAgents, a leading provider of Agentic AI platforms in the semiconductor design industry, announced that it has joined the Amazon Web Services (AWS) Partner Network (APN), a global community of AWS Partners that leverage programs, expertise and resources to build, market and sell customer offerings. “AI has enormous potential in semiconductor engineering, but the industry’s biggest...

26 Jun 2026 | Friday | NEWS

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