• Tuesday | 22 September 2026
Wafer-Scale P-Type 2D Semiconductor Clears Key Hurdle for Next-Generation Chips

Researchers have made progress towards addressing one of the major challenges facing two-dimensional semiconductor technology: developing a stable, high-performance p-type material that can be produced across wafer-scale substrates. The advance could support the development of future complementary metal-oxide-semiconductor (CMOS) technologies as the semiconductor industry explores alternatives to ...

3 Sep 2026 | Thursday | NEWS
Andes Technology Cuts Chip Design and Verification Time with ChipAgents AI

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced that Andes Technology, a leading supplier of RISC-V processor IP and a Founding Premier member of RISC-V International, has successfully deployed ChipAgents across multiple processor design and verification projects. In production deployments, Andes reduced a processor customisation task f...

3 Sep 2026 | Thursday | NEWS
Everspin and Teledyne HiRel Expand MRAM Solutions for Aerospace and Defence

Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of MRAM solutions, and Teledyne HiRel Semiconductors (Teledyne HiRel), a business unit of Teledyne Technologies Incorporated (NYSE: TDY) and a leading supplier of high-reliability semiconductor solutions, announced a strategic partnership to accelerate adoption of Everspin’s MRAM in aerospace, de...

3 Sep 2026 | Thursday | NEWS
Navitas Delivers 5th-Generation GaNFast Technology Through US Manufacturing Partnership

Navitas Semiconductor has announced the delivery of its latest fifth-generation GaNFast power semiconductor technology, manufactured in the United States through its strategic collaboration with GlobalFoundries. The development represents a step towards strengthening domestic production of gallium nitride (GaN) power devices as demand increases for more efficient power conversion across artificial...

3 Sep 2026 | Thursday | NEWS
Penn State and Battalion Launch $6M Research Programme for Advanced Semiconductors and High-Temperature Materials

Penn State and Battalion Advanced Technology Ltd ("Battalion") have entered into two research agreements worth up to $6 million to develop advanced semiconductor platforms and high-temperature materials that aim to enable next-generation energy, transportation, aerospace and industrial systems while also providing critical capabilities for national security. Led by researchers at Penn State's Mat...

3 Sep 2026 | Thursday | NEWS
Kulicke & Soffa Expands Advanced Packaging Solutions for AI and CPO

Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company"), a global leader in semiconductor and electronics assembly solutions, continues to strengthen its position as a critical enabler of next-generation artificial intelligence (AI) infrastructure through its advanced packaging portfolio, inc...

2 Sep 2026 | Wednesday | NEWS
EV Group Advances CPO Manufacturing for AI Data Centres and HPC

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, announced that it is actively engaged with customers and partners across the rapidly evolving co-packaged optics (CPO) ecosystem to support the needs of hyperscale data centers, AI infrastructure and high-performance computing (HPC) ap...

2 Sep 2026 | Wednesday | NEWS
GigaDevice Joins Zephyr Project to Expand GD32 MCU Open-Source Ecosystem

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has officially joined the Zephyr® Project, one of the world’s leading open-source real-time operating systems (RTOS). Hosted by the Linux Foundation®, the Zephyr® Project welcomes GigaDevice as a Silver Member, making Gig...

2 Sep 2026 | Wednesday | NEWS
Teradyne Launches Three UltraFLEXplus Instruments for AI Semiconductor Testing

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, announced the launch of three new instruments for its UltraFLEXplus platform, designed to meet the increasingly complex demands of AI and data center semiconductor testing. The UltraPin5000-EM, UltraPort-PCIe6, and UltraVS64-HP instruments are designed to deliver unmatched scalability, fle...

2 Sep 2026 | Wednesday | NEWS
Butterfly Network Partners with Merge Labs on Ultrasound-Based Brain-Computer Interfaces

Butterfly Network, Inc. ("Butterfly") (NYSE: BFLY), a pioneer and leader in semiconductor-based ultrasound, programmable cloud software and AI, and Merge Labs announced a multi-year licensing agreement through Butterfly Embedded™. The agreement gives Merge access to Butterfly’s Poseidon Family of Ultrasound-on-Chip™ technology for the development of ultrasound-base...

2 Sep 2026 | Wednesday | NEWS
THine Electronics Unveils DSP-Free Optical Chipset for PCIe 6/7 AI Servers

THine Electronics, Inc. (Tokyo Stock Exchange:6769, “THine”), a global leader in high-speed interface technologies, announced the introduction of two new optical semiconductor products featuring its proprietary ZERO EYE SKEW® technology. By eliminating digital signal processors(DSPs) with innovative proprietary circuit technology, these solutions deliver ultra-low latency, red...

2 Sep 2026 | Wednesday | NEWS
BTU Expands Reflow Technology with Advanced Formic Acid Capability

BTU International has introduced a new Formic Acid Reflow capability across several of its reflow oven platforms, targeting the growing requirements of advanced semiconductor packaging, power electronics and high-reliability electronic assemblies. The technology enables fluxless soldering while providing tighter process control, improved solder joint quality and the potential to reduce operating c...

1 Sep 2026 | Tuesday | NEWS
Qnity Launches Stackplane CMP Slurries for Advanced Semiconductor Packaging

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP). Stackplane™ slurries support the industry's move toward shrink and stack, where continued t...

1 Sep 2026 | Tuesday | NEWS
ACES and Movandi Partner to Advance 5G and 6G Wireless Infrastructure in Saudi Arabia

Advanced Communications and Electronic Systems Company (ACES) and Movandi, the semiconductor and systems connectivity company powering intelligent wireless infrastructure, announced a strategic partnership, formalised through a Memorandum of Understanding (MoU) during LEAP 2026 in Riyadh, to advance the development, validation and commercialisation of next-generation 5G and future 6G wireless...

1 Sep 2026 | Tuesday | NEWS
MemryX Powers Edge AI Safety System at Express LUCK Smart Factory

MemryX Inc., a provider of high-efficiency AI acceleration technology, announced that Express LUCK has deployed a MemryX-powered edge AI system within its manufacturing operations. The system supports real-time safety compliance on active production lines as part of Express LUCK's broader smart factory strategy. Express LUCK is a major global television and consumer electronics manufacturer produ...

1 Sep 2026 | Tuesday | NEWS
CollPlant to Acquire LightSolver in Move into Photonic AI Computing

CollPlant Biotechnologies Ltd. (Nasdaq: CLGN) announced that it has signed a definitive agreement to acquire LightSolver Ltd. ("LightSolver"), an Israeli deep-tech company pioneering a fundamentally new computing architecture based on lasers. The acquisition is expected to close this week. CollPlant is acquiring LightSolver utilising an equity-centric consideration structure c...

1 Sep 2026 | Tuesday | NEWS
GigaDevice Expands EMEA and Asia Distribution with Rutronik Partnership

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, announced a new strategic franchise partnership with Rutronik Elektronische Bauelemente GmbH, one of Europe’s leading broadline distributors of electronic components. The agreement covers EMEA and Southeast Asia, including India, and prov...

1 Sep 2026 | Tuesday | NEWS
Lasertec and Japanese Semiconductor Stocks Gain as AI Chip Demand Accelerates

Japan’s semiconductor industry is gaining renewed investor attention as rising demand for artificial intelligence infrastructure creates opportunities for companies supplying equipment and technologies to the chip sector. Among the companies highlighted in a recent market screen are Lasertec and two other Japanese businesses identified for their growth potential and significant insider owner...

31 Aug 2026 | Monday | NEWS
Needham Sees Strong Mature-Node Semiconductor Demand as Industry Upcycle Broadens

Needham’s latest semiconductor equipment tracker points to continued strength across mature-node manufacturing, with improving global chip sales and firm memory pricing supporting the broader semiconductor cycle. The 33rd Semicap Tracker, which incorporates July equipment import data from South Korea, Taiwan and China, as well as semiconductor sales through June and memory spot prices throug...

31 Aug 2026 | Monday | NEWS
SK hynix Breaks Ground on $4 Billion US HBM Production Hub in Indiana

  SK hynix Inc. is opening a new future for AI cooperation between the United States and South Korea by establishing the first next-generation High Bandwidth Memory (HBM) production hub in the US. SK hynix announced that it held a groundbreaking ceremony for an advanced packaging[1] production facility for AI memory on the 27th (local time) at the Holloway Gymnasium, Pur...

31 Aug 2026 | Monday | NEWS

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