The Nuclear Company Appoints Marvell Director Brad Buss to Strengthen Board and AI Infrastructure Strategy

The Nuclear Company announced the appointment of Brad Buss to its Board of Directors as an independent director and Chair of the Audit Committee, further strengthening the company's Board with one of the technology industry's most accomplished public company directors and financial leaders. Buss joins The Nuclear Company, bringing nearly three decades of experience helping build, govern, finance,...

10 Jul 2026 | Friday | NEWS
Ecolab Completes $4.75 Billion Acquisition of CoolIT Systems to Expand AI Data Centre Cooling Solutions

ST. PAUL, Minn.--(BUSINESS WIRE)-- Ecolab announced the close of its acquisition of CoolIT Systems, a leader in direct liquid cooling for high‑density data centres. The transaction closed earlier than expected, and Ecolab welcomes the world-class CoolIT team to the company. Ecolab acquired CoolIT for approximately $4.75 billion. CoolIT’s year‑to‑date sales have grown more tha...

10 Jul 2026 | Friday | NEWS
SEALSQ and GlobalFoundries Partner to Develop Post-Quantum Cryptography and Quantum-Ready Semiconductor Technologies

SEALSQ and GlobalFoundries (GF) have entered into a strategic collaboration to accelerate the development of secure semiconductor technologies designed for the quantum computing era. Under a memorandum of understanding (MoU), the two companies will work together on post-quantum cryptography (PQC), secure semiconductor architectures and quantum computing technologies, addressing ...

10 Jul 2026 | Friday | NEWS
Arteris and IC-Link by imec Partner to Accelerate AI and High-Performance Computing Chip Development

Semiconductor system intellectual property (IP) provider Arteris has announced a collaboration with IC-Link by imec to accelerate the development of next-generation artificial intelligence (AI) and high-performance computing (HPC) chips. The partnership combines Arteris' Network-on-Chip (NoC) interconnect IP with IC-Link by imec's application-specific integrated circuit (ASIC) d...

10 Jul 2026 | Friday | NEWS
Infineon Opens €5 Billion Smart Power Fab in Dresden, Creating World's Largest Power Semiconductor Manufacturing Site

Infineon Technologies has officially opened its Smart Power Fab in Dresden, Germany, marking a major milestone in Europe's semiconductor manufacturing ambitions. The new facility is described as the world's largest manufacturing site for power semiconductors and analogue/mixed-signal technologies and represents the company's largest single investment to date. Built with an investment of approxima...

10 Jul 2026 | Friday | NEWS
Zuken Joins TSMC's EDA Alliance to Advance Chiplet and Advanced Packaging Design

Japanese electronic design automation (EDA) software company Zuken has joined TSMC's Open Innovation Platform (OIP) EDA Alliance, expanding its collaboration with the world's largest contract chipmaker to support the development of next-generation semiconductor devices. As a member of the alliance, Zuken will enhance its integrated circuit packaging and printed circuit board (PCB)...

10 Jul 2026 | Friday | NEWS
Synopsys Shifts Focus to AI Chip Design as It Phases Out Selected Semiconductor Manufacturing Software

Electronic design automation (EDA) company Synopsys is reportedly planning to discontinue parts of its semiconductor manufacturing process control software portfolio as it shifts engineering resources towards higher-growth artificial intelligence (AI) design solutions. According to sources familiar with the matter, the company has informed several leading semiconductor manufacture...

9 Jul 2026 | Thursday | NEWS
DeepSeek Develops Custom AI Inference Chip to Reduce Reliance on Nvidia and Strengthen Semiconductor Strategy

Chinese artificial intelligence company DeepSeek is reportedly developing its own artificial intelligence chip, marking a significant step towards reducing its dependence on external suppliers such as Nvidia and Huawei while strengthening its long-term semiconductor strategy. According to reports citing people familiar with the matter, the company has been working on the project...

9 Jul 2026 | Thursday | NEWS
Rigaku Opens Semiconductor Metrology Training Centre in Osaka to Strengthen Global Service Network

Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; “Rigaku”), has opened the Rigaku Solutions Centre Osaka (RSC-Osaka) at its Osaka Plant. The new facility centralises and expands practical training for field service engineers supporting semiconductor metrology s...

9 Jul 2026 | Thursday | NEWS
Apple Expands Broadcom Partnership with $30 Billion Investment to Manufacture Custom Silicon in the US

Apple® announced a new multiyear commitment with Broadcom to design and produce custom silicon components and cutting-edge wireless connectivity technologies for a wide range of Apple products. The new agreement, expected to exceed $30 billion, will lead to the production of more than 15 billion U.S.-made chips and support hundreds of American jobs. Apple has been working with the administrati...

9 Jul 2026 | Thursday | NEWS
TetraMem and SK hynix Demonstrate Memristor-Based AI Chip for Energy-Efficient In-Memory Computing

TetraMem Inc., a leader in Analog In-Memory Computing (A-IMC) technology, and SK hynix Inc., a global leader in AI memory and semiconductor technologies, announced the successful completion of a joint technology collaboration, highlighted by the publication of their research paper, “A Memristor-based In-Memory Computing SoC with Efficient Depthwise Convolution,” in Advanced I...

9 Jul 2026 | Thursday | NEWS
Samsung Begins Mass Production of PCIe 6.0 PM1763 Enterprise SSD for AI Servers and High-Performance Computing

Samsung Electronics Co., Ltd., a global leader in advanced memory technology,  announced mass production of PM1763, the company’s PCIe® 6.0-based enterprise solid-state drive (SSD) optimised for next-generation AI and HPC server environments. As the volume of data required for AI training and inference continues to grow rapidly, enterprise SSDs (eSSDs) that deliver data quickly and...

9 Jul 2026 | Thursday | NEWS
POLYN Technology and ALTER TECHNOLOGY France Establish Neuromorphic Chip Validation Lab for AI Semiconductor Development

POLYN Technology, a developer of application-specific neuromorphic analog signal-processing (NASP™) chips, announced a partnership with ALTER TECHNOLOGY France to establish a joint chip-validation lab at ALTER’s Toulouse facilities. The new joint lab will provide POLYN with access to specialised electrical validation capabilities and an internationally renowned test environm...

8 Jul 2026 | Wednesday | NEWS
SEMI Releases 2026 Worldwide Assembly and Test Facility Database Covering 820+ Semiconductor Manufacturing Sites

SEMI and TechSearch International announced the release of the 2026 edition of the Worldwide Assembly & Test Facility Database, a comprehensive resource tracking semiconductor back-end manufacturing facilities operated by integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSAT) companies worldwide. The 2026 edition covers more than 820 facilities, up f...

8 Jul 2026 | Wednesday | NEWS
Analog Devices Completes Empower Semiconductor Acquisition to Advance AI Data Centre Power Management Solutions

Analog Devices, Inc. (NASDAQ: ADI) has completed its acquisition of Empower Semiconductor, marking a strategic move to strengthen its position in advanced power management solutions for artificial intelligence (AI) infrastructure and high-performance computing. The acquisition enhances Analog Devices' role as a system-level power technology partner, extending its expertise from the electrical gri...

8 Jul 2026 | Wednesday | NEWS
Mouser Electronics Sponsors Control Automation Day 2026 to Advance AI, Robotics and Industrial Automation Innovation

Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, is proud to be a major sponsor of Control Automation Day 2026. The event is a one-day, free virtual conference and trade show for control engineers and system integrators hosted by Control.com. The theme for this year's virtual conference is Engineered for...

8 Jul 2026 | Wednesday | NEWS
AOS Launches 80V Half-Bridge MOSFET with AmpStack™ Packaging for AI Data Centres and High-Power Applications

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide-bandgap power devices, power management ICs, and modules, introduced its AOPL66801 80V MOSFET in a half-bridge configuration available in a state-of-the-art DFN6x5 AmpStack™ MOSFET package. This breakthrough packaging technolog...

8 Jul 2026 | Wednesday | NEWS
ACCM Launches Celeritas SMC Silicon-Matched Core for AI Chiplet Packaging and Advanced IC Substrates

Advanced Chip and Circuit Materials (ACCM) introduced Celeritas SMC (Silicon-Matched Core), a production-ready core for advanced IC substrates engineered to match the in-plane coefficient of thermal expansion of silicon while running on established organic-substrate manufacturing lines. Available now from ACCM's Wisconsin facility, the material is designed for large-body chiplet packages, embedded...

8 Jul 2026 | Wednesday | NEWS
India to Have Five Operational Semiconductor Manufacturing Plants by End of 2026, Says Ashwini Vaishnaw

India is expected to have five semiconductor manufacturing facilities in operation by the end of 2026, marking a significant step in the country's efforts to establish a strong domestic chip manufacturing ecosystem. Union Minister for Electronics and Information Technology Ashwini Vaishnaw said the government has approved 12 semiconductor projects under its national semiconductor programme. Of th...

7 Jul 2026 | Tuesday | NEWS
Disco Balances Semiconductor Equipment Demand as AI, Advanced Packaging and Power Chip Markets Drive Growth

Japanese semiconductor equipment manufacturer Disco is maintaining a balanced approach to growth as chipmakers adjust investment plans in response to changing market conditions across the global semiconductor industry. The company continues to see steady demand for its ultra-precision dicing, grinding and polishing equipment, which is widely used in wafer processing and advanced semiconductor man...

7 Jul 2026 | Tuesday | NEWS