• Tuesday | 22 September 2026
Intel Foundry and ASML Advance High-NA EUV Lithography for Mass Production

This week at the SPIE Photomask Technology + Extreme Ultraviolet Lithography conference, Intel Foundry and ASML highlighted continued progress in bringing High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography into production and advancing the technologies that will shape its future adoption. Specifically, Intel Foundry and ASML shared the following updates: High NA continues ...

9 Sep 2026 | Wednesday | NEWS
Hanmi Semiconductor Expands 2.5D Packaging Equipment Presence in Taiwan

South Korean semiconductor equipment maker Hanmi Semiconductor has secured an important foothold in Taiwan’s advanced packaging market after its 2.5D bonding equipment passed mass-production qualification at a Taiwanese foundry. The company has subsequently begun supplying its packaging bonders to the unnamed customer, marking a significant step in Hanmi’s efforts to expand beyond its ...

8 Sep 2026 | Tuesday | NEWS
Baya Systems Targets Japan’s AI and Chiplet Market with Advanced Data-Movement Technology

In this exclusive interview,  Semicon Leaders Asia speaks with Nandan Nayampally, Chief Commercial Officer at Baya Systems, about the company’s expansion into Japan and the growing opportunities across the country’s semiconductor ecosystem. Nayampally shares his insights into the rising demand for AI, HPC, automotive and chiplet-based architectures, the importance of efficien...

8 Sep 2026 | Tuesday | Interaction
Silicon Labs Opens Austin R&D Lab to Advance Wireless Semiconductor Innovation

Silicon Labs (NASDAQ: SLAB), the leader in low-power wireless connectivity, celebrated the opening of its new research and development (R&D) laboratory for advanced chip design and testing in Austin. The new R&D laboratory, made possible in part through a $23 million grant from the Texas Semiconductor Innovation Fund (TSIF) established by the Texas CHIPS Act, was officially ...

8 Sep 2026 | Tuesday | NEWS
Park Systems Opens Hillsboro Office to Support Pacific Northwest Semiconductor Industry

Park Systems, a leading global manufacturer of atomic force microscopy (AFM) and nanoscale metrology systems, today announced the opening of its newest regional office in Hillsboro, Oregon. The strategic addition enhances the company's ability to provide localised technical support, rapid-response customer engineering, and direct account management to key semiconductor and high-technology par...

8 Sep 2026 | Tuesday | NEWS
BYD’s Semiconductor Strategy Strengthens China’s Automotive Chip Self-Reliance

The global automotive industry is entering a new phase in which semiconductors are becoming as strategically important as batteries, motors and manufacturing scale. As vehicles evolve into software-defined, AI-enabled platforms, chips increasingly determine everything from power management and cockpit functions to advanced driver-assistance systems. At the same time, geopolitical tensions and tech...

8 Sep 2026 | Tuesday | NEWS
Hyosung Heavy Industries Expands US Power Infrastructure for AI Data Centres

The rapid expansion of artificial intelligence (AI) and data-centre infrastructure is creating a new set of challenges for electricity generation, transmission and distribution, particularly in the United States. Rising power consumption from AI workloads, combined with the need to modernise ageing grid infrastructure, is prompting significant investment in technologies capable of delivering more ...

8 Sep 2026 | Tuesday | NEWS
proteanTecs and MegaChips Partner to Enhance ASIC and LSI Silicon Visibility

ProteanTecs®, the leading provider of health and performance management solutions for advanced electronics, announced it is collaborating with MegaChips on the integration of ProteanTecs’ embedded monitoring technology into MegaChips’ next-generation ASIC and LSI digital systems. The joint work will focus on bringing deep silicon visibility across development, production and in-fi...

7 Sep 2026 | Monday | NEWS
Bruker BEST and Luvata Partner to Scale Superconductors for Fusion Energy

Bruker Energy & Supercon Technologies (BEST), a segment of Bruker Corporation (Nasdaq: BRKR), and Luvata Materials & Solutions, a Business Unit of Luvata Group (LUVATA), announced a strategic collaboration to support the rapidly growing demand for superconducting materials and technologies required by next-generation magnetic confinement fusion power demonstration plant projects ...

7 Sep 2026 | Monday | NEWS
Global Semiconductor Equipment Billings Hit Record US$40.53 Billion in Q2 2026

SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report that global semiconductor equipment billings increased 23% year-over-year to US$40.53 billion in the second quarter of 2026. Second-quarter 2026 billings registered an 11% quarter-over...

7 Sep 2026 | Monday | NEWS
Manz Asia and SUSS Partner to Advance Inkjet Solutions for Semiconductor Packaging

A leading manufacturer of advanced semiconductor packaging equipment, Manz Asia, announced a strategic collaboration with SUSS, a leading manufacturer of equipment and process solutions for the semiconductor industry, to jointly advance next-generation inkjet solutions for semiconductor manufacturing and advanced packaging applications. As semiconductor manufacturing moves toward higher integrati...

7 Sep 2026 | Monday | NEWS
EverProX Launches MSDL 20G Chipset for Low-Power Multi-Camera Vision Systems

EverProX Technologies Munich GmbH, under its Silicon Line® brand—a pioneer in ultra-low-power optical and electrical interconnect technology announced the launch of "MSDL™ 20G", which is the first product in the new MSDL™ family, an end-to-end interconnect chipset comprising the SL8582x serializer and SL8581x deserializer. Engineered to overcome the bandwidth, EMI, and reach ...

7 Sep 2026 | Monday | NEWS
Marelli and Microchip Advance Open-Standard ASA Motion Link for Software-Defined Vehicles

Marelli, a global automotive supplier, and Microchip Technology (NASDAQ: MCHP), a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced a new solution that enables graphics and video content generated by a vehicle's central computer to be streamed directly to automotive displays using ASA Motion Link (ASA-ML), an open stand...

7 Sep 2026 | Monday | NEWS
Sivers Semiconductors Invests $30M to Expand InP Laser Manufacturing in Scotland

Sivers Semiconductors AB (STO: SIVE) announced a USD 30 million strategic investment to significantly expand its Indium Phosphide (InP) manufacturing facility in Glasgow, Scotland, as the company prepares for anticipated customer production ramps driven by growing AI datacenter and optical networking demand. Upon completion, the expanded facility is expected to support annual production of m...

4 Sep 2026 | Friday | NEWS
MulticoreWare Acquires Simulus Automation to Expand Semiconductor Design and Verification

MulticoreWare, Inc., a global technology company delivering AI software solutions, accelerated computing technologies, and advanced engineering services, announced the acquisition of Simulus Automation Pvt. Ltd., a semiconductor design and verification specialist serving customers developing SoCs, chipsets, and accelerator technologies. The industry is shifting toward hardware-software co-design....

4 Sep 2026 | Friday | NEWS
SEMI and Silicon Catalyst Partner to Accelerate Global Semiconductor Startup Innovation

SEMI, the global industry association connecting the electronics design and manufacturing supply chain, and Silicon Catalyst, the world's only accelerator focused exclusively on semiconductor innovation, announced a global strategic partnership designed to accelerate innovation and strengthen connections between semiconductor hardware startups, investors, manufacturers, and technology leaders worl...

4 Sep 2026 | Friday | NEWS
Baya Systems and AdoreSys Partner to Expand Chiplet and Data-Movement Solutions Across APAC

Baya Systems, an innovator in software-driven fabric and system IP solutions, and AdoreSys, a leading semiconductor design solutions provider, announced a strategic partnership to offer Baya’s WeaveIP™ fabric and WeaverPro™ software platform together with AdoreSys’ ASIC design, integration and implementation expertise as a unified solution for semiconductor and systems comp...

4 Sep 2026 | Friday | NEWS
SEEQC and Taiwan Strengthen Quantum Computing Supply Chain Collaboration

SEEQC, Inc. (“SEEQC” or the “Company”), a chip-based quantum computing company, announced the signing of a Memorandum of Understanding (“MOU”) with Taiwan’s Quantum Industry Technology Promotion Office to expand cooperation and exchange across quantum technology and the emerging global quantum supply chain. The MOU was signed by SEEQC Chief Technology Off...

4 Sep 2026 | Friday | NEWS
Mouser and Qorvo Advance Agile RF Solutions for Drones and Satellite Communications

Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, announces a new eBook in collaboration with Qorvo, exploring next-generation RF wireless designs for drones, satellite communications and industrial IoT. High-Performance RF Solutions for Agile New Markets addresses time-to-market pressures, coexistence issues, power-efficienc...

4 Sep 2026 | Friday | NEWS
Semiconductor Packaging Services Market to Reach US$118.59 Billion by 2035

The global semiconductor packaging services market is expected to expand significantly over the coming decade as rising demand for artificial intelligence (AI), high-performance computing (HPC), high-bandwidth memory (HBM) and chiplet-based architectures increases the need for sophisticated packaging and testing capabilities. According to DataM Intelligence, the market was valued at US$44.50 billi...

3 Sep 2026 | Thursday | NEWS

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