• Thursday | 14 May 2026
POLYN Advances Automotive Sensing with VibroSense Chip

POLYN Technology, a leader in neuromorphic technology with application-specific Neuromorphic Analog Signal Processing (NASP) products, has taped out a VibroSense™ engineering chip featuring an analog neuromorphic core for tire friction monitoring. This is POLYN’s first chip, developed in cooperation with GlobalFoundries, using more advanced nodes for this and the next generation of pr...

30 Apr 2026 | Thursday | NEWS
SouthernCrossAI Expands Sovereign AI Access via Equinix Fabric

SouthernCrossAI (SCX), Australia's full-stack sovereign AI infrastructure company, announced it is now providing sovereign AI inferencing capacity to the Equinix Fabric AI ecosystem, making its ASIC-powered inference nodes discoverable and accessible to enterprises, government agencies, and developers across the Equinix ecosystem. Alongside this milestone, SCX confirmed that its national infrastr...

30 Apr 2026 | Thursday | NEWS
Trio-Tech Raises $10M to Support Growth in AI and Automotive

Trio-Tech International (“Trio-Tech” or the “Company”) (NYSE MKT: TRT), a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced the closing of its previously announced registered direct offering with fundamental institutional investors. The offering consisted of 1,052,632 shares of the Company’...

30 Apr 2026 | Thursday | NEWS
Majestic Labs Launches AI Server to Solve Memory Bottleneck

Majestic Labs unveiled Prometheus, the first AI server designed from the ground up to tackle the memory wall: the most critical obstacle to the advancement and deployment of AI models. Leveraging an innovative architecture and a complete software stack, the server connects orders of magnitude more memory to each processor, at unprecedented bandwidth, achieving performance equivalent to multiple ra...

30 Apr 2026 | Thursday | NEWS
Kopin and Fabric.AI Partner to Build Optical Links for AI Data Centres

Kopin Corporation (NASDAQ: KOPN), a leading provider of application-specific optical systems and high-performance microdisplays, including MicroLED displays, announced a strategic collaboration with Fabric.AI (NASDAQ: SBLX), a leading developer of fabless semiconductor solutions for AI infrastructure, to develop MicroLED-based optical interconnect technology that will be designed to replace tradit...

30 Apr 2026 | Thursday | NEWS
MIPI Alliance Launches Group to Explore AI-Driven Humanoid Robotics

The MIPI Alliance, an international organisation that develops specifications that standardise wired interfaces for mobile and other connected ecosystems, announced the formation of a Physical AI Birds of a Feather (BoF) group dedicated to exploring upcoming technologies and trends in the physical AI market, with an initial focus on humanoids. The group will examine how MIPI specifi...

30 Apr 2026 | Thursday | NEWS
Liquid Instruments Raises $50M to Scale AI-Driven Test Solutions

Liquid Instruments, a pioneer in software-defined test solutions, announced the close of its $50 million Series C funding round, co-led by Keysight Technologies, Inc. (NYSE: KEYS), a global leader in design, emulation, and test solutions, and the Australian Government’s National Reconstruction Fund Corporation (NRFC). In addition to investing, Keysight will enter into a commer...

30 Apr 2026 | Thursday | NEWS
Cadence and NVIDIA Deepen AI Engineering Partnership

Expanded collaboration combines agentic AI, physics-based simulation, and digital twins to accelerate engineering and unlock new levels of productivity across semiconductors, physical AI systems and AI factories At CadenceLIVE Silicon Valley 2026, Cadence (Nasdaq: CDNS) announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based ...

29 Apr 2026 | Wednesday | NEWS
OpenLight Secures Fresh Capital as Demand Rises for Silicon Photonics Solutions

OpenLight, the world leader in custom Photonic Application-Specific Integrated Circuit (PASIC) design leveraging its patented heterogeneous silicon photonics process, announced it has raised an additional $50 million in a Series A-1 round, bringing the company’s total funding to $84 million. The financing reflects growing commercial momentum and accelerating customer adoption across AI infra...

29 Apr 2026 | Wednesday | NEWS
ROHM Co., Ltd. Launches NFC Wireless Power Chipset for Smart Rings and Compact Wearables

ROHM Co., Ltd. has developed a wireless power supply IC chipset consisting of the receiver (ML7670) and transmitter (ML7671) compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands. The smart ring market has seen rapid growth in recent years. However, for extremely small ring-shaped devices worn on the finger, wired charging is impr...

29 Apr 2026 | Wednesday | NEWS
Artemis Acquires Optikos Corporation to Accelerate Growth in Advanced Optical Engineering

Optikos® Corporation, a provider of engineering, manufacturing, and metrology expertise in optical systems, is joining forces with Artemis, a Boston-based private equity firm focused on scaling high-impact industrial tech. Through this acquisition, Artemis will provide the strategic support necessary to supercharge the engineering and manufacturing capabilities of Optikos. Through th...

29 Apr 2026 | Wednesday | NEWS
FPT Corporation and Intel Corporation Partner to Accelerate AI-Driven Factory Optimisation

FPT and Intel, a global leader in semiconductor and AI technologies, announced a strategic relationship to deliver an end-to-end AI-driven factory optimisation solution. Powered by AI, simulation, and digital manufacturing technologies, the collaboration aims to reduce bottlenecks, accelerate decision-making and improve downtime recovery, facilitating the sector’s transition towards AI-drive...

29 Apr 2026 | Wednesday | NEWS
Kyocera Corporation Launches Ceramic Core Substrate for Next-Generation AI Semiconductor Packaging

Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) announced that it is commercialising a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs(1) and switch ASICs, which are rapidly scaling in complexity as AI data centre architectures evolve. The new product will be unveiled at ECTC 2026, an international conference ...

29 Apr 2026 | Wednesday | NEWS
OKI Circuit Technology Develops 180-Layer PCB Technology for Next-Generation AI and HBM Testing

OKI Circuit Technology (OTC; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) (Note 1) mounted on AI semiconductors. This represents an approximat...

29 Apr 2026 | Wednesday | NEWS
Kingston Digital, Inc. Expands DC3000ME Gen5 SSD Line with New 30.72TB Enterprise Model

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced the launch of the Kingston DC3000ME Gen5 U.2 NVMe SSD with a new high-capacity 30.72TB1 option, expanding the DC3000ME family to address the growing storage density and performance demands of modern data centres. The DC3...

28 Apr 2026 | Tuesday | NEWS
Seoul Viosys Accelerates Expansion into Next-Generation Photonics and Optical Interconnects

Seoul Viosys (KOSDAQ: 092190), a company specialising in opto-semiconductor devices, is accelerating its entry into the next-generation photonics market supported by its proprietary “No-wire” and “No-package” fundamental patents—essential technologies for micrometre (μm)-scale miniaturisation of opto-semiconductors—as well as its competitiveness in VCSEL...

28 Apr 2026 | Tuesday | NEWS
Palliser Capital Urges SMC Corporation to Unlock Shareholder Value Through ¥600 Billion Buyback

Palliser Capital (“Palliser”), a top 25 shareholder of SMC Corporation (“SMC” or the “Company”),  published a comprehensive plan (“Value Enhancement Plan”) outlining the opportunities available to unlock substantial long-term value at the Company. To promote market transparency and respond to growing interest from shareholders and other stakeho...

28 Apr 2026 | Tuesday | NEWS
Trio-Tech International Announces $10 Million Registered Direct Offering

Trio-Tech International (“Trio-Tech” or the “Company”) (NYSE MKT: TRT), a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced that it has entered into securities purchase agreements with fundamental institutional investors for the purchase and sale of 1,052,632 shares of its common stock in a regist...

28 Apr 2026 | Tuesday | NEWS
Omdia Raises 2026 Semiconductor Revenue Forecast on Surging Memory Demand

Omdia has significantly raised its semiconductor revenue forecast for 2026 to 62.7%, again reflecting unprecedented growth in DRAM and NAND driven by sustained demand and ongoing supply shortages expected to persist through the year. The DRAM market is forecast to nearly double in value, while the smaller NAND segment could quadruple compared to 2025. Supply constraints in conventional memory IC ...

28 Apr 2026 | Tuesday | NEWS
Marvell Technology, Inc. Acquires Polariton to Advance Next-Generation Optical Connectivity

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, announced the acquisition of Polariton Technologies, a developer of high-speed, low-power plasmonics-based silicon photonics devices. The acquisition strengthens Marvell’s optical technology portfolio by adding advanced modulation capabilities that enable continued scaling in bandwidth, power ef...

28 Apr 2026 | Tuesday | NEWS

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